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IMAPS 2010 Program Outline
Sunday, October 31
8:00 am-5:00 pm
5:00 pm-6:00 pm
Professional Development Courses (see page 26 for details)
Professional Development Course Reception (Course Registrants and Instructors Only) Sponsored by Hesse & Knipps
Monday, November 1
Professional Development Courses (see page 26 for details)
Welcome Reception - Raleigh Convention Center - Ballroom C (ALL ARE INVITED)
8:00 am-5:00 pm
5:00 pm-7:30 pm
Tuesday, November 2
8:00 am-10:45 am
(unless otherwise noted)
3D Packaging and
Integration
Track
Modeling and
Reliability
Track
Next Generation
Materials
Track
Assembly and
Packaging
Track
Advanced
Technologies
Track
3D Interconnect
Technologies in RTP
Page 28
Device Design and
Modeling
Page 28
Advanced Materials
Page 28
Package Reliability
Testing
Page 29
LED Packaging
Page 29
Interactive Track
11:00 am-5:30 pm
11:25 am-11:40 am
11:40 am-12:00 pm
12:00 pm-12:45 pm
Exhibits Hall Open
Annual Business Meeting - Exhibit Hall Theater
Awards Ceremony - Exhibit Hall Theater
Keynote Presentation: Dr. John Edmond, Co-Founder, CREE Research, Inc. - Exhibit Hall Theater
12:50 pm-1:50 pm
Lunch Kiosks (Food available for purchase)
1:55 pm-5:15 pm
(unless otherwise noted)
3D TSV Processes
and Modeling
Page 30
Design for Reliability
Page 30
Pb-Free Solder
Ceramic and LTCC Materials and RoHS,
Packaging
Processes and
Reliability
Page 30
Page 31
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Wafer Level/CSP
Packaging
Requirements
Page 31
Wednesday, November 3
8:00 am-11:15 am
(unless otherwise noted)
3D Systems
Integration
Page 32
Modeling and
Design for
Signal/Power
Integrity
Page 32
Thermal
Management
Page 32
Wire Bonding and
Stud Bumping I
Page 33
Emerging
Technologies
Page 33
Exhibits Hall Open
9:00 am-5:30 pm
11:45 am-12:30 pm
Keynote Presentation: Dr. Rao Tummala, Professor and Director, Georgia Institute of Technology - Exhibit Hall Theater
12:30 pm-1:30 pm
Lunch in the Exhibits Hall (Provided by RFMD)
1:35 pm-5:25 pm
(unless otherwise noted)
5:30 pm-6:30 pm
6:30 pm-7:30 pm
3D Packaging
Page 34
System-Level
Signal/Power
Integrity Design
Page 34
High Performance
Interconnects and
Boards
Page 34
Wire Bonding and
Stud Bumping II
Page 35
MEMS Packaging
Page 35
Global Business Council (GBC) Marketing Forum (INCLUDED WITH YOUR FULL SYMPOSIUM REGISTRATION)
GBC Networking Reception (Sponsored by DOW Electronic Materials)
Thursday, November 4
8:00 am-12:00 pm
(unless otherwise noted)
9:00 am-12:00 pm
9:00 am-12:00 pm
Interactive Forum
(Poster Session)
Page 38
State of 3D
Technology Consortia View
Page 36
Flip Chip and Wafer Laminate Substrate
Bumping: Processes
Materials and
and Reliability
Technology
Page 36
Page 36
Microwave and RF Printed and Structural
Electronics
Applications
Page 37
Page 37
Exhibits Hall Open
IMAPS 2011 Booth Selection in the Exhibit Hall
The 43rd International Symposium on Microelectronics
imaps 2010
October 31 - November 4, 2010
Raleigh Convention Center
Raleigh , North Carolina - USA
Organized by the:
IMAPS 2010 Symposium Committee
and the Society Technical Committee
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Sponsored by:
The International Microelectronics And Packaging Society (IMAPS)
Bringing Together the Entire Microelectronics Supply Chain!™
The International Symposium on Microelectronics is wholly-owned, produced,
and managed by:
International Microelectronics And Packaging Society (IMAPS)
611 2nd Street, NE, Washington, DC 20002
Phone: 202-548-4001; Fax: 202-548-6115
E-mail: IMAPS@imaps.org
Internet: http://www.imaps.org
Final Program Sponsors
www.natelengr.com
www.hesse-knipps.us
www.thickfilm.net
www.metalor.com
Cover images courtesy of: Hesse & Knipps, Heraeus, and the Raleigh Convention & Visitor Bureau.
Photo credit: CREE shimmer wall at night - Brian Gassel; Raleigh cityscape - Roger Winstead.
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Welcome to IMAPS 2010
Technical Program Outline ................................................................................ 1
Greetings from the IMAPS President ................................................................ 4
Greetings from the General Chair ..................................................................... 6
Greetings from the Technical Chair and Co-Chairs .......................................... 7
Symposium Program Committee ...................................................................... 8
Welcome from the Governor of North Carolina .............................................. 10
Welcome from the Mayor of Raleigh .............................................................. 11
Hours & General Information .......................................................................... 12
IMAPS Committee Meetings / Special Events ................................................ 13
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Opening Ceremonies
Welcome Reception ........................................................................................ 14
Annual Business Meeting ................................................................................ 14
Awards Ceremony/List of Recipients ......................................................... 16-17
Keynote Presenters .................................................................................... 18-19
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Sponsorships
IMAPS 2010 Premier / Presidential Sponsors ........................................... 20-23
IMAPS 2010 Event / Media Sponsors ........................................................ 24-25
Internet Café .................................................................................................... 25
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Technical Program Information
Professional Development Courses (PDCs) .................................................. 26
Technical Program ...................................................................................... 28-38
High School Student / Exhibitor Interchange .................................................. 37
Symposium at a Glance ........................................................ Inside Back Cover
Other Programs and Activities
Global Business Council Fall Marketing Forum ............................................. 39
Student Program ............................................................................................. 40
Things to do in Raleigh ................................................................................... 41
JOBS MarketPlace .......................................................................................... 41
Wireless Access in the Exhibit Hall ................................................................. 41
Golf Classic ..................................................................................................... 42
Casino Night .................................................................................................... 43
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Exhibition
Exhibit Floor Plan ............................................................................................ 44
Exhibitors .................................................................................................... 45-53
Exhibitor Products & Services Index .......................................................... 54-56
IMAPS 2011 Booth Selection .......................................................................... 55
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Upcoming IMAPS Events
Conference/Workshop Announcements ......................................................... 57
Device Packaging Conference Announcement .............................................. 58
CICMT 2011 Conference Announcement .................................................. 59-60
HiTEN 2011 Conference Announcement ........................................................ 61
European Microelectronics and Packaging (EMPC2011) .............................. 62
IMAPS 2011 Symposium Call for Papers ....................................................... 63
Downtown Raleigh Map .................................................................................. 64
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Symposium management is not responsible for
loss or theft of personal belongings. Security for
personal belongings is the responsibility of the
individual.
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Loss Due to Theft
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Photographs will be taken at the IMAPS 2010
Symposium. By registering for this meeting, you
agree to allow IMAPS to use your photo in any
IMAPS-related publications or website.
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Photo Release
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Tuesday, Nov. 2
11:00 AM – 5:30 PM
Wednesday, Nov. 3
9:00 AM – 5:30 PM
Thursday, Nov. 4
9:00 AM – 12:00 PM
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Exhibit Hours
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Sunday, October 31
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Wednesday, November 3
7:00 AM – 5:00 PM
Thursday, Nov. 4
7:00 AM – 12:00 PM
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IMAPS 2010
Registration Hours
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TABLE OF CONTENTS
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November 2nd thru 4th
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Conference & Exhibition
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October 31st & November 1st
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Professional Development
Courses (PDCs)
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Sunday to Thursday
Raleigh Convention Center
500 South Salisbury Street
Raleigh, North Carolina 27601 - USA
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October 31 - November 4, 2010
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imaps 2010
Advertisers Index
Mini Systems ......................................................................... Inside Front Cover
Reldan Metals, Co. ............................................................................................ 5
iKnow Micro ....................................................................................................... 9
Geib Refining ................................................................................................... 15
IMAPS Microelectronics Journal. .................................................................... 27
LORD Corporation ........................................................................................... 38
Natel .................................................................................................. Back Cover
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greetings
FROM THE IMAPS PRESIDENT
Welcome to the 43rd International Symposium on Microelectronics being held at
the Raleigh Convention Center, Research Triangle, North Carolina, USA.
General Chair, David Seeger (IBM Corporation), and an International Technical
Committee led by Technical Chair, Sara Paisner (LORD Corporation), and Technical Co-Chairs Georg Meyer-Berg (Infineon Technologies), Jin Yu (KAIST) and
Urmi Ray (Qualcomm), have put together an innovative program. Whether you’re
looking to network with your peers, explore new products and technologies, engage customers, meet suppliers, demonstrate innovation leadership, or just be
part of the industry scene, there’s something for everyone at IMAPS 2010.
Please take time to walk through the exhibit area where you will find state of the art
technology from over one hundred exhibitors who can update you on their latest
products and services representing the semiconductor packaging and microelectronics supply chain. Thanks to all our exhibitors, many of whom are IMAPS Corporate members, for their support. Special thanks to this year’s Symposium Premier Sponsors that include NATEL,
Hesse & Knipps Semiconductor Equipment, and HERAEUS, along with Metalor Technologies USA as our Presidential Sponsor.
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Don’t miss our keynote presentations:
•
Tuesday, November 2nd - Dr. John Edmond, Co-founder of CREE Research, Inc. on “High Efficiency Blue & White
LED’s for the New Lightbulb”.
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Wednesday, November 3rd - Dr. Rao Tummala, Professor & Director of 3D Systems Packaging at the Research
Center of Georgia Institute of Technology, “Grand Challenges & Potential Solutions in the Changing World of NanoElectronics from ICs to 3D ICS to 3D System”.
The Fall Marketing Forum on Wednesday evening features Mr. Leo Linehan, Global Business Director of Advanced Packaging Technologies for Dow Electronic Materials, with “An Electronic Material Supplier’s Perspective on Challenges and
Opportunities in 3D Packaging.” Also Mr. David Miller, President of DuPont Electronics and Communications, will be discussing “The Critical Role of Materials in the Photovoltaic Industry.” A networking reception follows.
I would like to personally thank the Symposium committee and dedicated IMAPS staff for all the hard work in coordinating
this Conference event and a big thank you to all attendees, exhibitors, and speakers for your participation and support of
IMAPS.
Enjoy the conference and your stay in Raleigh.
Best Regards,
Howard Imhof
Metalor Technologies USA
Howard.Imhof@metalor.com
5
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greetings
FROM THE GENERAL CHAIR
Welcome IMAPS members and other interested parties from the technical community!
Thank you for joining us at the 43rd Annual International Symposium on Microelectronics, October 31
– November 4, 2010. This year’s program is in a new venue - the Research Triangle Park (RTP) area
in North Carolina, featuring Raleigh’s brand new convention center. RTP offers an abundance of high
technology companies, renowned research institutes, consortia and universities which have been
famous for the development of the area. One might ask why we would move to a new venue since
established venues have infrastructure and history on their side. While it is true that opening this
symposium at a new site introduces new challenges for conference organizers, it also offers new
opportunities. Most importantly, it allows the opportunity to expand the scope of those interested in the
IMAPS society. Indeed, as I talk with local folks in the RTP area, many were unaware of the society and are now becoming
actively engaged. In addition, it offers current IMAPS members the ability to expand the scope of their contacts in this region
of the country; not to mention world famous golfing in the area for golf enthusiasts!
You can see from the enclosed program that we have a strong technical program in addition to the vendor’s exhibition hall.
We’ve enhanced the program with some exciting new additions including a conference-long technical track on 3D packaging, one of the fastest growing areas in microelectronics today.
6
The highlights for this year’s event include:
• A tremendous technical program with 26 sessions, including excellent coverage of Signal/Power Integrity, Thermal
Management, and Wire Bonding, in addition to the aforementioned conference-long technical track dedicated to 3D
packaging issues.
• Two keynote presentations, one by Dr. John Edmond, Co-Founder, from CREE Research, Inc.; the other by Dr. Rao
Tummala, Professor and Director, from Georgia Institute of Technology.
• A line-up of several Professional Development Courses providing the chance to brush up on your knowledge or
move up the learning curve in a new area.
• The IMAPS Global Business Council Forum, featuring two talks on “Materials for Photovoltaics and 3D Packaging”
by leading industry analysts.
• Extensive student participation, with cash awards for the two best student papers.
• Over 130 exhibitors providing updates on their products and services.
• A program for college students that includes a visit to DuPont Microcircuit Material Headquarters.
• A program with local high schools, giving students a chance to see what the microelectronics industry is all about.
• A great golf tournament at the Lonnie Poole Golf Course, to help us on the “all work and no play” front.
It’s been a great pleasure serving as general chair of this event. I’m particularly honored to be surrounded by an organizing
committee and IMAPS staff that has worked extra hard to line up such a strong program in this new venue. The other
challenge has been very different than last year. Last year, the industry was lagging and budgets were tight thus hindering
participation. This year, the industry has been on such a ‘tear’ with huge upswings in business that folks are now too busy to
participate…a great problem to have!! Please take a look at the full committee list on page 8, so you know who to thank!
An event like IMAPS 2010 would not be possible without the support of our sponsors, so I’d like to thank them and highlight
NATEL, Hesse & Knipps Semiconductor Equipment and Heraeus as our Premier Sponsors; along with Metalor as
our Presidential Sponsor.
Thank you for taking a little time from your very busy schedule to come to this new venue and see the riches of technology
available in the RPT area. And as mentioned, for golfers the Carolina’s offer some of the best golfing venues in the country.
Thanks for coming!
David Seeger
IBM Corporation
seeger@us.ibm.com
greetings
FROM THE TECHNICAL CHAIR and CO-CHAIRS
O
n behalf of the IMAPS 2010 Technical Committee, it is our pleasure and privilege to officially welcome you to the 43
Annual IMAPS International Symposium on Microelectronics, October 31 to November 4 , in the Research Triangle in
rd
st
th
Raleigh, North Carolina.
As Technical Chairs we are excited by the scope and quality of this year’s program. We have brought together a Technical
Program with 26 sessions that includes an Interactive Poster session, with 150 papers and posters addressing all aspects
of microelectronics packaging. We also have several Professional Development Courses for you to choose from, 2 Keynote Presentations, a powerful Global Business Council meeting, and significant student participation activities.
IMAPS 2010 in North Carolina’s Research Triangle promises to be an excellent technical program including several special
focused sessions that address innovative technology and new development in the application areas of 3D Packaging,
Modeling and Design for System/Power Integrity, LEDs, Wafer Level CSP, Pb-free Packaging and others. Here are a few
highlights, offering opportunities to:
o
Dive deep into technology and development. The overall program is organized into five tracks that address 3D
Packaging, Modeling and Reliability, Next Generation Materials, Assembly and Packaging, and Advanced Technologies. Specific topics within these tracks include the latest technical innovations in LEDs and MEMS, Emerging
Technologies, 3D Packaging, as well as Microwave and RF Applications.
o
Explore business trends. The highly successful Global Business Council program, which has been a big hit for
the last two years, will be held on Wednesday, November 3rd, and is comprised of two powerful presentations
addressing the business trends and key market drivers in our society.
o
Network with colleagues from all over the world. One of the great aspects of attending a technical program of
this nature is the chance to meet and converse with peers from all over the world. IMAPS, a truly international
society, will have speakers from 15 countries, and attendees from Europe, the Pacific Rim, and the Americas,
providing incredible opportunities for networking and idea sharing.
o
Listen to two eminent industry leaders provide keynote presentations: Dr, John Edmond, co-founder of
CREE Research, Inc. and Dr. Rao Tummala, Professor and Director at the Georgia Institute of Technology.
o
Connect to the microelectronics supply chain. Over 130 exhibitors have registered, ensuring that our Exhibits
Hall will feature a diverse range of companies showcasing their latest products and technologies.
As the Technical Chair and Co-Chairs, we are excited about the impact this powerful technical program will have on our
society members and their respective businesses, and we gratefully acknowledge our IMAPS Technical Committees and
IMAPS staff for an outstanding job reviewing abstracts, organizing sessions, and providing invaluable help preparing this
Symposium. We hope you share our anticipation for this year’s event and to a fantastic 5 days of insights, inspiration and
idea sharing.
Again, please accept our enthusiastic welcome for attending the 2010 IMAPS International Symposium!
Sara Paisner
Georg Meyer-Berg
Jin Yu
Urmi Ray
LORD Corporation
sara_paisner@lord.com
Infineon Technologies AG
georg.meyer-berg@infineon.com
KAIST
jinyu@kaist.ac.kr
Qualcomm Inc.
uray@qualcomm.com
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imaps 2010
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IMAPS Executive Director
Michael O’Donoghue, IMAPS
modonoghue@imaps.org
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Local Technical Outreach Co-Chair
Scott Morris, RF Micro Devices
smorris@rfmd.com
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IMAPS 2011 General Chair
Mark Hoffmeyer, IBM Corporation
hoffmeyr@us.ibm.com
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Local Technical Outreach Chair
Glenn Oliver, DuPont
glenn.f.oliver@usa.dupont.com
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Foundation Golf Co-Chair
Scott Gordon, DuPont
scott.e.gordon@usa.dupont.com
IMAPS Treasurer
David Virissimo, SPM
dvirissimo@sempck.com
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Foundation Golf Chair
Sam Horowitz, Retired / DuPont
samuel.j.horowitz@usa.dupont.com
IMAPS Past President
Delip (Doug) Bokil, Namark Process
Design LLC
dbokil@bokil.com
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Foundation Chair
Steve Adamson, Asymtek
steven.adamson@nordsonasymtek.com
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Marketing Co-Chair
Hugh Roberts, Atotech
hugh.roberts@atotech.com
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VP of Technology
Lee Levine, Process Solutions Consulting
levilr@ptd.net
GBC Chair
Arne Knudsen, Kyocera America
arne.knudsen@kyocera.com
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Professional Development Course
Chair
Thomas Green, TJ Green Associates LLC
tgreen1@ptd.net
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Technical Co-Chair - USA
Urmi Ray, Qualcomm Inc.
uray@qualcomm.com
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Technical Co-Chair - Asia
Jin Yu, KAIST
jinyu@kaist.ac.kr
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Technical Co-Chair - Europe
Georg Meyer-Berg, Infineon Technologies
AG
Georg.Meyer-Berg@Infineon.com
IMAPS President-Elect
Rajen Chanchani, Sandia National
Laboratories
chanchr@sandia.gov
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Student Activities Co-Chair
Joan Delalic, Temple University
joan@temple.edu
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Technical Chair
Sara Paisner, LORD Corporation
sara_paisner@lord.com
IMAPS President
Howard Imhof, Metalor Technologies
USA
howard.imhof@metalor.com
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Student Activities Chair
Robert Evans, Cisco Systems / NCSU
rjevans@cisco.com
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General Chair
David Seeger, IBM Corporation
seeger@us.ibm.com
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2010 National Symposium Committee
○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
Welcome Reception
Monday, November 1st
5:00 PM - 7:30 PM
Raleigh Convention Center - Ballroom C
500 South Salisbury Street
Raleigh, NC 27601
sponsored by:
www.natelengr.com
www.hesse-knipps.us
www.thickfilm.net
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Welcome from the Governor
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Welcome from the Mayor
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hours and general information
Registration
Sun. & Mon.
Tues. thru Wed.
Thursday
7 am – 5 pm
7 am – 5 pm
7 am – Noon
RCC: Mezzanine
RCC: Mezzanine
RCC: Mezzanine
11 am – 5:30 pm
9 am – 5:30 pm
9 am – Noon
RCC: Exhibit Hall B&C
RCC: Exhibit Hall B&C
RCC: Exhibit Hall B&C
Exhibit Hours
Tuesday
Wednesday
Thursday
7 am – 5 pm
7 am – Noon
RCC: Room 307
RCC: Room 307
Opening Ceremonies
Refreshment Break: 11:00 am (IMAPS Cafés)
IMAPS
Annual Business Meeting
11:25 am
Speaker Breakfast
Tue. - Thurs.
Raleigh Convention Center
Location: Exhibit Hall Theater
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Speaker Ready Room
Tue. & Wed.
Thursday
Tuesday, November 2nd
7 am – 7:50 am
RCC: Exhibit Hall B&C
Proceedings Pick-up
Pick-up your Symposium CD-ROM Proceedings at the Registration
Desk.
& Lunch Break
12 Refreshments
Tuesday morning refreshment break will be in the Level 3 Foyer.
Tuesday afternoon through Thursday all refreshment breaks will be
located in the Exhibit Hall (IMAPS Cafés). A box lunch will be served
on Wednesday, November 3rd in the Exhibit Hall (IMAPS Cafés).
Change of Officers
Presidents’ Messages to the Membership
Annual Business Meeting
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IMAPS Awards Ceremony
11:40 am
Presenting the:
William D. Ashman Achievement Award
Foundation Golf Classic (See page 42 for more information) John A. Wagnon Jr., Technical Achievement Award
Monday, November 1st
IMAPS Fellow of the Society
Lonnie Poole Golf Course
Corporate Recognition Award
Shuttle departs the Marriott Hotel at 6:30 am, and departs the
Sidney J. Stein International Award
Golf Course at 1:30 pm. Breakfast on you own.
Outstanding Educator Award
Golf Holes sponsored by:
Daniel C. Hughes Jr. Memorial Award
President’s Award
www.technic.com
Golf Hole and Luncheon sponsored by:
Best and Outstanding Papers
of the IMAPS 2009 Symposium
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Keynote Presentation
12:00 pm
Speaker: Dr. John Edmond
www.lord.com
Symposium Location:
Raleigh Convention Center
500 South Salisbury Street
Raleigh, NC 27601
All IMAPS 2010 events will be held at the convention center.
Dr. John Edmond graduated summa cum laude from Alfred
University in 1983 with a Bachelor of Science degree in ceramic engineering. He earned his Ph.D. in Materials Science
at NC State University in 1987 and upon graduation co-founded
CREE Research, Inc. Since its founding, Dr. Edmond has
worked on the development and production of blue and green
LEDs, first in SiC, then the Group III Nitrides on SiC. In July
2007, Dr. Edmond earned a place on Business 2.0s ‘50 Who
Matter Now’ list.
committee meetings
and
special events
Sunday, October 31
PDC Reception (Instructors & Students Only)
5:00 pm - 6:00 pm
RCC: Room 201
6:30 am - 1:30 pm
Lonnie Poole Golf Course
Monday, November 1
Microelectronics Golf Tournament
Shuttle for the Golf Tournament will depart the Marriott at 6:30 am, and departs the Golf Course at 1:30 pm. Breakfast on your own.
Welcome Reception
5:00 pm - 7:30 pm
RCC: Ballroom C
Tuesday, November 2
Annual Business Meeting/Awards Ceremony
Keynote Presentation (Dr. John Edmond)
Press Luncheon (Invitation Only)
Student Booth Judging
Student Chapter Meeting/Panel Discussion/Reception
President’s Party (Invitation Only)
Microelectronics Foundation Casino Night
11:25 am - 12:00 pm
12:00 pm - 12:45 pm
12:50 pm - 2:00 pm
1:30 pm - 3:00 pm
3:30 pm - 5:30 pm
6:30 pm - 7:30 pm
7:30 pm - 10:30 pm
RCC: Exhibit Hall Theater
RCC: Exhibit Hall Theater
RCC: Room 303
RCC: Exhibit Hall
RCC: Room 201
Room: 402
Room: 402
(Tickets available for purchase at the Registration Desk)
Wednesday, November 3
Student Plant Tour (must meet at 8:15 am)
Publications Committee/Journal Advisory Board
Finance Committee
Keynote Presentation (Dr. Rao Tummala)
Lunch in the Exhibit Hall
GBC Marketing Forum
GBC Happy Hour
International Reception (Invitation Only)
8:30 am - 11:45 am
9:00 am - 10:00 am
10:00 am - 11:00 am
11:45 am - 12:30 pm
12:30 pm - 1:30 pm
5:30 pm - 6:30 pm
6:30 pm - 7:30 pm
7:00 pm - 9:00 pm
RCC: Main Entrance
RCC: Room 201
RCC: Room 201
RCC: Exhibit Hall Theater
RCC: IMAPS Cafés
RCC: Exhibit Hall Theater
RCC: IMAPS Café
RCC: Room 402
7:00 am - 8:00 am
9:30 am - 11:30 am
9:00 am - 12:00 pm
10:30 am - 11:30 am
12:00 pm - 2:00 pm
12:00 pm - 1:30 pm
2:00 pm - 4:30 pm
RCC: Exhibit Hall
RCC: Exhibit Hall B&C
RCC: Exhibit Hall B&C
RCC: Room 201
RCC: Room 301A
Bu Ku: 110 E. Davie Street
RCC: Room 201
Thursday, November 4
GBC Steering Committee Meeting
Student Exhibitor Interchange
IMAPS 2011 Booth Selection
2010/2011 Symposium Committee Meeting
Society Technical Committee Meeting
Advisory Council Luncheon (Invitation Only)
Chapter Leadership Meeting
President’s Reception
sponsored by:
www.metalor.com
International Reception
sponsored by:
www.thickfilm.net
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Welcome Reception
Monday, November 1, 2010
5:00 PM - 7:30 PM
Raleigh Convention Center
500 South Salisbury Street
Ballroom C
Opening Ceremonies - Exhibit Hall Theater
Tuesday, November 2, 2010
Refreshment Break in the Exhibit Hall
11:00 AM
IMAPS Annual Business Meeting
11:25 AM
IMAPS Awards Ceremony
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11:40 AM
Daniel C. Hughes Jr. Memorial Award
William D. Ashman Achievement Award
John A. Wagnon Jr. Technical Achievement Award
Corporate Recognition Award
Outstanding Educator Award
President’s Award
IMAPS Fellow of the Society
Sidney J. Stein International Award
Best & Outstanding Papers - IMAPS 2009
Come say “Thanks” to those who contributed so much to IMAPS over many years.
Keynote Presentation
12:00 PM
Dr. John Edmond, Co-Founder
CREE Research, Inc.
Welcome Reception & Opening Ceremonies sponsored by:
www.natelengr.com
www.hesse-knipps.us
www.thickfilm.net
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awards
2010 IMAPS AWARDS CEREMONY
Tuesday, November 2nd
11:40 am - 12:00 pm
Raleigh Convention Center
Location: Exhibit Hall Theater
IMAPS Members are unique individuals as packaging professionals. They are unique in the breadth of their knowledge. Unique in his or
her dedication to a little appreciated profession that affects each and every person every day. They are unique in their dedication to the
goals of IMAPS. Within this already unique population there are some individuals whose contribution is so great that their peers nominate
them for recognition. These members of the electronics packaging community contribute greatly to the health and vitality of the industry.
Accordingly, I would like to personally invite you to attend this year’s IMAPS Awards Ceremony to acknowledge some of them.
Each year, the current First Past President has one of the most pleasurable of leadership responsibilities - to recognize these notable
individual members for their accomplishments and to recognize a company that has made significant technical and supporting contributions to the microelectronics industry and to IMAPS in particular.
The process of identifying deserving nominees, and submitting and reviewing the nominations is exacting. Most individual awards are
reviewed by past recipients, making these awards the recognition of notables by notables. We thank all members for nominating the most
notable for consideration of an award. We can only honor those who are nominated and we don’t know everyone personally so please
nominate a unique person you know for an award in 2011.
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This year, we will present the William D. Ashman Achievement Award, the John A. Wagnon Jr. Technical Achievement Award, five Fellow
of the Society Awards, the Corporate Recognition Award, the Sidney J. Stein International Award, the Outstanding Educator Award, the
Daniel C. Hughes Jr. Memorial Award, and three President’s Awards.
The Society will also recognize Best and Outstanding Papers of the IMAPS 2009 Symposium which was held in San Jose, California, last
November.
Please join us in recognizing, congratulating and thanking not only these award recipients, but also the 2010 Symposium Committee and
all the companies that have supported IMAPS as sponsors and exhibitors.
The ceremony will take place on the stage in the exhibit hall theater of the Raleigh Convention Center from 11:40 am to 12:00 pm
immediately following the IMAPS Annual Business Meeting of the Society and will conclude with a Keynote presentation from Dr. John
Edmond, Co-founder of CREE Research, Inc.
Delip “Doug” Bokil
Namark Process Design LLC
IMAPS 2010 First Past President
Best Paper of the 2009 Symposium
WA34: Wafer Level/CSP Packaging Requirements
Chairs: Robert Forman, Dow Corporation; Lyndon Larson, Dow Corning Electronics
Microspring Characterization and Flip Chip Assembly Reliability
E. M. Chow, B. Cheng, D. DeBruyker, C. Chua, K. Sahasrabuddhe, Palo Alto Research Center (PARC);
I. Shubin, J. Cunningham, Y. Luo, A. V. Krishnamoorthy, Sun Microsystems
Outstanding Papers of the 2009 Symposium
THA44: Flip-Chip and Wafer Bumping: Processes and Reliability
Chairs: Bahareh Banijamali, Tessera Inc.; Timothy Younger, IBM
Laser Based Assembly of Ultra Fine Pitch Bumped ICs for Die-on-Die Applications
Andrew J.G. Strandjord, Thorsten Teutsch, Ghassem Azdasht, Pac Tech - Packaging Technologies, Inc.;
Matt Giere, Sun Microsystems
TA53: MEMS Packaging
Chairs: Alissa M. Fitzgerald, A.M. Fitzgerald & Associates, LLC; David Seeger, Semiconductor Research Corp.
Low-Cost and Reliable Packaging Technology for Stacked MCP with MEMS and Control IC Chips
Mitsuyoshi Endo, Akihiro Kojima, Yoshiaki Shimooka, Yoshiaki Sugizaki, Hiroaki Yamazaki, Etsuji Ogawa, Tamio Ikehashi, Tatsuya
Ohguro, Susumu Obata, Yusaku Asano, Takeshi Miyagi, Ikuo Mori, Yoshiaki Toyoshima, Hideki Shibata,
Toshiba Corporation
awards
IMAPS 2010 Society Awards
William D. Ashman Achievement Award
Corporate Recognition Award
presented to
Dr. James Jian-Qiang Lu
For contributions and research in 3D integration and packaging; for leadership contributions at International Symposiums and Device Packaging
Conferences, and 3-D Packaging Workshops.
presented to
Nordson ASYMTEK
For technical contributions to the microelectronics industry, demonstrating support to IMAPS by continuous organization memberships, and promotion of member participation in IMAPS events.
John A. Wagnon Jr. Technical
Achievement Award
Sidney J. Stein International Award
presented to
Dr. Shi-Wei Ricky Lee
For contributions in finite element stress analysis, solder joint reliability,
3D-TSV packaging, and LED-wafer level packaging; for R&D of packaging and assembly of ICs, optoelectronic devices and microsystems; and as
author of more than 200 technical papers and co-author of three technical
books.
Fellow of the Society
presented to
Dr. Jie Xue
For contributions to IMAPS as Symposium Technical Chair, Global Business Council Chair, Keynote Speaker, Technical Committee for ATW on
Copper, Technical Committee on Copper Low-k Workshops, Session Chair
on Advanced Packaging, Packaging Reliability, and paper presentations at
IMAPS symposiums.
David Saums
For contributions to IMAPS on the Society’s Technical Committee as the
Thermal Subcommittee Chair; Global Business Council Steering Committee Member and Session Chair, Guest Editor of Advancing Microelectronics; for continued service as Chair of the Thermal Management ATW since
2001.
Dr. Patrick McCluskey
For contributions to IMAPS as Technical Program Chair, ATW on Reliability of Advanced Electronics Packages and Devices in Extreme Cold
Environments; Technical Program Chair for three IMAPS International
High Temperature Electronics Conferences and Exhibitions; Symposium
Session Chair; and Faculty Advisor for University of Maryland.
Michael McKeown
For contributions to IMAPS as Co-Chair and member of the Global Business Council; as General Chair and member of the Wire Bonding Workshop; as Session Chair of the Automotive Electronics Packaging Workshop; and as President of the Metro Chapter.
Dr. Barbara Dziurdzia
For contributions to IMAPS as Treasurer of the European Microelectronics Packaging & Interconnection Symposium; and as a member of the Steering Committee of technical conferences and European symposiums.
presented to
Paul E. Collander
For continued leadership in IMAPS Nordic since 1974; and work for
IMAPS Europe, serving in many roles as President of IMAPS Europe,
Technical Program Committee Chair, and European Liaison Committee
representative.
Outstanding Educator Award
presented to
Dr. Janet K. Lumpp
For promotion of microelectronics through teaching and mentoring of students at the University of Kentucky; for recruiting activities to promote
IMAPS memberships; for promoting the University’s student chapter at
IMAPS symposia booth and paper competitions and; for numerous publications at IMAPS events.
Daniel C. Hughes Jr. Memorial Award
presented to
Dr. Karel Kurzweil
For development of thick film-based multichip modules with TAB chip
assembly and its introduction into high volume manufacturing; for development of smart card assembly including chip embedding; for long-time
support in various leadership positions to IMAPS Europe.
President’s Award
presented to
Steven Adamson
For dedicated efforts in ensuring a successful reorganization of the IMAPS
Microelectronics Foundation and increasing its financial resources.
Dr. Nihal Sinnadurai
For diplomacy in establishing professional relations between North American and European leaders of IMAPS, and contributions to the One World
Membership.
Dr. W. Kinzy Jones
For initiating a platform of discussion between North American and European leaders of IMAPS leading to a path forward on an international basis.
CONGRATULATIONS
TO THE
2010 AWARD WINNERS!
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keynote presentation
Tuesday, November 2, 2010
12:00 PM
RCC: EXHIBIT HALL THEATER
Dr. John Edmond
Co-Founder
CREE Research, Inc.
Presentation Title: High Efficiency Blue and White LEDs for the
New Lightbulb
Dr. John Edmond graduated summa cum laude from Alfred University in 1983 with a Bachelor of
Science degree in ceramic engineering. He earned his Ph.D. in Materials Science at NC State
University in 1987 and upon graduation co-founded CREE Research, Inc. Since its founding, Dr. Edmond has worked on
the development and production of blue and green LEDs, first in SiC, then the Group III Nitrides on SiC.
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In July 2007, Dr. Edmond earned a place on Business 2.0s ‘50 Who Matter Now’ list. The distinction places him alongside
business celebrities such as Steve Jobs, founder and CEO of Apple, and the chiefs of Amazon, Cisco and Google. He and
his team continue to advance the performance of LEDs to enable high efficiency solid state lighting solutions. He has 73
issued and 33 pending patents in the US, with an additional 147 issued and 127 pending foreign patents in the field of SiC
and Group III-Nitrides.
IMAPS
2010
Raleigh Convention Center
Research Triangle, North Carolina
November 2-4
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keynote presentation
Wednesday, November 3, 2010
11:45 AM
RCC: EXHIBIT HALL THEATER
Dr. Rao Tummala
Professor and Director of 3D Systems Packaging
Research Center
Georgia Institute of Technology
Presentation Title: Grand Challenges and Potential Solutions in
the Changing World of Nano-Electronics from ICs to 3D ICs to
3D Systems
Prof. Rao Tummala is a Distinguished and Endowed Chair Professor, and Founding Director of NSF ERC at Georgia Tech,
the largest Academic Center in Microsystems pioneering System-On-Package (SOP) vision, since 1994. Prior to joining
Georgia Tech, he was an IBM Fellow, pioneering such major technologies as the first plasma flat panel display based on
gas discharge, the first and next three generations of multichip packaging - alumina, glass-ceramic-copper and copperpolymer thin film, and materials for ink-jet printing and magnetic storage.
He received many industry, academic and professional society awards including Industry Week’s award for improving U.S.
competitiveness, IEEE’s David Sarnoff, Major Education and Sustained Technical awards, Dan Hughes award from IMAPS,
Engineering Materials Achievement award from DVM and ASM-International, Total Excellence in Manufacturing award
from SME, John Jeppson’s award from the American Ceramic Society as well as the Distinguished Alumni Awards from the
University of Illinois, the Indian Institute of Science, Bangalore and Georgia Tech. He received his BS from IISc, Bangalore
and Ph.D. from the University of Illinois.
Prof. Tummala published 426 technical papers, holds 74 patents and inventions; authored the first modern packaging
reference book - Microelectronics Packaging Handbook (Van Nostrand, 1988) and the first undergrad textbook - Fundamentals of Microsystems Packaging (McGraw Hill, 2001) and first book introducing the System-On-Package technology.
He is a Fellow of IEEE, IMAPS, and the American Ceramic Society, and member of the National Academy of Engineering
in the USA and in India. He was the President of both IEEE-CPMT and IMAPS.
Hotel Key Cards;
Note Pads/Pens for Technical Sessions
provided by:
www.thickfilm.net
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imaps 2010
P L AT I N U M S P O N S O R
Natel
20
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Premier & Presidential Sponsors
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Semiconductor Equipment
Corporate Overview
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21
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S I LV E R S P O N S O R
Heraeus Thick Film Division:
Our commitment to the thick film
industry has never been stronger
22
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LÞʜÕÀÊLœœÌ…ʈ˜Ê,>iˆ}…°
Premier & Presidential Sponsors
PRESIDENTIAL SPONSOR
METALOR
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23
imaps 2010 sponsors
(as of October 8th)
Premier Sponsors
Platinum Sponsor
Gold Sponsor
www.natelengr.com
Silver Sponsor
www.hesse-knipps.us
Presidential Sponsor
www.thickfilm.net
www.metalor.com
Event Sponsors
Logo Bags and Final Program
www.thickfilm.net
www.natelengr.com
www.hesse-knipps.us
Internet Café
www.natelengr.com
24
President Reception, Wireless and Lanyards
www.metalor.com
International Reception, Hotel Key Cards and Note Pads/Pens for Technical Sessions
www.thickfilm.net
Refreshment Breaks in the Exhibits Hall;
Golf Hole/Luncheon
Lunch in Exhibit Hall
www.rfmd.com
www.lord.com
Golf Hole
Bag Insert
GBC Happy Hour
www.technic.com
www.terrauniversal.com
www.dow.com
Media Sponsors
www.electronicsprotectionmagazine.com
www.ledjournal.com
www.meptec.org
www.antennasonline.com
www.thermalnews.com
www.us-tech.com
www.waferpackaging.com
symposium sponsors
(as of October 8th)
IMAPS 2010 Corporate Sponsors
Welcome Reception
Technical Sessions
Natel
Hesse & Knipps Semiconductor Equipment
Heraeus
Natel
Hesse & Knipps Semiconductor Equipment
Heraeus
Exhibit Aisle Signs
GBC Happy Hour
Natel
Dow Electronic Materials
Internet Café
President’s Reception
Natel
Metalor
Opening Ceremonies
International Reception
Natel
Hesse & Knipps Semiconductor Equipment
Heraeus
Heraeus
PDC Lunch & Reception
Hesse & Knipps Semiconductor Equipment
Exhibit Hall Signs
Natel
Hesse & Knipps Semiconductor Equipment
Heraeus
Wireless in the Exhibit Hall
Badge Lanyards
Metalor
Metalor
Logo Bags
Natel
Hesse & Knipps Semiconductor Equipment
Heraeus
Hotel Key Cards and Note Pads/Pens
for Technical Sessions
Heraeus
SPECIAL THANKS
TO OUR
IMAPS 2010 SPONSORS
IMAPS Café
Natel
IMAPS Internet Café in the Exhibit Hall
featuring:
Four PC stations with high-speed Internet connections, so you are able to log onto the web
and check email within seconds.
Sponsored by
www.natelengr.com
25
PDCs
Sunday, October 31 & Monday, November 1, 2010
All PDCs run 8:00 am - 5:00 pm, unless otherwise noted.
PDC Registration Fee Includes:
All course materials, refreshment breaks and lunch on the day of your course only, a PDC Reception on Sunday, October 31st for
PDC instructors & attendees only, a Certificate of Attendance (mailed to you post-show), plus an invitation to the Welcome
Reception on Monday, November 1st.
Sunday, October 31st
S1: Room 301 A
Polymers for Semiconductor
Packaging
Course Leader: Dr. Jeff Gotro,
InnoCentrix, LLC
S2: Room 301 B
TSV and Other Key Enabling
Technologies of 3D IC/Si
Integrations
Course Leader: Dr. John H.
Lau, ITRI
26
S3: Room 305 A
MEMS Reliability and Packaging
Course Leader: Dr. Slobodan
Petrovic, Oregon Institute of
Technology
S4: Room 305 B
Adhesion Fundamentals in
Microelectronic Packaging
Course Leader: Dr. Raymond
A. Pearson, Lehigh University
Monday, November 1st
S6: Room 306 B
Plating Processes for High
Reliability Microelectronic
Devices
Course Leader: Fred Mueller,
CEF, General Magnaplate
Corp.
S8 - Room 201
½ Day: 8 am - Noon
Understanding Failure and
Root-Cause Analysis in PbFree Electronics
Course Leader: Greg Caswell,
DfR Solutions
S9 - Room 201
½ Day: 1 pm - 5 pm
LED Packaging Technology:
Design, Materials, Processes,
and Applications
Course Leader: Dr. S. W.
Ricky Lee, Hong Kong
University of Science and
Technology
M1: Room 301 A
Modeling and Optimization of
Electronic Packaging Structures for Signal and Power
Integrity
Course Leaders: Dr. Ivan Ndip,
Fraunhofer IZM; Professor Ege
Engin, San Diego State
University; Dr. Antonio
Ciccomancini Scogna,
Computer Simulation
Technology (CST) of America
M5: Room 306 A
An Electronics Expert Reliability Analysis Tool
Course Leaders: Craig
Hillman, Greg Caswell, Nathan
Blattau, DfR Solutions
M2: Room 301 B
Introduction to Microelectronics
Packaging
Course Leader: Phillip G.
Creter, Creter & Associates
M7: Room 306 C
Hermeticity Testing and RGA
(Residual Gas Analysis)
Course Leaders: Thomas J.
Green, TJ Green Associates
LLC; Philipp Schuessler,
Schuessler Consulting
M3: Room 305 A
Technology of Screen Printing
Course Leaders: Arthur Dobie,
Sefar Inc.; David Malanga,
Heraeus, Inc., Circuit Materials
Division
M4: Room 305 B
Nanopackaging:
Nanotechnologies in Microelectronics Packaging
Course Leader: Dr. James E.
Morris, Portland State
University
S5: Room 306 A
RF/Microwave Hybrids: Basics,
Materials and Processes
Course Leader: Richard Brown,
Richard Brown Associates, Inc.
CANCELLED PDCs
S1: High-Performance Thermal Management Materials
Course Leader: Dr. Carl Zweben, Thermal Management
Materials Consultant
M6: Room 306 B
Wire Bonding in
Microelectronics
Course Leader: Lee Levine,
Process Solutions Consulting
M8 - Room 201
½ Day: 8 am - Noon
3D Integration and Packaging
Technologies, Assessment,
Status and Applications
Course Leader: James J.-Q.
Lu, Rensselaer Polytechnic
Institute
M9 - Room 201
½ Day: 1 pm - 5 pm
3D IC Integration
Course Leader: Dr. Philip E.
Garrou, Microelectronic
Consultants of NC
The course above was cancelled at the request of the Instructor &
replaced with the new S1 course by Dr. Jeff Gotro.
S7: Hybrid Visual Inspection per Mil-STD-883
Course Leader: Thomas J. Green, TJ Green Associates LLC
PDC Refreshment Breaks
RCC - Room 303*
10:00 am - 10:30 am
and
3:00 pm - 3:30 pm
PDC Luncheon
RCC - Room 303*
Noon - 1:00 PM
*on the day of your course only.
PDC Lunch & Reception
sponsored by:
www.hesse-knipps.us
PDC Reception
RCC - Room 201
5:00 pm - 6:00 pm
Sunday, October 31st
PDC instructors & attendees only
Get Publ
ished W
ith IMAPS!
Published
With
We invite you
to submit your technical manuscript(s) for peer review for an upcoming issue of the Journal of Microelectronics and Electronic Packaging (JMEP). The
IMAPS Journal is a prestigious, refereed, and archival publication distributed to a qualified audience
worldwide comprised of IMAPS members, educational institutions, and corporate libraries. Focused
solely on microelectronics topics and the electronic
packaging of these technologies, JMEP contains only
papers relevant to your business and industry.
Complete information regarding this publication may
be found on the IMAPS website at www.imaps.org/
jmep; however, the key points are:
• With such a technically focused publication, you can
get to print much faster with JMEP – 2-4 months on
average from submission to publication.
• All submissions must be in electronic format, and
should be submitted via E-Mail to jmep@imaps.org.
• Papers should preferably be formatted and submit-
ted in Microsoft Word.
• Tables, graphs, and photographs should be submitted at the end of the file and need not be embedded
in the text.
• Photographs and other illustrations should preferably be submitted as high resolution files - JPEG, GIF
or WMF format preferred.
http://www.imaps.org/
• The Transfer of Copyright form must be filled out on the IMAPS website.
jmep/copyright.pdf.
Authors of papers that have been printed in other IMAPS publications or presented at IMAPS
workshops are invited to submit updated and/or expanded versions of their papers for possible
publication in the Journal.
Please send all submissions, comments, or questions to jmep@imaps.org or feel free to contact the
phone/e-mail below.
IMAPS Headquarters
611 2nd Street, NE
Washington, DC 20002
Phone: 202-548-8715
E-mail: bschieman@imaps.org
Website: www.imaps.org
Bringing Together the Entire Microelectronics Supply Chain!™
27
technical program
3D Packaging and Integration
Track
TA1 - Room 305 A
3D Interconnect Technologies in RTP
Chairs: Paul Franzon, North Carolina State
University; Phil Garrou, Microelectronic
Consultants of NC
8 am - 10:20 am
3-D IC Integration is an active area of research
in Research Triangle Park. We have assembled
6 invited papers from the local area to give you
a flavor of what’s going on in 3D in the
triangle.
8:00 3D IC Technology: The Perfect Storm
Philip Garrou, Microelectronic Consultants
of NC
28
8:25 Electrical Demonstration of TSV Interconnects
and Multilevel Metallization for 3D Si
Interposer Applications
Erik Vick, Scott Goodwin, Dorota Temple,
RTI International
Modeling and Reliability Track
TA2 - Room 305 B
Device Design and Modeling
Chair: Joan Delalic, Temple University
8 am - 10:20 am
This session discusses new modeling approaches
and applies them towards the design of new
devices and systems.
8:00 Advanced Microfluidic Packaging for
Molecular Diagnostics
M. Palmieri, STMicroelectronics; T. Barbuzzi,
A. Maierna, M. Marchi, G. Montalbano,
G. Panvini, STMicroelectronics-Italy;
T. Rodenfels, W. Stoeters, Boehringer Ingelheim
microParts GmbH
8:25 A Ceramic Clevis Sensor for Online Substance
Concentration Measurement, Manufactured by
Ceramic Injection Molding
Matthias Hartmann, Steffen Doerner,
Soeren Hirsch, Otto-von-Guericke
University of Magdeburg (TEPROSA)
8:50 Low Temperature Direct Bond Technology
8:50 Packaging of a Fingerprint Based Access
for 3D Microelectronics Integration and Wafer
Control System
Scale Packaging
Sandeepsarma Josyula, Zdenka J. Delalic,
Paul Enquist, Ziptronix, Inc.
Anand B., Temple University
9:15 Break
Next Generation Materials Track
TA3 - Room 306 A
Advanced Materials
Chairs: John Bolger, Department of Defense;
Wenning Liu, Pacific Northwest National
Laboratory
8 am - 10:45 am
This session covers the use of advanced materials
in a wide variety of microelectronics packaging
applications, including RF, conductive adhesives,
proximity communications, energy storage and
nanotechnology.
8:00 Metal Coated Polymer Particles for Electronic
Packaging
Dan V. Goia, Ionel Halaciuga, Clarkson
University; Keith Redford, Conpart AS
8:25 Achieving Ceramic-like RF Capacitor
Requirements with Organic-Based Materials
Jin-Hyun Hwang, John Andresakis, Bob Carter,
Yuji Kageyama, Fujio Kuwako, Oak-Mitsui
Technologies, LLC
8:50 Characterization of Substrate Materials for EndUse Environment Classification
Syed Sajid Ahmad, Arun Shankaran, Fred Haring,
Justin Vignes, Bernd Scholz, Aaron Reinholz,
North Dakota State University
9:15 Break
9:30 Creating 3D Specific Systems: Architecture,
9:30 EE Cars Architecture & Linked ECU:
Design and CAD
Constraints and New Needs
Paul D. Franzon, W. Rhett Davis,
El Khamis Kadiri, Eric Fitterer, Bertrand Delord
Thor Thorolfsson, Samson Melamed,
Manson, PSA Peugeot-Citroën
North Carolina State University
9:55 Low Temperature Bonding of High Density
Large Area Array Interconnects for 3D
Integration
Jason D. Reed, Matthew Lueck, Chris Gregory,
Alan Huffman, John M. Lannon, Jr., Dorota S.
Temple, RTI International
TUESDAY’S SESSIONS
9:55 Reliability Modeling to Enable Damage
Assessments for Plated Through Holes
Gilad Sharon, Donald Barker, University
of Maryland - CALCE
9:15 Break
9:30 Ferro-Electrically Enhanced Proximity
Communications
John E. Cunningham, Ivan Shubin, Darko
Popovic, Hiren Thacker, Xuezhe Zheng, Ying
Luo, Jim Mitchell, Kannan Raj, Ashok V.
Krishnamoorthy, Oracle; Steve Zamek, Winnie
Chen, University of California at San Diego;
Arka Majumdar, Stanford University
9:55 Solid-State Formation of Intermetallic
Compounds in Co-Sb Coupled Nanowires
Seong Gi Jeon, Jae Yong Song, Ho Sun Shin,
Jin Yu, Korea Advanced Institute of Science
and Technology
10:20 Global Technology Survey of Anisotropic
Conductive Interconnect Technologies, Past,
Present and Future - An Industry Intellectual
Property Approach
Edmar M. Amaya, Gene A. Lang, EDAM LAW
PLLC
SPONSORED BY:
www.natelengr.com
A SPECIAL THANKS
TO THE
SOCIETY TECHNICAL
COMMITTEE MEMBERS!
Tuesday Morning, November 2, 2010
*Sessions 8:00 am - 10:45 am
*unless otherwise noted.
Assembly and Packaging Track
TA4 - Room 306 B
Package Reliability Testing
Chairs: Jae Yong Song, Korea Research Institute of Standards and
Science; Mudasir Ahmad, Cisco Systems, Inc.
8 am - 10:45 am
Research on the experimental testing and simulation methods of evaluating
the mechanical reliability of solder ball joints, interconnects, multichip
modules, etc., used in electronic packages.
8:00 Investigation on the Failure Criterion of Reliability Testing for Pb-Free
BGA Packages
Weidong Xie, Tae-Kyu Lee, Kuo-Chuan Liu, Jie Xue, Cisco Systems, Inc.
8:25 Validated High Speed Pull and Shear Test Methodologies to Evaluate
Pb-Free BGA Mechanical Strength
Mudasir Ahmad, Amir Youssef, Cisco Systems, Inc.; Ravi Assudani,
Drew Nelson, Stanford University
Advanced Technologies Track
TA5 - Room 306 C
LED Packaging
Chair: John Mazurowski, Pennsylvania State University
8 am - 10:20 am
We are now using LED technology to reduce life cycle costs, and this has
become a challenge for efficiency. This session covers aspects of LED
packaging including electrical, mechanical, optical, and thermal- and
covers issues relevant to specific applications
8:00 LED Manufacturing Trends (50 minutes)
Jeffrey N. Perkins, Yole, Inc.
8:50 Improvements in Solid State Lighting Applications with the use
of Traditional Thick Film Technology
Sarah Groman, Heraeus Materials Technology LLC; Neil Jones, TT Group
Industries
9:15 Break
8:50 Improved Design of a High Density 3D Multichip Module for Class I
Medical Devices
Doug Link, Michael Kollar, Starkey Laboratories, Inc.
9:15 Break
9:30 Tape-Peel Testing as a Simple Method to Evaluate the Adhesion of Coated
Layers on Metal Core PCB
Bernd Scholz, Ismir Pekmic, Syed Sajid Ahmad, Aaron Reinholz,
North Dakota State University
9:30 Thermal Management Solutions for the LED Market
K. Andrew Kintz, Sara N. Paisner, M. Shane Thompson, LORD Corporation
9:55 Thermoplastic Optical Polymers with Lead-Free Solder Reflow Resistance
for HB-LED Packaging and Assembly
Weijun Zhou, Quan Yuan, Chris Li, Stephen F. Hahn, Kurt A. Koppi,
Berend Hoek, The Dow Chemical Company
9:55 Interconnect Failure Rate Estimation Based on the Extreme Value
Distribution
Mark Plucinski, Mark Hoffmeyer, IBM Corporation
10:20 Enabling MSL-1 Capability for QFN and Other Design Leadframe
Packages
Dan Hart, John Ganjei, Nilesh Kapadia, MacDermid Electronic Solutions
Keynote Presentation
Tuesday, November 2nd
12:00 pm - 12:45 pm
Exhibit Hall Theater
Dr. John Edmond, Co-Founder
CREE Research, Inc.
Presentation Title: High Efficiency Blue and White LEDs
for the New Lightbulb
29
technical program
3D Packaging and Integration
Track
TP1 - Room 305 A
3D TSV Processes and Modeling
Chairs: James J.-Q. Lu, Rensselaer Polytechnic Institute; Zhongping Bao, Qualcomm
Inc.
1:55 pm - 5:15 pm
This session focuses on the latest achievements
related to Through-Silicon-Via (TSV) processes
and modeling, including TSV etching, liner
disposition, copper fill, planarization, and
electrical and mechanical modeling.
30
Modeling and Reliability Track
TP2 - Room 305 B
Design for Reliability
Chair: John Torok, IBM Corporation
1:55 pm - 5:15 pm
Next Generation Materials Track
TP3 - Room 306 A
Ceramic and LTCC Packaging
Chairs: John Menaugh, DuPont Microcircuit
Materials; Larry Zawicki, Honeywell FM&T
1:55 pm - 4:50 pm
With more integration across chips, packages
and system through 3D packaging, SiP and
multi-chip modules, testing for failure and
detecting the failure mechanism are very
important. Design is the best stage to
systematically implement a reliability
improvement and monitoring scheme. In this
session, papers that discuss designs to improve
and quantify reliability will be presented.
The use of ceramics in the electronics industry
continues to grow. Ceramic applications in
electronics include sensors, actuators, electrooptical materials, packaging of semiconductors,
and multilayer modules for RF and Microwave
applications. The reasons for the increased use is
that ceramics is chemically inert, provides a
hermetic package around unpackaged ICs,
capable of withstanding high temperatures and the
TCE closely matches the performance of the
semiconductors.
1:55 Electrical Analysis and Modeling of 3D
Through-Strata-Vias (TSVs) and Pads
1:55 Improvement of ELK Reliability in Flip Chip
Zheng Xu, Adam Becce, Kenneth Rose, JianPackages using Bond-on-Lead (BOL)
Qiang Lu, Rensselaer Polytechnic Institute
Interconnect Structure
Eric Ouyang, MyoungSu Chae, Seng Guan Chow, 1:55 Investigation of Silver Migration Impacts on
2:20 Impact of Mechanical Simulation Methodology
Roger Emigh, Mukul Joshi, Rob Martin, Raj
Microwave Systems Fabricated on LTCC
on Electronic Package Reliability Assessment
Pendse, STATSChipPAC Inc.
Substrate Under High-Power RF Excitation and
with Applications to 3D TSS Technology
High Temperature and Humidity Conditions
Zhongping Bao, James Burrell, Qualcomm Inc.
Deepukumar M. Nair, K. M. Nair, Ken Souders,
2:20 Molded Underfill (MUF) Technology
Michael Smith, Mark McCombs, James Parisi,
Development for SiP Module with Fine Flip Chip
2:45 Enabling Robust Copper Fill of High Aspect
Tim Mobley, DuPont Electronic Technologies;
Do-Jae Yoo, Ki-Chan Kim, Young-Hoon Kwak,
Ratio Through Silicon Vias
Bradley Thrasher, Innerpulse Inc.
Min-Seok Jang, Job Ha, Jae-Cheon Doh,
Mark Willey, Damo Srinivas, Sesha Varadarajan,
Chang-Bae Lee, Young-Do Kweon, Samsung
David Porter, Easwar Srinivasan, Dennis
Electro-Mechanics Co., LTD
2:20 Selected Applications and Processing for Low
Hausmann, Jon Henri, Hu Kang, Mayur Trivedi,
Temperature Cofired Ceramic
Tom Mountsier, Novellus Systems
Ken A. Peterson, Daniel S. Krueger, Charles E.
2:45 Characteristic Life Based Acceleration
Sandoval, Sandia National Laboratories
Transforms for Lead-Free Solder Joint
3:10 Break
Reliability under Thermal Cycling Conditions
Mudasir Ahmad, Kuo-Chuan Liu, Cisco Systems, 2:45 New Mixed Metal Transition Via-Fill Conductors
4:00 A Novel TSV Etching using NLD and VHF CCP
Inc.
for Cost Effective DuPont GreenTape™ 951 &
Plasma for 3-D Stacked Devices
9K7 LTCC Circuits
Yasuhiro Morikawa, Takahide Murayama,
K. M. Nair, M. F. McCombs, K. E. Souders,
3:10 Break
Manabu Yoshii, Koukou Suu, ULVAC Inc.
S. E. Gordon, DuPont Microcircuit Materials
4:00 Drop Test Simulation for the Component-Level
3:10
Reliability of Module Packages
Yu Gu, Daniel Jin, RF Micro Devices Inc.
4:00
4:25 Counterfeit Detection Strategies: When to Do It
4:50 Filling and Planarizing Deep Trenches with
/ How to Do It
Polymeric Material for Through-Silicon Via
Greg Caswell, DfR Solutions
Technology
R. K. Trichur, M. Fowler, J. W. McCutcheon,
4:50 Electromigration Performance of Pb-Free
M. Daily, Brewer Science, Inc.
μPILR™ Flip-Chip Packages
Rajesh Katkar, Laura Mirkarimi, Tessera, Inc.
4:25
UESDAY
OVEMBER ND
4:25 Highly Ionized Sputtering for TSV-Lining
Mohamed Elghazzali, Juergen Weichart,
OC Oerlikon Balzers Limited
T
,N
2
Student Booth Judging
1:30 pm 3:00 pm
Exhibit Hall
Student Chapter Meeting
3:30 pm - 4:30 pm
&
Student Industry Panel/Reception
4:30 pm - 5:30 pm
Room 201
Break
Effect of Dielectric Selection on Sintering
Behavior of LTCC
Daniel S. Krueger, Laura Agee, Cristie Fadner,
Brent Duncan, Greg Hilmas, Shi Zhang,
Wayne Huebner, Honeywell Federal Manufacturing
& Technologies; Ken Peterson, Sandia National
Laboratories
The Future of Maximum CAD/CAM Automation
for Ceramic Hybrids
John Sovinsky, CAD Design Services, Inc.
Platinum Sponsor
www.natelengr.com
Tuesday Afternoon, November 2, 2010
*Sessions 1:55 pm - 5:15 pm
*unless otherwise noted.
Assembly and Packaging Track
TP4 - Room 306 B
Pb-Free Solder Materials and RoHS, Processes
and Reliability
Chairs: Young-Bae Park, Andong National University; Tae-Kyu Lee,
Cisco Systems, Inc.; Jae-Woong Nah, IBM T. J. Watson
Research Center
1:55 pm - 5:15 pm
This session provides the latest advances in materials, processes, and
reliability issues in Pb-free solder materials.
Advanced Technologies Track
TP5 - Room 306 C
Wafer Level/CSP Packaging Requirements
Chairs: Susan Chen & George Sears, LORD Corporation
1:55 pm - 4:50 pm
Cost reduction and miniaturization are some of the challenges that the
semiconductor and IC packaging industry has been facing. Wafer level
packaging and chip scale packaging have gained their popularity in recent
years addressing these industry needs. This session consists of interesting
papers on the packaging evolution technology review and the latest
technology development in these areas.
1:55 Pb-Free v/s Tin-Lead Reliability Comparison for Telecom/High
Reliability Applications
Ganesh Iyer, Gnyaneshwar Ramakrishna, Lavanya Gopalakrishnan,
Kuo-Chuan Liu, Cisco Systems, Inc.
1:55 On the Origins, Status, and Future of Flip Chip & Wafer Level Packaging
Alan Huffman, RTI International; Philip Garrou, Microelectronic Consultants
of NC
2:20 Effects of Fe on the Kirkendall Void Formation of Sn-3.5Ag-xFe/Cu
Solder Joints
S. H. Kim, Jin Yu, KAIST
2:20 2nd Level Reliability Improvement on WLCSP
Seungwook Park, Jupyo Hong, Changbae Lee, Sunhee Moon, Jinsoo Kim,
Hyungjin Jeon, Dojae Yoo, Youngdo Kweon, Samsung Electro-Mechanics
Co., LTD.
2:45 Impact of Isothermal Aging on Fine Pitch BGA Packages with Sn-AgCu Solder Interconnects
Tae-Kyu Lee, Weidong Xie, Kuo-Chuan Liu, Jie Xue, Cisco Systems, Inc.;
Thomas R. Bieler, Michigan State University
2:45 Spin Coating of Dielectrics on Thin Silicon to Enhance Strength
Characteristics
Fred Haring, Syed Sajid Ahmad, Nathan Schneck, Kaycie Gerstner,
Nicole Dallman, Chris Hoffarth, Aaron Reinholz, North Dakota State
University
3:10 Break
3:10 Break
4:00 A Study on the Mechanism of Black Pad Formation during Electroless
Nickel Immersion Gold Process
J.H. Kim, Jin Yu, KAIST; K. H. Kim, Carnegie Mellon University
4:25 Nanoindentation Characterization of Lead-free Solders and Intermetallic
Compounds Under Thermal Aging
S. W. Ricky Lee, Tong Jiang, Fubin Song, Chaoran Yang, Hong Kong
University of Science and Technology
4:00 Wafer-Level Hermetic Packaging for Bio-Medical Applications
Antonio La Manna, Carine Gerets, Maaike Op de Beeck, Thibault Buisson,
Eric Dy, Philippe Soussan, IMEC
4:25 Mask and Mask-Less Injection Molded Solder (IMS) Technology for Fine
Pitch Substrate Bumping
Jae-Woong Nah, Peter A. Gruber, Paul A. Lauro, Claudius Feger, IBM T.J.
Watson Research Center
4:50 Effects of Electromigration(EM) on the Kirkendall Void Formation
in Sn-3.5Ag/Cu Solder Joints
Yong Jung, Jin Yu, KAIST
Plan to attend Casino Night!
to benefit the Microelectronics Foundation
Tuesday, November 2nd
7:30 pm - 10:30 pm
Room: 402
The Microelectronics Foundation provides funding for college and high school students to attend
IMAPS events throughout the year and to put on special events in their region. Casino Night is a
chance to have a fun evening with friends and customers and have a chance to win prizes. Details on
page 43.
This event is limited to 70 people. There will also be a silent auction.
Tickets are $50, available at the Registration Desk or on-line at
http://www.microelectronicsfoundation.org/imaps2010.html.
31
technical program
3D Packaging and Integration
Track
WA1 - Room 305 A
3D Systems Integration
Chairs: Venky Sundaram, Georgia Institute of
Technology; Kevin Moores, Department
of Defense
8 am - 11:15 am
This session focuses on recent advances in
modules and systems enabled by 3D stacking,
including materials and processes for wafer
thinning, TSV fabrication, bonding and
assembly, interconnection schemes, and system
level modeling and characterization.
32
Modeling and Reliability Track
Next Generation Materials Track
WA2 - Room 305 B
Modeling & Design for Signal/Power
Integrity
Chairs: Ivan Ndip, Fraunhofer Institute for Reliability and Microintegration, IZM;
Sanjeev Gupta, Agilent Technologies
8 am - 11:15 am
WA3 - Room 306 A
Thermal Management
Chairs: Woong-Sun Lee, Hynix Semiconductor
Inc.; Virgil Ganescu, Harrisburg Area Community College
8 am - 10:50 am
Semi-analytical, numerical and statistical
methods are applied to efficiently and accurately
model electronic packaging structures. Design
guidelines/rules are derived to ensure signal and
power integrity.
8:00 The Role of Wafer Bonding in 3D Integration 8:00 PCB Effects on On-Chip Capacitor
and Packaging
Requirements and an Efficient ResonanceJames Hermanowski, Greg George, SUSS
Prevention ASIC Methodology
MicroTec, Inc.
Timothy Budell, Eric Tremble, IBM Systems and
Technology Group
8:25 Advanced Thin Wafer Support Processes
for Temporary Wafer Bonding
8:25 A Miniaturized Ground Surface Perturbation
Jeremy McCutcheon, Dongshun Bai, Brewer
Lattice for Noise/Coupling Mitigation in
Science, Inc.
Packaging Applications
Antonio Ciccomancini Scogna, CST of America
8:50 Simulation of Process-Stress Induced Warpage
of Silicon Wafers Using ANSYS® Finite 8:50 Capacitance Calculation for Offset Via
Element Analysis
Structures using an Integral Approximation
Aditi Mallik, Roger Stout, ON Semiconductor
Approach Based on Finite Element Method
Hanfeng Wang, Yaojiang Zhang, James L.
Drewniak, Jun Fan, Missouri University of
9:15 Break
Science and Technology; Bruce Archambeault,
IBM Corporation
10:00 Processing Aspects to Achieve High-End Hybrid
Backside Illuminated Imagers
9:15 Break
Joeri De Vos, Koen De Munck, Mehmet Akif
Erismis, Padmakumar Ramachandra Rao,
Kiki Minoglou, Wenqi Zhang, Deniz S. Tezcan,
10:00 Successful Practices for the Modeling of Printed
Piet De Moor, Philippe Soussan, IMEC
Circuit Boards and Substrates Using
Electromagnetic Field Solvers
Steven G. Pytel Jr., Sergey Polstyanko, Werner
10:25 Advances in Wafer Level Processing and
Thiel, Richard Hall, ANSYS; Scott C. McMorrow,
Integration for CIS Module Manufacturing
Tom Dagostino, Teraspeed Consulting
Bioh Kim, EV Group, Inc.; Thorsten Matthias,
Gerald Kreindl, Viorel Dragoi, Markus
Wimplinger, Paul Lindner, EV Group
10:25 Debye Model Fitting for Time-Domain Modeling
of Lossy Dielectrics
A. Ege Engin, San Diego State University
10:50 Development on Silicon Module with Cu-Filled
TSV and Integrated Passive Devices
Yun-Mook Park, Jun-Kyu Lee, Byung-Jin Park,
10:50 Statistical Analysis Approach to Improve the
Byeung-Gee Kim, Jung-Won Lee, In-Soo Kang,
High Speed Signal Quality by Including the
NEPES Corporation
Manufacturing Process Variations of Printed
Circuit Board
Seungyong Baek, Mike Sapozhnikov,
Warren Meggitt, Philip Pun, Jason Visneski,
EDNESDAY
OVEMBER RD
Ramesh Velugoti, Amit Agrawal, Cisco Systems,
Inc.
Student Plant Tour
W
,N
3
at the
DuPont Microcircuit Material
Headquarters
Must meet at 8:15 am
Convention Center Main Entrance.
The Thermal Management Session includes topics
about all thermal issues of Electronic Packaging
such as Thermal Analysis and Modeling, Thermal
Interface Materials, Thermal Packaging, System
Cooling, etc.
8:00 Imminent Needs in Future Development of Air
Cooled Microprocessors Heat Sinks
V. Ganescu, Harrisburg Area Community College;
A. Pascu, Politechnica University of Bucharest
8:25 Kinetic Heat Sink
Vijay Khanna, Gerard McVicker, Sri M. SriJayantha, IBM - T.J. Watson Research Center
8:50 New GaN Power-Electronics Packaging
Solutions: A Thermal Analysis using Raman
Thermography
M. Faqir, A. Manoi, M. Kuball, University of
Bristol; T. Mrotzek, S. Knippscheer, Plansee SE;
M. Massiot, Egide; M. Buchta, H. Blanck, United
Monolithic Semiconductors; S. Rochette,
O. Vendier, Thales Alenia Space
9:15 Break
10:00 Using In situ Capacitance Measurements to
Monitor the Stability of Thermal Interface
Materials in Complex PCB Assemblies
Michael Gaynes, Timothy Chainer, Edward
Yarmchuk, IBM - T.J. Watson Research Center;
John Torok, David Edwards, David Olson,
Katie Pizzolato, IBM Corporation
10:25 Study on Thermal Proof of SnO2 Protection Thin
Film for Ultra High Reflective Film Ag System
H. Miyagawa, R. Satoh, Y. Iwata, E. Morinaga,
S. Kamo, Osaka University
Wednesday Morning, November 3, 2010
*Sessions 8:00 am - 11:15 am
*unless otherwise noted.
Assembly and Packaging Track
WA4 - Room 306 B
Wirebonding and Stud Bumping I
Chair: Daniel Evans, Palomar Technologies, Inc.
8 am - 11:15 am
Wire bonding continues as the dominant method of chip interconnection.
This session starts with an overview of the process and proceeds with some
of the innovative variations that enable high reliability solutions to today’s
packaging.
8:00 The Microelectronic Wire Bond: Past, Present, and Future
Harry K. Charles, Jr., The Johns Hopkins University/Applied Physics
Laboratory
8:25 Challenges of Wire Bonding In High Value and High Performance Medical
Devices
James A. Ohneck, Valtronic Technologies USA
8:50 Improved Bond Reliability Through the Use of Auxiliary Wires (Security
Bumps and Stand-Off Stitch)
David J. Rasmussen, Palomar Technologies, Inc.; Rodney Thompson,
Goodrich Corporation
9:15 Break
10:00 2 mils Au Wire Interchip Wedge Bond Cratering Study
Wang ZhiJie, Tony Lim, Jiang YingWei, Zhang ChangLiang, Freescale Inc.;
Haengsun Choi, Kwansun Hwang, ASEKr Inc.
10:25 Predicting Fusing Current for Encapsulated Wire Bonds under Transient
Loads
Aditi Mallik, Roger Stout, ON Semiconductor
10:50 A Systematic Approach for Creating a System-In-Package (SIP)
Sam Sadri, Tri Le, Stephanie A. Althouse, NxGEN Electronics
Advanced Technologies Track
WA5 - Room 306 C
Emerging Technologies
Chairs: Luu Nguyen, National Semiconductor Corporation; Mark
Hoffmeyer, IBM Corporation
8 am - 11:15 am
This session will introduce emerging technologies in processes, materials,
and design for electronic devices. The first four papers in this session present
novel patterning processes for a variety of microstructures and substrates.
These are followed by a paper introducing a unique capacitor material, and
a paper discussing a novel processor design.
8:00 Silicon Micro-Fabrication Technologies for Micro-Filters
Bivragh Majeed, Wim De Malsche, Lei Zhang, Paolo Fiorini,
Deniz Sabuncuoglu Tezcan, Philippe Soussan, IMEC
8:25 Understanding Cleaning of Vias Fabricated Using Micro Mechanical
Punching in Liquid Crystal Polymer (LCP) Substrate
Mohammad K. Chowdhury, Ajay P. Malshe, University of Arkansas;
Li Sun, Shawn Cunningham, WiSpry Inc.
8:50 Laser Patterning and Via Drilling of Sapphire Wafers and Die
Justin Vignes, Fred Haring, Syed Ahmad, Kaycie Gerstner, Aaron Reinholz,
North Dakota State University
9:15 Break
10:00 High-Dielectric-Constant PLZT Films on Metal Foils for Embedded Passives
Beihai Ma, Manoj Narayanan, U. (Balu) Balachandran, Argonne National
Laboratory
10:25 Hardware Design for Novel Packaging of Multi-Cellular
Meta-Processing Unit
Son Nguyen, Joan Delalic, Temple University; Bjorn Gruenwald, Hilbert
Technology
10:50 The Performance Over the Frequency Range 140GHz-220GHz
of Thick-Film CPW Lines Fabricated from Nano-Particle Silver
A. Alshehri, R. J. Leigh, C. E. Free, University of Surrey; M. Horaczek,
D. Rudka, M. Jakubowska, M. Sloma, Warsaw University of Technology
Keynote Presentation
Wednesday, November 3rd
11:45 am - 12:30 pm
Exhibit Hall Theater
Lunch in the Exhibit Hall
Dr. Rao Tummala
Wednesday,
November 3rd
12:30 PM - 1:30 PM
Professor and Director of 3D Systems Packaging Research Center
Georgia Institute of Technology
sponsored by
Presentation Title: Grand Challenges and Potential Solutions
in the Changing World of Nano-Electronics from ICs to 3D ICs
to 3D Systems
www.rfmd.com
33
technical program
3D Packaging and Integration
Track
WP1 - Room 305 A
3D Packaging
Chairs: Milind Shah, Qualcomm Inc.; Lee
Levine, Process Solutions Consulting
1:35 pm - 4:35 pm
This session focuses on the latest developments
in 3D packaging which includes package
design, process and structure.
Modeling and Reliability Track
Next Generation Materials Track
WP2 - Room 305 B
System-Level Signal/Power Integrity
Design
Chairs: Judy Priest, Cisco Systems, Inc.; Dale
Becker, IBM Corporation
1:35 pm - 5:25 pm
WP3 - Room 306 A
High Performance Interconnects
and Boards
Chairs: Amanda Mikhail, IBM Corporation;
Anwar Mohammed, Huawei Technologies
1:35 pm - 5:00 pm
Techniques for system-level modeling, analyzing
and suppressing signal/power integrity and EMI
issues in high-speed packages and boards are
presented.
1:35 Chip-last Embedded Actives and Passives in
Ultra-Miniaturized Organic Packages with
Chip-First Benefits
1:35 Fast and Accurate Multi-Layer PDN Analysis
Nitesh Kumbhat, Fuhan Liu, Venky Sundaram,
for Power Integrity and EMC
Vivek Sridharan, Abhishek Choudhury, Hunter
Bruce Archambeault, Sam Connor, IBM
Chan, Rao Tummala, Georgia Institute
Corporation; Ketan Shringarpure, Jun Fan,
of Technology
Missouri University of Science and Technology
34
This session integrates novel approaches to design
and verification of high performance
interconnects and boards. Design/verification
methodologies, material selections, and
manufacturing methods are addressed.
1:35 Characterization of Black Pad Defect on
Electroless Nickel-Immersion Gold (ENIG) Plated
Circuits
Adam W. Mortensen, Roger M. Devaney, Hi-Rel
Laboratories
2:00 Advanced 3D Packaging of Miniature 2:00 TSV Modeling Considering Signal Integrity
Biomedical Sensors
2:00 High Via Density Thin Metal-Core PCB
Issues
Dohyuk Ha, Tse-Yu Lin, Byung Guk Kim,
using Electro-Coated Dielectric
Ivan Ndip, Brian Curran, Kai Löbbicke, Stephan
Pedro P. Irazoqui, William J. Chappell,
Bernd Scholz, Ismir Pekmic, Syed Sajid Ahmad,
Guttowski, Herbert Reichl, Klaus-Dieter Lang,
Purdue University
Aaron Reinholz, North Dakota State University
Fraunhofer Institute for Reliability and
Microintegration (IZM)
2:25 Wafer Level Assembly Technique Development
2:25 Nanomaterials for “Green” Electronics
for Fine Pitch Flip Chip 3D Die-to-Wafer 2:25 Custom Test Fixture Design and Measurement
Rabindra N. Das, Konstantinos I. Papathomas,
Integration
Mark D. Poliks, Voya R. Markovich, Endicott
Correlation of Differential Pairs in a Flip-Chip
Zhaozhi Li, John L. Evans, Auburn University;
Interconnect Technologies, Inc.
Organic Buildup Package Using Measurement
Brian J. Lewis, Paul N. Houston, Daniel F.
Based De-Embedding
Baldwin, ENGENT, Inc.; Eugene A. Stout,
Daniel Lambalot, Bayside Design, Inc.; Sanjeev
2:55 Break
Theodore G. Tessier, Flip Chip International LLC
Gupta, Agilent Technologies, EEsof-EDA
2:55 Break
2:55 Break
3:45 Dynamic Mechanical Analysis of Printed Circuit
Board Laminates
J. Kuczynski, IBM Corporation
3:45 Compression Molding for Thin PoP Top
3:45 Implementation of a Virtual EMI Lab to CostPackages
Effectively Tackle Multi-Gigahertz EMI 4:10 A Novel Metal Core Substrate with Simplified
Ravikumar Adimula, Jason Brand, Myung Jin
Challenges
Manufacturing Process and High Adhesion
Yim, James Zhang, Richard Strode, Chan Yoo,
Amolak Badesha, Agilent Technologies; Hany
Conformal Dielectric and Circuitry Metal for
Micron Technologies
Fahmy, Chen Wang, Nvidia Corporation; Davy
High Density Chip-Scale Packaging Applications
Pissoort, KHBO-FMEC
Syed Sajid Ahmad, John Jacobson, Zane Johnson,
4:10 Fine Pitch 3D Dispensable Electrical
Kevin Mattson, Aaron Reinholz, Nathan Schneck,
Interconnects for System in Package Solutions
Bernd Scholz, Greg Strommen, North Dakota State
4:10 Pinout Optimization for 10 Gbps+ Serial Link
Jeff S. Leal, Suzette K. Pangrle, Charles Whyte,
University
Routing
c
Keith Barrie, Jeff Leff, Scott M Grath, Gerardo
Judy Priest, David Siadat, Cisco Systems, Inc.
Ayala, Vertical Circuits, Inc.
4:35 Braided Electrical Contact Element Based High
Performance Connectors
4:35 Accurate and Efficient BER Calculation by
Michael Salloum, Che-Yu Li, BeCe Corporation
Statistical Simulation Based on Physical
Transmit Jitter Model
Fangyi Rao, Sanjeev Gupta, Agilent
Technologies, EEsof-EDA
WEDNESDAY’S SESSIONS
SPONSORED BY
www.hesse-knipps.us
5:00 Packaging in IBIS-AMI Technology
Daniel Dvorscak, Steven G. Pytel Jr.,
Isaac Waldron, Danil Kirsanov, ANSYS;
Dale Becker, Matteo Cocchini, IBM Systems
and Technology Group
Wednesday Afternoon, November 3, 2010
*Sessions 1:35 pm - 5:25 pm
*unless otherwise noted.
Assembly and Packaging Track
Advanced Technologies Track
WP4 - Room 306 B
Wirebonding and Stud Bumping II
Chairs: Faina M. Zaslavsky, Crane Electronics Group/Microelectronics Solutions; Yong-Bin Sun, Kyonggi University
1:35 pm - 5:00 pm
Current hot issues for mass production in wirebonding technology.
1:35 Fine Pitch Cu Wire Bonding - As Good As Gold
Bernd K. Appelt, William T. Chen, Andy Tseng, Yi-Shao Lai, ASE Group Inc.
2:00 A Robust CUP Pad Structure Design with Thin Pad Metal for Cu Wire
Bonding
ChangHee Han, SG Kim, JH Shim, DH Jiang, SW Ko, BJ Lee, KC Kim,
HG Lee, JS Yoon, BT Jiang, SW Hong, HD Kim, IS Yoo, YS Song,
Dalsoo Kim, TLI, Inc.; Sihyun Choe, ASE Korea, Inc.
2:25 Free Air Ball Consistency of Palladium Coated Copper Wire
Johnny Yeung, Sylvia Sutiono, Heraeus Materials Singapore Pte Ltd.;
Eugen Milke, WC Heraeus GmbH
WP5 - Room 306 C
MEMS Packaging
Chairs: Yoon-Chul Sohn, Samsung Advanced Institute of Technology;
Ron Barnett, National Instruments
1:35 pm - 5:00 pm
In this session, various types of MEMS and sensor device packaging will be
introduced. The contents will contain packaging materials, etching, TSV
interconnection, analysis, and low temperature bonding etc.
1:35 Sensor Packaging: New Challenges for New Applications
Caroline Beelen-Hendrikx, Coen Tak, NXP Semiconductors
2:00 Low Temperature Wafer Level Packaging Technology
of Bulk-Micromachined MEMS Device
Heung Woo Park, SeungHun Han, Hyun Kee Lee, Yeong Gyu Lee,
Seoung Ho Kim, Bok Gun Moon, Taek Hee Yun, Min Seok Jang,
Si Joong Yang, Sang Hun Park, Sung Jun Lee, Won Kyu Jeung,
Jung Won Lee, Samsung Electro-Mechanics Co.
2:55 Break
2:25 The Use of Metallographic and SEM Analysis for Characterization
of Sidewall Surfaces in MEMS Devices with DRIE Processing
Colin Stevens, Robert Dean, Auburn University; Samuel Lawrence, Lehigh
University; Lee Levine, Process Solutions Consulting
3:45 Wire Bonding UPH and Stitch Bond Improvement using 20 Micron
Insulated Wire with Security Bump
Chunyan Nan, Michael Mayer, Y. Norman Zhou, University of Waterloo;
Jairus L. Pisigan, John Persic, Young-Kyu Song, Microbonds Inc.;
Henry Bathan, STATS ChipPAC Ltd.
2:55 Break
4:10 Pure Palladium and Palladium Phosphorus Depositions used in ENEPIG
and ENEP Surface Finishes - Comparison of Physical Properties and Their
Influence on Soldering and Au Wire Bonding
Mustafa Oezkoek, Atotech Deutschland GmbH; Hugh Roberts,
Joe McGurran, Atotech USA Inc.
4:35 A Method to Quickly Measure the Thickness of Aluminum Bond Pad
on Silicon Substrate
Son Nguyen, Z. Joan Delalic, Temple University; Horst Clauberg, Kulicke and
Soffa Industries, Inc.
3:45 Wafer Level Package with Y Shaped TSV and Vacuum Sealing
by Cu-Sn Isothermal Solidification for MEMS Resonator
Le Luo, Yuhan Cao, Shanghai Institute of Microsystem and Information
Technology, Chinese Academy of Sciences
4:10 MEMS Device Sealing in a High Vacuum Atmosphere Achieving
Long Term Reliable Vacuum Levels
Paul W. Barnes, SST International
4:35 Hermetic Sealing of Stainless Steel Packages by Seam Seal Welding
Thomas Marinis, Berj Nercessian, Charles Stark Draper Laboratory
GLOBAL BUSINESS COUNCIL FALL MARKETING FORUM
Exhibit Hall Theater
Wednesday, November 3rd
5:30 pm - 6:30 pm
Gold Sponsor
“Materials for Photovoltaics and 3D Packaging”
GBC HAPPY HOUR: 6:30 pm - 7:30 pm
SPONSORED BY:
www.hesse-knipps.us
www.dow.com
35
technical program
3D Packaging and Integration
Track
THA1 - Room 305 A
State of 3D Technology - Consortia View
Chair: Urmi Ray, Qualcomm, Inc.
8 am - 12:00 pm
This special session is to discuss the State of 3D
Technology in consortia view and to show case
the exemplary research and development going
on under a pre-competitive umbrella to enable
the framework for faster industry adoption of
3D technology. The consortia activities in 3D-IC
will also be presented. A panel session will
follow to focus on “Roadmap, Technical and
Business Progress of 3D Integration and
Packaging” with questions/answers for both
sessions.
8:00 Nicolas Sillon, Group Manager Packaging
and Integration, CEA-Leti Minatec
36
8:25 Dorota Temple, Senior Fellow and Program
Director, RTI International
8:50 Klaus Hummler, Senior Principal Engineer, 3D
Integration, SEMATECH North
Modeling and Reliability Track
THA2 - Room 305 B
Flip-Chip and Wafer Bumping:
Processes and Reliability
Chair: Lyndon Larson, Dow Corning
8 am - 11:35 am
Flip-chip based devices have been around for a
long time, but the newest technology nodes and
materials limitations are impacting reliability
and performance. This session deals with flip
chip processing and packaging innovations
particularly focused on process and reliability
improvements.
Next Generation Materials Track
THA3 - Room 306 A
Laminate Substrate Materials
and Technology
Chair: Ronald Jensen, Honeywell
8 am - 12:00 pm
The papers in this session will present a number
of novel materials and process technologies
related to organic laminate substrates. These
include halogen-free laminate materials for high
density and rf applications, coreless laminate
substrates, laminates with embedded passives,
electroless copper plating for thru-hole
metallization, and immersion silver plating for
COB surface finish.
8:00 Underfill for Ultra-Low Bumped (10μ
μ ) 3D
Package
8:00 Reliability Studies in Advanced Halogen-Free
Mary Liu, Wusheng Yin, YINCAE Advanced
Organic Laminates for Ultra-Fine Pitch 3D
Materials, LLC
Packaging
Koushik Ramachandran, Fuhan Liu, Nitesh
8:25 Effects of Crystallographic Orientation of Sn
Kumbhat, Baik-Woo Lee, Venky Sundaram, Rao
on Electromigration Behavior
Tummala, Georgia Institute of Technology; Mark
Kiju Lee, Keun-Soo Kim, Yutaka Tsukada,
Wilson, The Dow Chemical Company
Katsuaki Suganuma, Osaka University;
Kimihiro Yamanaka, KYOCERA SLC
Technologies Co.; Soichi Kuritani, ESPEC
CORP; Minoru Ueshima, SENJU METAL
INDUSTRY CO., LTD.
8:25 Next Generation High Dk, Low Df Organic
Laminate for RF Modules and High Frequency
Applications
9:15 Break
Fuhan Liu, Vivek Sridharan, Tapobrata
Bandyopadhyay, Venky Sundaram, Rao Tummala,
8:50 High Yield, Near Void-Free Assembly Process
10:20 Rozalia Beica, Program Director, EMC-3D
Georgia Institute of Technology; Kiyoshige
of a Flip Chip in Package Using No-Flow
Consortium
Kojima, Naomi Shiga, Zeon Corporation;
Underfill
Toshihiko Jimbo, Zeon Chemicals L.P.
Daniel F. Baldwin, Engent, Inc.; Sangil Lee,
Georgia Institute of Technology
Panel Discussion: 10:45 am - 12:00 pm
8:50 A New Coreless Substrate Technology
3D-TSV Integration and Packaging:
Bend K. Appelt, Alex S. F. Huang, Bruce Su,
9:15
Break
Roadmap, Technical and Business
Yi-Shao Lai, ASE Group Inc.
Progress
Moderator: James J.-Q. Lu, Rensselaer Polytechnic Institute
Panelists:
• Klaus Hummler, Senior Principal Engineer, 3D
Integration, SEMATECH North
• Paul Franzon, Professor, North Carolina State
University
• Phil Garrou, Consultant, Microelectronic
Consultants of NC
• Urmi Ray, Senior Staff Engineer, Qualcomm, Inc.
• Rozalia Beica, Program Director, EMC-3D
Consortium
• Nicolas Sillon, Group Manager Packaging and
Integration, CEA-Leti Minatec
• Dorota Temple, Senior Fellow and Program
Director, RTI International
10:20 A Study of High Cu Behavior on Electrolytic Ni
9:15 Break
and Electroless Ni Pad Finish
Hyun-Kyu Lee, Yong-Chul Chu, Myung-Ho
Chun, Sang-Ho Jeon, DUKSAN HI-METAL CO., 10:20 Design, Fabrication, Electrical Characterization
LTD
and Reliability of Nanomaterials Based
Embedded Passives
Rabindra N. Das, John M. Lauffer, Steven G.
10:45 Fine Feature Solder Paste Printing for Solder
Rosser, Mark D. Poliks, Voya R. Markovich,
Sphere and Solder Trace Manufacturing
Endicott Interconnect Technologies, Inc.
Fred Haring, Nicole Dallman, Kaycie Gerstner,
Syed Sajid Ahmad, Aaron Reinholz, North
Dakota State University; Kristi Jean, North
10:45 High Aspect Ratio Package Core Production
Dakota State College of Science
with Electrolytic Deposited Copper
Stephen Kenny, Bernd Roelfs, Atotech Germany
11:10 Thermosonic Gold to Gold Intermettalic
Advantages for CSP Packaging
11:10 Cost-Effective Alternatives to Palladium
Philip Couts, TDK Corporation of America
Activation – A Study on Autocatalytic Electroless
Copper Deposition
Edith Steinhaeuser, T. A. Magaya, Atotech
Deutschland GmbH
Silver Sponsor
www.thickfilm.net
11:35 Immersion Silver as Universal Surface Finish
for COB Technology
J. Goehre, M. Schneider-Ramelow, K.-F. Becker,
M. Hutter, Fraunhofer IZM
Thursday Morning, November 4, 2010
*Sessions 8:00 am - 12:00 pm
*unless otherwise noted.
Assembly and Packaging Track
THA4 - Room 306 B
Microwave and RF Applications
Chairs: Scott Morris, RF Micro Devices; Art Prejs, CREE Research,
Inc.
8 am - 11:35 am
Measurement, modeling, and materials of RF and Microwave packaging
will be examined in this session. The examination will vary from bandpass
filters to transmission line optimization methods. Materials discussed
include composites consisting of nano particles.
8:00 Practical Implementation of Frequency Monitoring for Widely Tunable
Bandpass Filters
Hjalti H. Sigmarsson, Evan Binkerd, Jeff Maas, Juseop Lee, Dimitrios
Peroulis, William J. Chappell, Purdue University
8:25 Modeling and Optimization of Bond Wires as Transmission Lines and
Integrated Antennas at RF/Microwave Frequencies
Ivan Ndip, Christian Tschoban, Stefan Schmitz, Andreas Ostmann,
Martin Schneider-Ramelow, Stephan Guttowski, Herbert Reichl,
Klaus-Dieter Lang, Fraunhofer Institute for Reliability and Microintegration
(IZM)
8:50 High Frequency Measurement Techniques for On-Chip Inductors
Bruce C. Kim, University of Alabama; Dae-Hyun Han, Dong-Eui
University; Seok-Ho Noh, Andong National University
Advanced Technologies Track
THA5 - Room 306 C
Printed and 3D Structural Electronics
Chairs: Mike Newton, nScrypt, Inc.; Young-Chang Joo, Seoul National University
8 am - 12:00 pm
Printed and 3D Structural Electronics is a technology sector that has been
enabled by the convergence of new high resolution printing technologies in
the graphics and additive manufacturing industries along with advances in
electronics polymer and nanomaterials. This session will look at these
advances in printing, materials and low temperature processing of
electronics.
8:00 Inkjet Printable Dispersions of Silver and Gold Nanoparticles
Dan V. Goia, Krishna Balantrapu, Lu Lu, Ionel Halaciuga, Clarkson
University
8:25 Evaluation of PulseForge Tool for Processing Metallic Conductive Inks
on Low Temperature Substrates Part II: Screen Inks
S. Farnsworth, I. Rawson, K. Schroder, D. Pope, NovaCentrix®
8:50 Correlation of Dispense Characteristics of Conductive Inks to Substrate
Temperature
Fred Haring, Justin Vignes, Syed Sajid Ahmad, Arun Shankaran, Kaycie
Gerstner, Nicole Dahlman, Aaron Reinholz, North Dakota State University
9:15 Break
9:15 Break
10:20 Chip Embedding for Printed Circuit Boards and Subsystems
Thomas Gottwald, Alexander Neumann, Schweizer Electronic AG
10:45 AuSi and AuSn Eutectic Die Attach Case Studies from Small (12 mil) to
Large (453 mil) Die
Daniel D. Evans, Jr., Zeger Bok, Palomar Technologies, Inc.
11:10 Study of Grounding Schemes Utilized in Conformal Shielding Applications
Scott Morris, Dan Carey, RF Micro Devices
10:20 Ink-Jetting for Electronic Assembly
Georg Meyer-Berg, Gottfried Beer, Klaus Pressel, Infineon Technologies AG
10:45 Direct Printing/Micro-Dispensing Solution for 3D Coating Applications
Xudong Chen, Kenneth Church, nScrypt Inc.
11:10 Structural Electronics Through Additive Manufacturing and MicroDispensing
Richard Olivas, Rudy Salas, Dan Muse, Eric MacDonald, Ryan Wicker, The
University of Texas at El Paso; Mike Newton, Kenneth Church, nScrypt, Inc.
11:35 Fabrication of Tall Structures for Microelectronics Application Using
Selective Electrodeposition Process
Bernd Scholz, WeiYang Lim, Ferdous Sarwar, Syed Sajid Ahmad,
Aaron Reinholz, North Dakota State University
Student / Exhibitor Interchange
THURSDAY’S SESSIONS
SPONSORED BY
www.thickfilm.net
The Microelectronics Foundation is very happy to announce the continuation of
rd
the Student/Exhibitor Interchange and scholarship program for this year’s 43
Symposium on Microelectronics. This year, we will be hosting students from
th
Cary Academy on Thursday, November 4 , from 9:30 am to 11:30 am. The
objective is to stimulate interest in the students for pursuing careers in science
and technology. Students were selected based on their interest and the quality
of their essay on topics revolving around technology. A scholarship check will be
presented on behalf of IMAPS. Students will also tour the exhibit hall, after which
each student will be assigned to a specific exhibitor to learn more about the
scientific contributions of that company to our industry. This will mark the fourth
year of this highly successful, innovative and popular program.
37
technical program
Interactive Track - Poster Session
Wednesday, November 3, 2010
Session 1:35 pm - 5:25 pm
Exhibit Hall B&C
WP6 - Exhibit Hall
Interactive Forum (Poster Session)
Chair: Lee Levine, Process Solutions Consulting
One-on-One Interactive Forum. This is your chance for
detailed interaction with authors whose work is too good to
miss.
Modeling of a Heterojunction Bipolar Transistor Based AlGaAs / GaAs
W. Kinzy Jones, Sr., Florida International University;
Xudong Chen, nScrypt Inc.
Optimization of Photovoltaic Power Generation using a Measurement
and Management Technology (MMT) Platform
Levente J. Klein, Sergio Bermudez Rodrigues, Satya Nitta,
Robert Sandstrom, Supratik Guha, Hendrik Hamann, IBM TJ
Watson Research Center
K. Ghaffour, A. Bedia, D. Ghaffour, A. Guen-Bouazza,
B. Bouazza, Univerité Abou-Bekr Belkaid of Tlemcen
A First Individual Solder Joint Encapsulant Adhesive
The Reliability of COF Joints with Tin Bumps and Non-Conductive Adhesives
for Image Sensor Module Application
Chip Embedding for Printed Circuit Boards and Subsystems
Chang-Bae Lee, Jin-Gu Kim, Young-Do Kweon, Samsung
Electro-Mechanics Co., Ltd.; Kyoung-Moo Harr, Young-Ho Kim,
Hanyang University
38
Evaluation of Glass Frits for Development of Lead-Free Thick Film Resistor
Mary Liu, Wusheng Yin, YINCAE Advanced Materials, LLC
Thomas Gottwald, Alexander Neumann, Schweizer Electronic
AG
Inkjet Printing of Thick-Film Resistors
Marcel Waßmer, Waldemar Diel, Klaus Krueger, HelmutSchmidt-University
“Cleaning” - The Dirty Word in Packaging Assembly
Rich Brooks, Kyzen Corporation
Development of a Low Voiding Solder Attach Process for Photovoltaic Cell
Assemblies
Identifying and Working with Government Regulations
Kelly Raia, American River International, Ltd.
Ian Hardy, Crane Electronics Group
Creating Solutions to Your Most Demanding Challenges:
Potting and Encapsulants
Semiconductor Packaging/Circuit Assembly
Thermal Management
Conductives
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GLYHUVHDSSOLFDWLRQVKDVDOORZHGXVWRSDUWQHUDQGGHYHORSLQQRYDWLYH
VROXWLRQVWKDWKHOSHQVXUH\RXUVXFFHVV:HFDQKHOS$VN8V+RZ
WWW.LORD.COM
1.877.ASK.LORD (275.5673)
©2010 LORD Corporation SA3150
Presents its Fall Marketing Forum
“Materials for Photovoltaics and 3D Packaging”
Wednesday, November 3, 5:30 pm - 6:30 pm
Exhibit Hall Theater
This GBC Marketing Forum is a business session produced to provide industry insight for all IMAPS 2010 participants. A
lively networking Reception with valuable door prizes will follow to help build industry partnerships. All IMAPS 2010 participants involved with business development and sales management responsibilities should participate. Don’t miss out!
Mr. David Miller
President
DuPont Electronics & Communications
Mr. Leo Linehan
Global Business Director of Advanced Packaging Technologies
Dow Electronic Materials
“An Electronic Material Supplier’s
Perspective on Challenges and
Opportunities in 3D Packaging”
3D packaging is a competitive market
with an ever expanding diversity of
package designs and manufacturing
processes. The rapid growth in 3D packaging is largely driven
by strong consumer demand for ultraportable electronics
with higher performance and more functionality. A review
and discussion of the significant challenges and opportunities
in 3D packaging for material suppliers will be presented.
About Mr. Linehan:
Leo Linehan has more than 20 years of experience in
semiconductor packaging and manufacturing. Prior to joining
Dow, he held several roles in materials development, process
engineering, R & D, and business development at both Rohm
& Haas and the IBM Microelectronics Division. Leo has
authored numerous papers in semiconductor applications
and holds more than 20 patents. www.dow.com/products
“The Critical Role of Materials in the
Photovoltaic Industry”
Mr. Miller will provide an overview of
the PV market, note industry investment, and present on the relevance of
materials in achieving grid parity. He will
focus on energy conversion efficiency,
system lifetime, and overall system cost. David will also touch
on both manufacturing and public policy factors that impact
PV as a sustainable energy solution.
About Mr. Miller:
David Miller began his career with DuPont in 1981 and has
held several positions in engineering, manufacturing, sales,
business development, and investor relations. He was named
Vice President and General Manager of DuPont Electronic
Technologies in 2001 and earned his present position in
October 2009. www2.dupont.com/Electronics/en_US/
GBC HAPPY HOUR: 6:30 pm - 7:30 pm
SPONSORED BY:
www.dow.com
Reception Door Prizes are donated by:
DuPont Electronics, Kyocera America, ASE US, Cisco Systems,
Laurie Roth Marketing, and IMAPS.
39
student program
Dear IMAPS Academic Advisors and Student Members,
Thank you for your interest in participating in IMAPS 2010 Student Programs! These programs listed below are designed
to provide students with technical information, industry insight, and valuable connections.
Dr. Robert Evans
Technical Leader at Cisco Systems & Adjunct Assistant Professor at NC State University
IMAPS 2010 Student Activities Chair
rjevans@cisco.com
40
Professional Development Course (PDC) Monitor:
Students who have signed-up to monitor a course should
report to the registration area and ask for Jackki Morris-Joyner. Monitors must arrive 30 minutes prior to
the start of the class. Course monitors will assist the
instructor to help with the presentation and should remain in the room for the entire scheduled time.
Student Chapter Meeting
Gain more insight and share your success on increasing membership and producing better programs with
other student chapter leaders. Learn ways to gain more
funding. All IMAPS student members are invited. The
chapter meeting will be in Room 201 of the Convention Center on Tuesday, Nov. 2nd, 3:30 - 4:30 pm.
Student Paper Competition
Student authors will deliver paper presentations throughout the Symposium. Their presentations will be evaluated on technical content, presentation skills, the written manuscript, and audience interaction. Winning students will receive cash prizes, a certificate, and recognition in Advancing Microelectronics magazine.
Student-Industry Panel and Reception
The Student-Industry Panel will provide students advice on job hunting, career development, and industry
insight from leading professionals from IBM, Cisco, and
Northrop Grumman. Industry leaders and professional
engineers will describe and discuss how their education, interests, and career experiences led to successful careers. A reception will immediately follow when
students will have the opportunity to talk directly with
the industry panelists and other leaders. All IMAPS student members are invited. The student-industry panel
and reception will also be in Room 201 on Tuesday,
Nov. 2nd, 4:30 - 5:30 pm.
Insight at Student Research Poster (IMAPS 2008)
Student Booth Competition
Highlight your research and academic programs at student chapter booths and gain advice & recognition from
industry leaders. Student booths will be evaluated by a
panel of judges on various criteria. Winning chapter
booths will receive cash prizes, certificates, and magazine recognition. Booth space is complimentary for
IMAPS student chapters. Booth judging will be in the
Exhibit Hall on Tuesday, Nov. 2nd, 1:30 - 3:00 pm.
Team Pride at a Student Booth (IMAPS 2008)
Student Tour: DuPont Microcircuit Material Headquarters
Students have the opportunity to both tour the DuPont
Microelectronics facility and to interact with senior engineers and scientists during informative briefings. Students will learn first-hand how technologies are advancing photovoltaics, biosensors, automotive, consumer
electronics, and avionics. The tour will be Wednesday morning, Nov. 3rd from 8:30 to 11:45 am. Participants must meet at the main entrance of the Convention Center at 8:15 am sharp to board the shuttle.
Technical Demo at Cisco Tour (IMAPS 2009)
Things to do in Raleigh . . .
We have identified a number of interesting excursions targeted for friends and family during your
trip to Raleigh. Spend a few hours on a culinary tour sampling North Carolina’s famous barbeque;
take a Segway tour through historic Oakwood; or hop on a Raleigh Rickshaw for a spin around
town.
Information on these, and other adventures, can be found online at:
http://www.imaps.org/imaps2010/todo.htm
PLEASE NOTE
All tours run independently. IMAPS does not manage any tours this year.
You must register separately for each tour. These are suggestions only.
Additional ideas are available through the Raleigh Convention & Visitors Bureau, online at:
http://www.visitraleigh.com/visitors/things_to_do/
41
JOBS MarketPlace – New Positions Just Added!
IMAPS members can post unlimited job and internship openings at no cost. Hiring managers can
view posted resumes by using convenient sort criteria.
IMAPS member job seekers can post resumes and/or search for current openings at no cost. Job
seekers can make their search even easier by using job alerts so compatible job openings will be emailed when posted.
There are many ways to use the JOBS MarketPlace.
Try it out today at http://jobs.imaps.org/home/index.cfm?site_id=117.
Wireless Access in the Exhibit Hall
Presidential
Sponsor
www.metalor.com
Metalor is pleased to bring you wireless access in the IMAPS 2010 Exhibit
Hall. Metalor feels that this access is necessary for companies that have
taken the time to exhibit, but need to be able to conduct business while
doing booth duty. Please join us in thanking Metalor for bringing wireless
to you at IMAPS 2010.
Sponsored by:
www.metalor.com
imaps 2010
16th Annual IMAPS Golf Classic
to benefit
The IMAPS Microelectronics Foundation
Monday, November 1, 2010
Lonnie Poole Golf Course
http://lonniepoolegolfcourse.com
Centennial Campus
North Carolina State University
42
The IMAPS Microelectronics Foundation golf tournament will be held at the Lonnie Poole Golf Course
on the campus of North Carolina State University. This championship course designed by Arnold Palmer
opened to the public in 2009. The Arnold Palmer Design group used features in the existing landscape
as the primary cues for their design. It’s 15 minutes in proximity to downtown Raleigh and natural
elevations allow outstanding vistas during play.
Cost is $125 per person.
$550 for a team of four; $950 for a team of four including a hole sponsorship.
$1050 for a team of four including 1 special hole sponsorship.
The cost includes: Transportation to and from the course, tournament package and lunch.
PLEASE NOTE: Appropriate golf attire is required.
Shuttle departs the Marriott Hotel at 6:30 am, and departs the Golf Course at 1:30 pm.
Breakfast on your own.
Golf Holes
sponsored by:
www.technic.com
Golf Hole and Luncheon
sponsored by:
www.lord.com
Casino
Night
at
IMAPS 2010
to benefit The Microelectronics Foundation
43
Date: Tuesday, November 2, 2010
Time: 7:30 pm – 10:30 pm
Location: Room 402 Raleigh Convention Center
Event:
Black Jack U Poker U Craps, Roulette
Silent Auction
Refreshments U No Host Bar
Tickets $50
Limited to 70 players
Advance tickets available at
http://www.microelectronicsfoundation.org/imaps2010.html
Tickets available on-site at Registration Desk
Sponsorship Opportunities:
$500 table sponsor
$600 Golf Tournament Hole and Table Sponsor
Exhibit Hall Map
44
exhibitors
3D Systems Packaging Research
Center at Georgia Tech
Booth #: 512
813 Ferst Drive NW
Atlanta, GA 30332
Ph: (404) 894-9097
patricia.allen@ece.gatech.edu
http://www.prc.gatech.edu
A global Academic Center dedicated to
leading-edge research and education in
the System-on-a-Package (SOP)
concept to enable highly miniaturized
systems by working with Industry, and
PRC research staff, faculty and
students. The PRC offers various
industry research partnerships: one-onone contracts, thematic consortia
programs, and UnITE PAC; a global
network connecting Industry and
Academia.
AdTech Ceramics
Booth #: 812
511 Manufacturers Road
Chattanooga, TN 37405
Ph: (423) 755-5510
brian.bukovitz@adtechceramics.com
http://www.adtechceramics.com
AdTech Ceramics produces custom
HTCC, AlN and metal microelectronic
packaging, ceramic injection molded
products, and etched metal for medical,
military and high reliability industrial
applications. ISO 9001:2008 certified.
Advance Reproductions Corp.
Booth #: 420
100 Flagship Drive
North Andover, MA 01845
Ph: (978) 685-2911
stevea@advancerepro.com
http://www.advancerepro.com
Laserwritten Glass Photomasks coated
with chrome, iron oxide or emulsion on
sizes from 2.5" up to 32" square for all
of your Photomasking needs.
Conversion and Digitizing Services
available, along with high-precision
Photoplots utilizing 1/4, 1/8th or 1/40th
mil resolution with film sizes up to 32"
x 36".
Advanced Cooling Technologies
Booth #: 410
1046 New Holland Avenue
Lancaster, PA 17601
Ph: (717) 295-6109
scott.garner@1-act.com
http://www.1-act.com
AI Technology, Inc.
Booth #: 504
70 Washington Road
Princeton Junction, NJ 08550-1012
Ph: (609) 799-9388
ramigh@aitechnology.com
http://www.aitechnology.com
as of October 8, 2010
Air-Vac Engineering Company
Booth #: 313
30 Progress Avenue
Seymour, CT 06483
Ph: (203) 888-9900
howard.lasto@air-vac-eng.com
http://www.air-vac-eng.com
Atotech USA, Inc.
Booth #: 710
1750 Overview Drive
Rock Hill, SC 29730
Ph: (803) 326-3443
hugh.roberts@atotech.com
http://www.atotech.com
All Flex Flexible Circuits
Booth #: 413
1705 Cannon Lane
Northfield, MN 55057
Ph: (507) 663-7162
information@allflexinc.com
http://www.allflexinc.com
Atotech is one of the world’s leading
suppliers of integrated production
systems, process chemistry and
technical support for the manufacture
of package substrates and printed
wiring boards, as well as process
solutions for advanced wafer
metallization from die interconnects to
wafer level packaging technologies.
With more than 3,200 employees,
Atotech serves its customers globally
with 16 production plants, 16 technical
centers and 40 service centers located
in 40 countries.
Flexible
circuit
and
heater
manufacturer specializing in quickturn
and production volumes. All Flex
circuits are highly reliable, their
flexibility eases installation making
them ideal for today’s compact package
constraints. Produces single-sided,
double-sided, multi-layer flexible
circuits, and maxi-flex®. Provides
complete component assembly. Serves
military, aerospace, medical, industrial,
and instrumentation markets. AS9100/
ISO 9001:2008, Mil P50884E, ITAR.
ALLVIA, Inc.
Booth #: 605
657 N. Pastoria Ave.
Sunnyvale, CA 94085
Ph: (408) 212-3200
info@allvia.com
http://www.allvis.com
ALLVIA (Sunnyvale, CA), the
recognized leader in TSVs, provides
custom TSV, Interposer, DRIE, Plating,
CU Pillar and Assembly Services.
Custom design and fabrication services
are provided by a highly skilled
technical staff.
AMICRA Microtechnologies
GmbH
Booth #: 212
Wernerwerkstr. 4
D-93049 Regensburg
Germany
Ph: +49- 941-208209 0
johann.weinhaendler@amicra.com
http://www.amicra.com
AMICRA is a leading supplier of High
Accuracy Die/Flip-Chip Bonders. The
existing AFC systems are designed for
WLP, TSV, DtD, 3D-IC applications
down to +/- 0.5µm@3sigma. With a
specification < +/-3µm@3 sigma in 3
seconds, the new NOVAPlus system
offers high speed and high accuracy in
one system.
Batten & Allen
Booth #: 722
308 Jesse St.
Philipburg, PA 16866
Ph: (814) 342-1599
ekolbe@pennswoods.net
http://www.batten-allen.com
Besi
Booth #: 320
33 East Comstock Drive, Suite 7
Chandler, AZ 85225
Ph: (408) 497-6404
sales@besi.com
http://www.besi.com
Besi’s 2200 evo Multichip Die Bonder
suits your laboratory development and
high-volume production needs
perfectly. With a placement accuracy
of ± 7um @ 3 Sigma and a throughput
of up to 7,000 chips per hour the 2200
evo sets new standards for versatile
equipment, usable for many different
multichip applications like hybrid,
stacked die, SIP/CMOS or thin dies.
Brewer Science
Booth #: 433
2401 Brewer Drive
Rolla, MO 65401
Ph: (573) 364-0300
dbrown@brewerscience.com
http://www.brewerscience.com
Brewer Science delivers innovative
process technologies, material
solutions, and equipment for
applications in advanced packaging,
MEMS, LED/Energy, Semiconductor,
Compound
Semiconductor,
Nanotechnology, and Optoelectronics.
Products include WaferBOND®
bonding materials, ZoneBOND™
systems, ProTEK® coating, ARC®
anti-reflective coatings, OptiNDEX™
high refractive index materials,
OptiStack® multilayer lithography
systems, and Cee® processing
equipment.
CAD Design Software, Inc.
Booth #: 318
2975 Bowers Avenue
Suite 315
Santa Clara, CA 95051
Ph: (408) 436-1340
johns@cad-design.com
http://www.cad-design.com
CAD Design Software (CDS) standard
and customizable circuit design
software suites provide Electronic
Design Automation layout solutions to
meet unique design technology needs
and reduce time-to-market. CDS’ EDA
Layout/DFM solutions include Digital
/ Analog / Flex PCBs, Ceramic Hybrids,
RF / Microwave, IC Packaging, IC Test
and
Custom
Development
Applications.
Chip Supply, Inc.
Booth #: 510
7725 N. Orange Blossom Trail
Orlando, FL 32810-2696
Ph: (407) 298-7100
bwolfe@chipsupply.com
http://www.chipsupply.com
A global provider of semiconductor die
and specialized packaging solutions,
we are Thinking Beyond Silicon™ to
meet the needs of military, medical, and
hi-rel customers. Offering a complete
range of interconnect solutions,
spanning bare die and wafer
processing,
complementary
engineering and test services, custom
packaging via SiliconPlus™, and
obsolescence management.
Cicor
Booth #: 226
WTC, Leutschenbachstrasse 95
8050 Zurich Switzerland
Ph: +41 43-8114408
stampanoni@cicor.ch
http://www.cicor.com
Cicor Printed Circuit Boards is known
for its comprehensive expertise in
multilayer boards, flex, rigid-flex and
rigid high density interconnects, and
reel-to-reel technology. We develop
and produce effective solutions – from
the idea, through prototypes, to largeseries production, from standard jobs
to highly complex challenges. Crossdivisional cooperation within the Cicor
Group ensures that know-how and
technology are kept at the cutting edge.
45
exhibitors
Coining, Inc.
Booth #: 708
280 N. Midland Ave.
Saddle Brook, NJ 07663
Ph: 201-791-4020
jscelzo@coininginc.com
http://www.coininginc.com
Manufacturer & global supplier of quality preforms and bonding wire for lowhigh temp soldering/brazing. Highly
pure alloys of gold, silver, lead, tin, indium, bismuth, palladium, aluminum.
Lead-free RoHS. Copper, Kovar® &
molybdenum, clad, plated stampings.
Flux coating. Tape & reel, custom packaging. **New Cover Assemblies (preform/lid). Extensive tooling library,
standard & custom designs. Quick turnaround. Request our CD alloy/tool lists.
46
Colt Refining, Inc.
Booth #: 732
12 A Star Drive
Merrimack, NH 03054
Ph: (603) 429-9966
jarsenault@coltrefining.com
http://www.coltrefining.com
Colt Refining, a forerunner in precious
metal refining continues to invest in
leading-edge technology including
Thermal-Oxidation, Induction Melting,
Milling, Sifting, Blending, Chemical
Stripping and Solution Recovery to
service the Micro-Electronic and
related industries for all your recovery
needs. See the History Channel
Documentary of the company by going
to www.coltrefining.com.
Co-Planar, Inc.
Booth #: 803
P. O. Box 1115
Denville, NJ 7834
Ph: (973) 625-3500
tmcclellan@co-planar.com
http://www.co-planar.com
Co-planar is a Precision Metal & Mylar
Stamping Company servicing the
Automotive, Connector, Electronics,
Insert Molding, Medical, &
Semiconductor Industries. WE MAKE
THE PARTS THAT MAKE THE
DIFFERENCE!
CPS Technologies Corporation
Booth #: 321
111 South Worcester Street
Norton, MA 02766 USA
Ph: (508) 222-0614
bsullivan@alsic.com
http://www.alsic.com
CPS Technologies Corporation is the
worldwide leader in the design and
high-volume production of AlSiC
(aluminum silicon carbide) for high
thermal conductivity and device
compatible thermal expansion. AlSiC
thermal management components
manufactured by CPS include Hermetic
electronic packages, Heat sinks,
Microprocessor & Flip chip heat
spreader lids, Thermal substrates, IGBT
base plates, Cooler baseplates, Pin Fin
baseplates for Hybrid Electric Vehicles
(HEV), Microwave & Optoelectronic
Housings and System in Package (SiP)
Heat Spreader Lids that address
multiple ICs on a PCB with a single lid
design.
Crane Aerospace and Electronics
Booth #: 622
10301 Willows Road NE
Redmond, WA 98052
Ph: (425) 882-3100
electronics@craneae.com
http://www.craneae.com/microelec
Crane Aerospace & Electronics,
Microelectronics Solutions, is a major
supplier of systems and components
found in some of the toughest
environments, from aircraft engines
and landing gear to space satellites and
medical implants. Our product and test
system development capabilities
complement the expertise and
experience gained in over 40 years of
manufacturing.
Cyber Technologies
Booth #: 429
962 Terra Bella Avenue
San Jose, CA 95125
Ph: (408) 689-8144
karlheinz.strass@cybertechnologies.com
http://www.cybertechnologies.com
Cyber Technologies is the leading
provider of standalone and fully
integrated high resolution 3D Optical
Metrology Systems for non-destructive
process control of film thickness,
surface topography and quality
inspection of MEMS, Solar Cells, Fuel
Cells, Lenses, Printed Products, Device
Packages and many other Devices.
Our systems reliably measure on
absorbent, highly reflective, soft or
transparent materials with high vertical
and lateral resolution even over large
areas of interest. Our customers take
advantage of the systems’ automation
capabilities, high speed, accuracy and
comprehensive parametric capabilities
in R&D and production in industries
as varied as MEMS, automotive,
medical devices, semiconductors, solar,
hybrid, pharmaceutical as well as optics
manufacturing.
Disco Hi-Tech America
Booth #: 431
3000 Aerial Center Executive Park
Suite 180
Morrisville, NC 27560
Ph: (919) 468-6003
yone@discousa.com
http://www.discousa.com
features extremely clean burnout
leaving negligible residue after
decomposition. It decomposes at very
low temperatures and in all
atmospheres. It has excellent green
strength and processibility. Product
available in solids, solutions and water
based.
Laser, Dicing, Grinding and Polishing
applications.
Endicott Interconnect
Technologies, Inc.
Booth #: 712
1093 Clark Street
Endicott, NY 13760
Ph: (607) 755-1847
theresa.taro@eitny.com
http://www.endicottinterconnect.com
DuPont Electronics and
Communications
Booth #: 623
14 T.W. Alexander Drive
Research Triangle Park, NC 27709
Ph: (800) 242-3382 ext. 5755
mcmcustomerservice@usa.dupont.com
http://www.mcm.dupont.com
DuPont Microcircuit Materials has over
40 years of experience in the
development, manufacture, sale, and
support of specialized thick film
compositions for a wide variety of
electronic applications in the
photovoltaic, display, automotive,
biomedical, industrial, military, and
telecommunications markets. For more
information on DuPont Microcircuit
Materials and Solamet® metallization
pastes,
please
visit
http://
mcm.dupont.com.
ECRIM
Booth #: 810
1011 River Mist Drive
Rochester, MI 48307
Ph: (248) 462-2712
twang@blueoceansllc.com
h t t p : / / w w w. b l u e o c e a n s l l c . c o m
ECRIM has over 40 years experience
in R&D and manufacturing
microelectronic products and its metal
packages. Our products are well
recognized by our customers for their
technical strength, proven product
reliability, innovative solutions, quick
response, competitive price and overall
value. We have obtained ISO9000 and
ISO14001 certificates and are
compliance to world-class processes.
Our product lines include HIC,
Hermetic Metal Package, LTCC, AlN,
Thick Film, Thin Film and Industrial
Furnaces.
Empower Materials
Booth #: 523
91 Lukens Drive
New Castle, DE 19720
Ph: (302) 225-0100
peterferraro@empowermaterials.com
http://www.empowermaterials.com
Empower Materials manufactures and
sells QPAC Polyalkylene carbonate
sacrificial binders worldwide. QPAC
Epoxy Technology, Inc.
Booth #: 522
14 Fortune Dr.
Billerica, MA 01821-3972
Ph: (978) 667-3805
jmccabe@epotek.com
http://www.epotek.com
Epoxy Technology is a Global
Manufacturer and Custom Formulator
of Epoxy Adhesives. EPO-TEK
Specializes in Adhesives for Circuit
Assembly, Die Attach, LED, Solar,
Optoelectronic, Hard Drive, Display,
Automotive Electronics, Medical
Electronics, and Military/Aerospace
Applications. ISO 9001 Certified.
RoHS and REACH Compliant.
www.EPOTEK.com
ES Components, Inc.
Booth #: 222
108 Pratts Junction Road
Sterling, MA 01564
Ph: (978) 432-7641
rgrigalunas@escomponents.com
http://www.escomponents.com
Bare Die Distributor providing Bare
Die, Wafer, Die Form Parts, and
Package Devices to the Hybrid,
Military and OEM markets.
ESL ElectroScience
Booth #: 619
416 East Church Road
King of Prussia, PA 19406-2625
Ph: (610) 272-8000
dchambers@ElectroScience.com
h t t p : / / w w w. E l e c t r o S c i e n c e . c o m
ESL ElectroScience specializes in
providing solutions to enable customers
to take technologies from concept
through high volume production. As a
global supplier of customized thick film
pastes and ceramic tapes, ESL products
can be found in hybrid microcircuits,
multilayer
microelectronics,
transformers, TF heaters, photovoltaic
cells, sensors, and fuel cells.
as of October 8, 2010
F & K Delvotec, Inc.
Booth #: 200
27182 Burbank St.
Foothill Ranch, CA 92610
Ph: (949) 595-2200
kris.nelson@fkdelvotecusa.com
h t t p : / / w w w. f k d e l v o t e c u s a . c o m
As VLSI’s number one rated wire bond
equipment vendor for 2009 and 2010,
we offer unmatched technology
leadership and unmatched customer
service on our entire product line of
CONVERTIBLE Auto and Semi-Auto
wire bonders. We have a Model for
every wire bonding technology. Heavy
Wire, Heavy Ribbon, Fine Wire, Fine
Ribbon, Ball Bonding, TAB, Deep
Access, Hybrids, COB, RF Devices,
Microwave Applications. Our
convertible bonders offer 3 MINUTE
quick change bond heads with no hand
tools required. What about an auto
bonder that converts to an auto pull/
shear tester in 3 minutes. We also offer
Ultrasonic/Transducer test equipment
and a NEW Auto Die bonder is coming
in 2011. Come visit the number one
rated wire bond equipment supplier to
learn more.
Ferro Corporation
Booth #: 506
4150 East 56th Street
Cleveland, OH 44105
Ph: (216) 641-8580
stadnicare@ferro.com
http://www.ferro.com
Ferro’s Electronic Packaging Materials/
Multilayer Materials business provides
materials and engineered products for
hybrid circuits, microelectronics,
advanced packaging, and devices. Our
product line includes high-purity glass
frit and powders and ceramic powders
for electronic components. We also
supply thick film products for hybrid
microelectronics, photovoltaics, surge
resistors, displays, MEMS, and
packages.
Finetech, Inc.
Booth #: 706
8380 S. Kyrene Rd.
Ste. 110
Tempe, AZ 85284
Ph: (480) 893-1630
sales@finetechusa.com
http://www.finetechusa.com
Precision bonders with placement
accuracy of 0.5 micron. Machine
modularity enables a full spectrum of
bonding processes within one platform
… thermo-compression, thermo-sonic,
eutectic, epoxy, ACF and Indium
bonding, and sensitive materials (i.e.,
GaAs/GaP). The bonders support the
highest-accuracy applications: MEMS,
sensors, laser bars & diodes, photonics
packaging, VCSELs, flip chips.
Geib Refining Corporation
Booth #: 518
399 Kilvert Street
Warwick, RI 02886
Ph: (800) 228-4653
mike@geibrefining.com
http://www.geibrefining.com
Precious metal reclaim of gold,
platinum, palladium, silver, rhodium,
ruthenium, and iridium. We process all
of your materials on our 8 acre site in
Warwick, RI. 100% destruction means
no wondering where you scrap goes...
we are also ITAR registered and
compliant which ensures your sensitive
parts are fully destroyed on our
property. We are EPA Compliant and
are in good standing with all federal and
state regulatory agencies. Don’t risk
your environmental exposure, choose
a proven IMAPS vendor; choose Geib
Refining Corp.
Haiku Tech, Inc.
Booth #: 427
1669 NW 79 Ave.
Miami, FL 33126
Ph: (305) 463-9304
mdemoya@haikutech.com
http://www.haikutech.com
Haiku Tech specializes in materials,
equipment and solutions for the
manufacturing of electronic passive
components, including: Dielectric
powders, binders, tape casters, sheet
blankers, mechanical punches, screen
printers, stackers, isostatic laminators,
chip dicers, termination equipment,
LTCC zero shrinkage sintering presses,
tape and reel, optical dilatometers and
visual inspection equipment.
Harrop Industries, Inc.
Booth #: 409
3470 E. 5th Ave.
Columbus, OH 43219-1797
Ph: (614) 231-3621
pjtimmel@harropusa.com
http://www.harropusa.com
Harrop designs and manufactures a
complete line of periodic and
continuous equipment, including tape
casters, dryers, burn-off ovens, infrared
conveyor ovens, and kilns to produce
ceramic products. Heat sources can be
electric or gas. Microwave-assist
heating is available. Also offer thermal
analysis laboratory services and toll
firing services.
Hary Manufacturing Inc.
Booth #: 211
PO Box 187
Woodbridge, NJ 07095
Ph: (908) 722-7100
paulh@hmiprinters.com
http://www.hmiprinters.com
Heraeus Thick Film Division
Booth #: 703
24 Union Hill Road
West Conshohocken, PA 19428
Ph: (610) 825-6050
yin.yin@heraeus.com
http://www.thickfilm.net
HMI is a successor to Affiliated
Manufacturers, Inc. (AMI). HMI
manufactures Precision Screen
Printers, Automated Printing Systems,
Infrared Dryers, and Vision Alignment
Systems. HMI provides high quality
squeegees, “Shami” screen cleaning
cloths and will provide support for
existing AMI-Presco equipment. HMI
equipment is used for production of
thick film circuits, solar cells, and other
applications requiring precision
deposition.
Heraeus Materials Technology LLC,
Thick Film Division is a worldwide
supplier of thick film pastes, LTCC
materials and precious metal powders
to the hybrid microelectronics industry.
Featured this year are new products
from the cermet paste business from
LORD Corporation. We are also
featuring our material set for thermal
management applications, such as LED
lighting and heater applications. Our
precious metal powders and our RoHS
compliant and completely Pb/Cd free
thick film pastes designed for meeting
the expected high performance
standards of thick film technology
while meeting current environmental
regulations.
HEI, Inc.
Booth #: 422
610 S. Rockford Dr.
Tempe, AZ 85281
Ph: (480) 208-2476
tim.craumer@heii.com
http://www.heii.com
HEI, Inc. is an ITAR Registered, FDA
Registered Contract Manufacturer
specializing
in
Electronic
Manufacturing Services (EMS),
including Microelectronic and UltraMiniaturized Assembly, and HighDensity Interconnect Flex / Rigid /
Rigid-Flex / Ceramic Substrate
Manufacturing. HEI supports complete
product life-cycle, from Concept - to Rapid Prototyping - to - Production.
Henkel Corporation
Booth #: 405
14000 Jamboree Rd.
Irvine, CA 92606
Ph: (714) 368-8003
aida.nasr@us.henkel.com
http://www.henkelna.com/electronics
Henkel’s leading brands of Acheson™,
Hysol®, Loctite® and Multicore® have
long been recognized as the product
brands to trust for printed circuit board
assembly applications. With a broad
portfolio of materials including surface
mount adhesives, advanced flux
chemistries, traditional tin-lead and
high performance lead-free solder
solutions as well as CSP underfills and
board protection materials, Henkel’s
advanced formulations ensure
maximum processability and reliable
in-field performance.
Hesse & Knipps, Inc.
Booth #: 509
2305 Paragon Drive
San Jose, CA 95131
Ph: (408) 436-9300
info@hesse-knipps.us
http://www.hesse-knipps.us
High speed fine pitch wedge bonders
and heavy wire bonders handle light
and heavy wire applications with
aluminum and gold round wire from
12.5 micron to 500 micron diameter,
plus ribbon wire from 6 x 35 microns
up to .3 x 2 mm, including HCR™
(High Current Ribbon).
High Connection Density, Inc.
Booth #: 818
820A Kifer Road
Sunnyvale, CA 94086
Ph: (408) 743-9700
sales@hcdcorp.com
http://www.hcdcorp.com
High Connection Density, Inc. (HCD)
provides board-to-board, flex-to-board,
and package-to-board solderless
connectors for BGA, LGA and socket
applications. HCD’s patented
SuperButton® and SuperSpring®
technology-based products are the
perfect solution for applications
requiring high frequency, high current
and low resistance. Designed for
manufacturability, HCD offers
innovative technology at competitive
prices. Our proprietary technology
provides you a competitive advantage.
47
exhibitors
48
Hi-Rel Laboratories, Inc
Booth #: 621
6116 N. Freya
Spokane, WA 99217
Ph: (509) 325-5800
roger@hrlabs.com
http://www.hrlabs.com
Infinite Graphics, Inc.
Booth #: 726
4611 East Lake Street
Minneapolis, MN 55406
Ph: (612) 721-6283
pmaitland@igi.com
http://www.igi.com
Hi-Rel
Laboratories
is
an
independently owned and operated
corporation. Our field is the materials
evaluation of the micro-electronic
phases of commercial industry,
aerospace and defense. Expertise in
Destructive Physical Analysis, Failure
Analysis, and Materials Analysis of
electronic components, packaging,
interconnections and circuitry, makes
Hi-Rel the leader in these areas.
IGI provides eXtended Life
Photomasks, reticles, custom precision
imaging and imaging software. Large
area 3D sculptured photoresist, shims
and molds, and inserts are an IGI
expertise. IGI’s new photomask
ordering software eliminates errors by
allowing you to view your phototool,
with modifications, as you are ordering.
Most data input and output formats are
available. IGI also provides custom
software for unique applications.
IBM Servers Group
Booth #: 809
3909 Cornwallis Rd.
B/205 D/FQ2A Office HH118
Research Triangle Park, NC 27709
Ph: (919) 543-4090
archibam@us.ibm.com
http://www.ibm.com
The System x Server Development
Power, Packaging, and Cooling teams
develop systems and technologies that
drive efficiency into handling clients’
mission critical workloads. IBM Lab
Services Data Center Services provides
services that optimize system
utilization and maximize energy
efficiency.
Indium Corporation
Booth #: 415
34 Robinson Rd.
Clinton, NY 13323
Ph: (315) 853-4900
abrown@indium.com
http://www.indium.com
Indium Corporation is a premier
materials supplier to the global
electronics, semiconductor, solar, thin
film and thermal management markets.
Products include: solders, preforms,
and fluxes; brazes; sputter targets;
indium, gallium, and germanium
chemicals and sourcing; and Reactive
NanoFoil®. Founded in 1934, Indium
has global technical support and
factories located in China, Singapore,
South Korea, the United Kingdom,
and the USA.
Interconnect Systems, Inc.
Booth #: 408
759 Flynn Road
Camarillo, CA 93010
Ph: (805) 482-2870
Dennis.Brondi@isipkg.com
http://www.isipkg.com
Interconnect Systems Incorporated
designs and manufactures multicomponent modules, bare-die
packages,
high-performance
connectors, high density memory
modules, and footprint conversion
adapters including IC obsolescence
solutions and BGA fan-out interposers.
Services include BGA reballing. ISI is
ITAR registered and certified to
ISO9001:2008.
Interplex Engineered Products, Inc.
Booth #: 730
231 Ferris Avenue
East Providence, RI 02916
Ph: (410) 575-2354
domenic.federici@us.interplex.com
http://www.interplex.com/IEP
Interplex Engineered Products (IEP)
and Interplex Quantum Leap Packaging
(IQLP)–Thermoplastic Packages and
Housings-Application specific, opencavity, leadframe based, hermetic/nearhermetic, using standard and
proprietary high-performance polymers
(Quantech), including compliant,
Press-fit technology. Vertically
integrated: product design, metal
stamping, continuous etching,
continuous selective wire bondable
electro-plating, reel-to-reel insert
molding, and in-house tooling.
Kyocera America, Inc.
Booth #: 311
8611 Balboa Avenue
San Diego, CA 92123
Ph: (858) 614-2592
iris.labadie@kyocera.com
http://www.kyocera.com/kai/
semiparts
Kyocera America, Inc. (KAI) has been
manufacturing ceramic packages in
San Diego, CA since 1971. KAI offers
an extensive array of semiconductor
packages and complex modules for
numerous applications including RF,
millimeter wave, high-reliability,
phased
array
radar,
and
telecommunications. Packages are
available in HTCC, LTCC, alumina,
BeO, and organic materials. KAI has
state-of-the-art package design
capability in-house that includes
electrical and thermo-mechanical
design, modeling / simulation and
analysis to maximize package and
circuit performance in your application.
Our Assembly Technology Division
accepts prototype to volume production
orders for flip chip, wirebond, wafer
dicing and vacuum soldering to provide
a convenient one-stop-shop solution for
customers.
Kyzen Corporation
Booth #: 315
430 Harding Industrial Drive
Nashville, TN 37211
Ph: (615) 983-4542
contact_us@kyzen.com
http://www.kyzen.com
Kyzen Corporation provides integrated
precision cleaning solutions for
semiconductor, microelectronics, SMT,
and hybrid applications. We offer a
broad range of process solutions
ranging from hand wipes and sprayable
aqueous chemistries to azeotropic
vapor degreasing solvents. Our goal is
to partner with our customers and
provide integrated cleaning solutions.
Lambda Technologies, Inc.
Booth #: 823
860 Aviation Pkwy., # 900
Morrisville, NC 27560
Ph: (919) 462-1919
bschauer@microcure.com
www.microcure.com
Lambda develops and markets
industrial process tools that incorporate
unique and proprietary techniques to
ensure optimum control and delivery of
microwave energy for both thermal and
plasma process requirements. For
example, our Variable Frequency
Microwave (VFM) products are used
worldwide for curing adhesives and
polymer coatings as well as for
annealing dopants and other layers on
Si wafers within the semiconductor
industry and Lambda’s plasma products
offer the state-of-the-art for Microwave
Plasma CVD of polycrystalline films
and single crystal diamond.
Laser Tech, Inc.
Booth #: 411
1134 East Pine St.
St. Croix Falls, WI 54024-9002
Ph: (715) 483-1636
lwhitman@laser-tech-inc.com
http://www.laser-tech-inc.com
Laser Tech, Inc. is a long recognized
expert in the laser machining of
alumina substrates for the microelectronics industry. Laser Tech, Inc.
specializes in high-density micro via
drilling, and the machining of large area
ceramic substrates up to 14" by 14".
Visit us at “www.laser-tech-inc.com” or
contact Larry Whitman @ 715-4831636 for questions and quotes!
LORD Corporation
Booth #: 414
111 Lord Drive
Cary, NC 27511
Ph: (877) 275-5673
Customer.support@lord.com
http://www.lord.com
For 40+ years, LORD Corporation has
created solutions for your most
demanding challenges from potting and
encapsulants to semiconductor
packaging/circuit assembly materials to
thermal management and conductives.
Our expertise in multiple chemistries
and diverse applications allows us to
develop solutions that ensure success.
We can help … Ask Us How.
Metallix Refining, Inc.
Booth #: 219
59 Avenue At The Commons
Suite 201
Shrewsbury, NJ 07702
Ph: 800-327-7938
susanm@metallixrefining.com
http://www.metallixrefining.com
Metallix is a buyer and recycler of
precious metals (Gold, Silver, Platinum,
Palladium, Rhodium) bearing scrap
materials. Our state-of-the-art, precious
metal recycling facility is located in
Greenville, NC. Our precious metals
recycling processes were designed to
produce maximum value from your
scrap materials. Additionally our
attention paid to Environmental,
Health, and Safety issues makes
Metallix the likely choice for your
precious metal recycling needs. For
more in-depth information, please visit
as of October 8, 2010
our website and view our corporate video
at <http://www.metallixrefining.com/
english/corporatevideo.html>
Micro Hybrid Dimensions, Inc.
Booth #: 304
2161 E. 5th Street
Tempe, AZ 85281-3035
Ph: (480) 731-3131
greg@micro-hybrid.com
http://www.micro-hybrid.com
Microcertec
Booth #: 822
47 Allee Du Clos Des Charmes
Collegien, 77090
France
Ph: +33 1 60 06 66 73
alain.charbonnier@microcertec.com
http://www.microcertec.com
Customized ceramic components,
substrates & heat sinks. Thin-film
metallised ceramics. 3D ceramic
interconnection devices. Glass-to-metal
assemblies & packages, ceramic-tometal brazed assemblies.
Micropac Industries, Inc.
Booth #: 633
905 East Walnut Street
PO Box 469017
Garland, TX 75040
Ph: (972) 272-3671
dlindemann@micropac.com
http://www.micropac.com
Micropac has provided microelectronic
components and modules along with
next level board assembly services to
the Hi Rel market place for over 40
years. Products and capabilities
include MIL-PRF-38534 and MILPRF-19500 qualified designs of MCMs
and components, Solid State Relays,
Solid State Power Controllers,
Optocouplers, LEDs, LED Displays,
and Power Op Amps.
MicroScreen LLC
Booth #: 603
1106 South High Street
South Bend, IN 46601
Ph: (574) 232-4358
kathyj@microscreen.org
http://www.microscreen.org
Type HT High Tension screens for
printing thick film circuits, solar cells,
membrane switch assemblies, etc. Fine
line emulsions applied with PCL
controlled coating machines. Complete
facility including photo lab. Stencils for
printing solder paste. We are an ITAR
Registered company.
Micross Components Corp.
Booth #: 711
22 Just Road
Fairfield, NJ 07004
Ph: (973) 227-8007
eileen.vlouhos@micross.com
http://www.micross.com
innovative thermally conductive
adhesives and sealing glasses.
Headquartered in Niigata, Japan with
subsidiaries in the USA, Europe,
Singapore and China, NAMICS serves
its worldwide customers with enabling
products for leading edge applications.
ISO 9001:2000 certified distributor of
semiconductor die and passive
components in chip form. We also offer
value added services to customer specs
and military standards. We are an
acknowledged leader in customer
service.
nanosystec, GmbH
Booth #: 607
Marie-Curie-Str. 6
Gross-Umstadt, Hesse 64823
Germany
Ph: 49 6078 782540
christiane.hummelt@nanosystec.net
http://www.nanosystec.net
Minco Technology Labs, Inc.
Booth #: 814
1895 Rutherford Lane
Austin, TX 78754
Ph: (512) 339-3474
kristi.cooper@mincotech.com
http://www.mincotech.com
Leading Manufacturer of Mission
Critical
High
Reliability
Semiconductors & Wafer/ Die
Processing, Serving the Primary Market
and Aftermarket. DSCC Certified/ISO
9001:2008/AS9100.
Mini-Systems, Inc.
Booth #: 613
20 David Road
North Attleboro, MA 02760
Ph: (508) 695-0203
ctourgee@mini-systemsinc.com
http://www.mini-systems.biz
MORGaN
Booth #: 205
www.morganproject.eu
bmusk@goochandhousego.com
klas.brinkfeldt@swerea.se
Mundt & Associates, Inc.
Booth #: 323
14682 N. 74th St., #150
Scottsdale, AZ 85260
Ph: (480) 922-9365
mundtinc@mundtinc.com
http://www.mundtinc.com
The product portfolio consists of:
NanoWeld is a powerful alignment and
welding system for optoelectronic
devices. NanoRapid is a high speed
selective laser soldering system, fast
enough to be integrated in production
lines. NanoTest is ideal to determine the
performance of active components on
chip and chip on Submount level.
Natel Engineering Co., Inc.
Booth #: 503
9340 Owensmouth Ave.
Chatsworth, CA 91311-6915
Ph: (818) 734-6500
jima@natelengr.com
http://www.natelengr.com
Natel Engineering is a Vertically
Integrated,
“One-Stop
Shop”
Electronics Manufacturing Company–
From Substrates to Box Assembly and
everything in between.
Newport Corporation
Booth #: 521
101 Billerica Ave, Bldg 3
North Billerica, MA 01862-1256
Ph: (978) 667-9449
dan.crowley@newport.com
http://www.newport.com
Manufacturers of Precision Die Bonding - Dispense and Laser Based Solutions.
NAMICS Corporation
Booth #: 615
2055 Gateway Place, Suite 480
San Jose, CA 95110
Ph: (408) 515-4611
sales@namics-usa.com
http://www.namics.co.jp
NorCom Systems, Inc.
Booth #: 502
1055 West Germantown Pike
Norristown, PA 19403
Ph: (610) 592-0167
caubertin@norcomsystemsinc.com
http://www.norcomsystemsinc.com
NAMICS CORPORATION is a leading
source for underfills, encapsulants,
adhesives, and insulating and
conductive materials used by producers
of semiconductor devices, passive
components and solar cells. NAMICS
subsidiary, DIEMAT, Inc. located in
Byfield, MA, specializes in the
development and manufacture of
NorCom Systems, Inc. manufactures
the NorCom 2020 advanced optical
leak test system for hermetically sealed
packages. The NorCom 2020 provides
automated, in-line, full matrix gross
and fine leak testing performed
simultaneously
with
direct
measurement of package leak rates in
cc-atm/sec. Package types include
MEMS, PC board-mounted devices,
Hybrids, crystal oscillators, and Hi-Rel.
Nordson DAGE
Booth #: 303
48065 Fremont Blvd
Fremont, CA 94538
Ph: 510-683-3930 x101
hal@dage-group.com
http://www.dage-group.com
Nordson EFD, Inc.
Booth #: 303
40 Catamore Blvd.
East Providence, RI 02914
Ph: (800) 556-3484
info@nordsonefd.com
http://www.nordsonefd.com
Nordson EFD LLC (formerly known as
EFD, Inc.) is a leading manufacturer of
high quality solder pastes & fluxes and
precision dispensing systems. Nordson
EFD Solder is ISO9001 certified and
offers a comprehensive line of printing
and dispensing solder pastes for
improving yields and reducing costs in
assembly processes. We provide
application based solder products,
complete paste dispensing solutions
and develop supportive technical
partnerships with our customers.
Nordson EFD precision dispensing
systems apply controlled amounts of
solder pastes and fluxes, adhesives,
sealants, lubricants and virtually any
assembly fluid used in nearly every
industrial manufacturing process.
Nordson YESTECH, Inc.
Booth #: 310
2762 Loker Ave., West
Carlsbad, CA 92010
Ph: (760) 918-8471
sales@nordsonyestechinc.com
http://www.nordsonyestechinc.com
NTK Technologies
Booth #: 631
3979 Fredson Circle Drive
Suite 650
Santa Clara, CA 95054
Ph: (650) 823-3046
mstoops@ntktech.com
http://www.ntktech.com
NTK Technologies, Inc., is a leader in
IC Packaging comprised of Organic
and Ceramic Substrates. With domestic
and international sales and engineering
centers, NTK offers a wide range of
packaging materials and design
services to support a broad spectrum
of IC packaging applications. NTK’s IC
Package catalogs of products are
targeted at mainstream and custom IC
packages for advanced markets
including Opto, FPGA, MPU, CPU,
MCM, RF, and Medical.
49
exhibitors
Orthodyne Electronics
Booth #: 721
16700 Red Hill Avenue
Irvine, CA 92606-4802
Ph: (949) 660-0440
oesales@kns.com
http://www.orthodyne.com
Orthodyne Electronics, a division of
K&S, is an award winning, leading
provider of ultrasonic wedge bonders
for the hybrid and semiconductor
industries. Orthodyne’s Semiconductor
and Hybrid Wedge Bonders bond
aluminum wire sizes from 1-20 mil
with large and small wire options or
PowerRibbon® sizes 30x4 mil to 80x12
mil.
Pac Tech Packaging Technologies
USA
Booth #: 808
328 Martin Ave.
Santa Clara, CA 95050
Ph: (408) 588-1925
sales@pactech-usa.com
http://www.pactech-usa.com
50
Pac Tech builds solder balling and
assembly equipment for flip-chip and
chip-scale packaging. With systems for
solder jetting (SB2) and flip-chip attach
(LAPLACE) Pac Tech is the leader in
laser heating and reflow technology for
advanced packaging applications like
HGA assembly, MEMS and
optoelectronic packaging. The solder
bump repair system SB2-R is the
solution for lead-free CSP/BGA
rework. Pac Tech also offers contract
bumping & backend services for quickturn and mass production in Santa
Clara-California, Penang-Malaysia and
Nauen-Germany.
chip-attach of eutectic and epoxy
bonded LEDs, MEMS, microwave, RF
components, multi-chip modules, and
hybrids.
Perfection Products, Inc.
Booth #: 718
1320 Indianapolis Avenue
Lebanon, IN 46052
Ph: (765) 482-7786
sales@perfection-products.com
http://www.perfection-products.com
Perfection Products manufactures
Process Magazines and Carriers. Such
products are Film Frames, Grip Rings,
Magazines for Frames and Rings. Lead
Frame Magazines, Process Boats
(formed & flat style) & Magazines,
Antistatic Shippers for Frames and
Rings. Also available are the 12.0"
(300 mm) Wafer Frames and
Magazines. Perfection – Accept
Nothing Less.
Photo Sciences, Inc.
Booth #: 202
2542 West 237th Street
Torrance, CA 90505
Ph: (310) 634-1538
wayneh@photo-sciences.com
http://www.photo-sciences.com
Photo Sciences manufactures a diverse
range of photomask products, precision
imaged coatings on glass, metal and
specialized substrates. Photomask
products include laser imaged chrome
or iron oxide on soda lime and quartz
for 1x masters, stepper reticles and
contact prints. Our FAST TRACK
photomask service offers free
replacement within 30 days for any
reason except design change.
Pacific Aerospace & Electronics
Booth #: 319
434 Olds Station Road
Wenatchee, WA 98801
Ph: (509) 667-5346
ameade@pacaero.com
http://www.pacaero.com
Quartzdyne Electronics
Booth #: 720
4334 W. Links Drive
Salt Lake City, UT 84120
Ph: (801) 266-6958
brian@quartzdyne.com
http://www.quartzdyne.com
Palomar Technologies, Inc.
Booth #: 530
2728 Loker Avenue West
Carlsbad, CA 92010
Ph: (760) 931-3600
rhueners@bonders.com
http://www.palomartechnologies.com
Custom hybrid Manufacturing for high
temperature and harsh environments.
Palomar Technologies offers automated
component assembly, wire, ball and
wedge bonding systems for
manufacturers in medical, wireless,
microwave, computer, automotive,
aerospace industries. Palomar
Microelectronics offers development
and assembly services including wire
bonding, gold ball bumping, and direct-
Reldan Metals Co.
Booth #: 309
396-402 Whitehead Ave.
South River, NJ 08882
Ph: (800) 764-9222
sales@armetals.com
http://www.armetals.com
MAXIMIZING VALUE FROM
PRECIOUS METAL SCRAP® Reldan
Metals Co., Division of Abington
Reldan Metals, LLC has been refining
for over 30 years with a combined
experience of over 50 years turning our
clients’ waste into recoverable,
quantifiable assets. Our expertise
addresses the different types of
materials in the market place along with
the most efficient process for recovery
of your precious metals value. Our full
service refinery is ISO 14001 certified,
which ensures compliance with
environmental laws and regulations
resulting in a zero- discharge operation.
We are also CHWMEG audited. We
utilize environmentally sound
procedures to consummate the
recycling of e waste. We have signed
the prestigious Basel Action Network’s
“Electronic Recycler’s Pledge of True
Stewardship” and have qualified as
upholding the highest standard of
environmental and social responsibility.
Royce Instruments, Inc.
Booth #: 520
500 Gateway Dr.
Napa, CA 94558
Ph: (707) 255-9078
dcox@royceinstruments.com
http://www.royceinstruments.com
Remtec, Inc.
Booth #: 214
100 Morse Street
Norwood, MA 02062
Ph: (761) 762-9191
sales@remtec.com
http://www.remtec.com
RTI International
Booth #: 220
3040 Cornwallis Rd.
PO Box 12194
Research Triangle Park, NC 27709-2194
Ph: (919) 248-1872
lannon@rti.org
http://www.rti.org
Remtec manufactures ceramic
substrates with PCTF® (Plated Copper
on Thick & Thin Film) metallization for
thermal management applications.
Products: laser and photo diodes
submounts; leadless SMT packages for
direct PCB mount with hermetic &
thermal vias, wraparounds with low
inductance and embedded passives for
RF components and modules; and
multilayer thick film circuits.
Manufacturing in the USA for over 27
years, our Bond Testers and Die Sorters
have an excellent reputation for
performance and customer support. The
highly integrated System 650 Bond Tester
has rich statistical capability and supports
enterprise networked SPC. Our quick
changeover Die Sorters excel at handling
fragile die with critical geometry. Either
fully automatic with wafer mapping or
semi-automatic for lower cost.
Riv, Inc.
Booth #: 618
31 Railroad Ave
P.O. Box 220
Merrimack, NH 03054-4163
Ph: (603) 424-0510
tania@rivinc.com
http://www.rivinc.com
RTI International’s Center for Materials and
Electronic Technologies is a world leader
in advanced interconnect and packaging
technologies. RTI provides access to state
of the art wafer bumping and WLP
technologies, supporting small and midvolume customers as well as developmental
applications. As a recognized leader in 3D
integration, RTI has developed a
comprehensive platform of technologies
and works with commercial, government,
and academic clients from around the world
to develop and implement solutions. In
addition to its focus on advanced
interconnect technologies, RTI also
conducts research and development in
sensors and actuators, electronic material
characterization, and novel device
microfabrication.
Rogers Corporation
Booth #: 709
100 South Roosevelt Ave.
Chandler, AZ 85226
Ph: (480) 961-1382
acmlit@rogerscorp.com
http://www.rogerscorp.com
SEFAR Printing Solutions, Inc.
Booth #: 302
111 Calumet St.
Depew, NY 14043
Ph: (800) 995-0531
spsales@sefar.us
http://www.sefar.us
Rogers Corporation is a global
technology leader in the development
of high performance printed circuit
materials for use in high frequency
circuit applications. Rogers’ materials
serve a wide range of markets including
communications
infrastructure,
advanced packaging, aerospace and
defense, computer and office
equipment and high-speed digital
applications.
With over 40 years of thick film screen
experience, Sefar can create repeatable
precision stencils according to your
individual requirements. Sefar is proud to
exhibit our ISO 9001 certified screen
making capabilities as well as high
resolution artwork generation services
that can expedite and improve the quality
of your production processes.
as of October 8, 2010
Semi Dice, Inc.
Booth #: 821
P.O. Box 3002
10961 Bloomfield Street
Los Alamitos, CA 90720
Ph: (562) 594-4631
dminter@semidice.com
http://www.semidice.com
Semiconductor Wafer and Bare Die
products.
Value-added
wafer
processing and test services provided
for the hybrid, MCM and COB
markets. Franchises with Both Active
and Passive lines including National
Semi, Microsemi, Fairchild Semi,
Analog Devices, Central Semi, Intl.
Rect., ON Semi, NXP, Vishay
Intertechnology, IRC Advanced Film
Division, Johanson Dielectronics and
more.
Semiconductor Equipment
Corporation
Booth #: 526
5154 Goldman Ave.
Moorpark, CA 93020
Ph: (805) 529-2293
sales@semicorp.com
http://www.semicorp.com
Sikama International, Inc.
Booth #: 611
118 East Gutierrez Street
Santa Barbara, CA 93101-2314
Ph: (805) 962-1000
phil@sikama.com
http://www.sikama.com
Silicon Cert, Ltd.
Booth #: 412
4201 Pottsville Rd.
Reading, PA 19605
Ph: (610) 939-9500
jschmoyer@siliconcert.com
http://www.siliconcert.com
Mechanical and environmental
endurance reliability and qualification
testing to JEDEC, MIL-STD, Telcordia,
AEC. In-house analytical services
include X-ray, SEM, CSAM, auger,
decapsulation, cross-sectioning and
counterfeit detection of electronic
components. ISO 9001:2008 certified.
ISO 17025:2500 accredited. DSCC
laboratory suitability approved.
Smart Equipment Technology
(S.E.T.)
Booth #: 419
Ave. des Colombieres - BP 24
Saint-Jeoire, F-74490 74490
France
Ph: 33-0-450358392
egreneche@set-sas.fr
www.set-sas.fr
SET is a world leading supplier of High
Accuracy Die/Flip-Chip Bonders. With
hundreds of machines installed
worldwide, SET is renowned for the
unsurpassed accuracy and the
flexibility of its systems. Ranging from
manual loading version to fully
automated operation, SET’s equipment
enables 3D-IC using Die-to-Die or Dieto-Wafer bonding onto wafers up to 300
mm.
Sonoscan, Inc.
Booth #: 519
2149 E. Pratt Boulevard
Elk Grove Village, IL 60007-5914
Ph: (847) 437-6400
jlykowski@sonoscan.com
http://www.sonoscan.com
Sonoscan® is a leader and innovator
in Acoustic Micro Imaging (AMI)
technology. Sonoscan manufactures
acoustic microscope instruments and
accessories to nondestructively inspect
and analyze products. Our C-SAM®
microscope provides unmatched
accuracy for the inspection of products
for hidden internal defects.
SST International
Booth #: 627
9801 Everest Street
Downey, CA 90242
Ph: (562) 401-9246
llloyd@sstinternational.com
http://www.sstinternational.com
SST manufactures vacuum/pressure
furnaces
for
high-reliability
microelectronic package assembly.
SST’s furnaces create void-free solder
joints without flux. Applications
include eutectic die attach, hermetic
package sealing, lead-free soldering,
fiber-optic component soldering, glassto-metal sealing, high temperature
brazing, high vacuum MEMS package
sealing with getter activation and solar
cell void-free attach.
Stellar Industries Corp.
Booth #: 403
50 Howe Avenue
Millbury, MA 01527
Ph: (508) 865-1668
snooky@stellarind.com
http://www.stellarind.com
Stellar Industries Corp. offers high
performance, high power Copper on
Ceramic for Laser Submounts and for
RF Microelectronic hybrids. Stellar
Industries Corp. also offers vapor
deposited AuSn for precision mounting
and a complete line of custom ceramic
machining and metallization services.
Stellar Microelectronics Inc.
Booth #: 714
28454 Livingston Avenue
Valencia, CA 91355
Ph: (661) 775-3500
alex@stellarmicro.com
http://www.stellarmicro.com
Taconic
Booth #: 221
136 Coonbrook Road
Petersburgh, NY 12138
Ph: (518) 658-3204
staceys@4taconic.com
http://www.4taconic.com
Tamarack Scientific Co.
Booth #: 308
220 Klug Circle
Corona, CA 92880
Ph: (951) 817-3700
info@tamsci.com
http://www.tamsci.com
Manufacturer of EXCIMER & DPSS
LASER SYSTEMS, UV STEPPERS,
UV SCANNERS and MASK
ALIGNERS.
We specialize in
applications including: Advanced
Packaging, 3D TSV, Organic
Electronics, MEMS, Displays, RFID,
Solar Cells, Medical Devices and HDI.
TDK Corporation
Booth #: 702
475 Half Day Road, Suite 300
Licolnshire, IL 60069
Ph: (972) 409-4519
sara.reynoso@us.tdk.com
http://www.tdk.com
The TDK AFM-15 Flip Chip Ultrasonic
Gold-to-Gold Interconnect (GGI)
Bonder provides a low temperature,
precision, clean, high reliability, die
attach process. The flip chip GGI die
attach process provides up to a 70%
form factor size reduction and superior
electrical high frequency performance
compared to other methods. GGI
interconnect is used for RF devices,
MEMs, HBLEDs, CMOS BSI image
sensors.
Technic, Inc.
Booth #: 629
300 Park East Drive
Woonsocket, RI 02895
Ph: (401) 769-7000
gph@technic-epd.com
http://www.technic.com
Technical Materials, Inc.
Booth #: 322
5 Wellington Rd.
Lincoln, RI 02865
Ph: (800) 241-2523
joseph_kaiser@beminc.com
http://www.technicalmaterials.com
TechSearch International Inc.
Booth #: 218
4801 Spicewood Springs Rd.
Suite 150
Austin, TX 78759
Ph: 512-372-8887
tsi@techsearchinc.com
http://www.techsearchinc.com
TechSearch International, Inc. was
founded in 1987 as a market research
and consulting company specializing in
emerging semiconductor packaging
trends. Multi- and single-client
services encompass market research,
technology trends, and strategic
planning. Research topics include
wafer level packaging, flip chip
interconnect, CSPs, BGAs, 3D
integration with TSVs, manufacturing
in China and India, high-density flex
circuits, multichip packages (MCPs)
such as stacked die CSPs and Systemin-Package (SiP), and embedded
components, microvia substrates,
semiconductor packaging, LED
assembly, materials developments, and
assembly
materials,
Pb-free
manufacturing, and technology
licensing. Market forecasts and trends
in advanced semiconductor packaging
developments
are
available.
TechSearch International professionals
have an extensive network of more than
15,000 contacts in North America,
Asia, and Europe and travel
extensively, visiting major electronics
manufacturing operations and research
facilities worldwide.
Teledyne Microelectronic
Technologies, Inc.
Booth #: 514
12964 Panama Street
Los Angeles, CA 90066
Ph: 310-574-2082
microelectronics@teledyne.com
http://www.teledynemicro.com
Teledyne Microelectronics in Los
Angeles, California is a full service
contract manufacturer offering
innovative approaches in packaging
high-density,
high-reliability,
microelectronics for the aerospace,
space, defense, medical and industrial
markets. Areas of expertise include RF/
microwave, optoelectronics, analog/
digital, power and military secure
communications. Certified MIL-PRF38534 Class “H and K”; DOD
Microelectronics Trusted Source for
Packaging, Assembly and Test.
51
exhibitors
Torrey Hills Technologies, LLC
Booth #: 620
6370 Lusk Blvd, F-111
San Diego, CA 92130
Ph: (858) 558-6666
kkuang@torreyhillstech.com
http://www.torreyhillstech.com
U.S. Tech
Booth #: 820
10 Gay Street.
Phoenixville, PA 19460
Ph: 610-783-6100
ustech@gim.net
http://www.us-tech.com
VIOX Corporation
Booth #: 719
6701 Sixth Avenue South
Seattle, WA 98108
Ph: (206) 763-2170
glass@viox.com
http://www.viox.com
Williams Advanced Materials
Booth #: 306
2978 Main Street
Buffalo, NY 14214
Ph: (716) 837-1000
kimberly_schoen@beminc.com
http://www.williams-adv.com
Since its establishment in 2004, Torrey
Hills Technologies, LLC has turned
itself into a top-class manufacturer of
Cu-W, Cu-Mo, CMC and CPC heat
sinks. At the same time, the company’s
equipment sales, including those of
production belt furnaces and three roll
mills, are heading for another straight
increase.
U.S. Tech, an international hi-tech
electronics publication, reaches over
350,000 engineers, buyers, product
specifiers & manufacturing & corporate
managers each month, on the web and
in print combined. The newspaper
focuses on new innovations in
components, distribution & PCB
design, manufacturing, assembly &
test, renewable energy, as well as the
business and regulatory issues facing
the electronics manufacturing and
distribution sector.
VIOX manufactures electronic-grade
and specialty glass powders for thick
film, hybrid, solar cell and biomedical
applications. Volumes from lab samples
to production scale. Glasses are batchmelted in platinum crucibles preventing
contamination. Powders produced by
wet or dry milling. VIOX offers glass
design services including test melting
and in-house analytical capabilities.
WAM offers the semiconductor
industry a comprehensive group of
packages, cover-lids, thin film hybrid
circuits and precious metal services.
Williams also offers a full range of
ceramic packages for RF power
transistors and Direct Bond Copper
(DBC) metallized substrates and thin
film circuit manufacturing.
Trebor Instrument Corp.
Booth #: 609
39 Balsam Drive
Huntington Stat., NY 11746-7724
Ph: 631-293-8127
treborinst@hotmail.com
http://www.treborinst.com
52
Flipchip Bonder, Eutectic Die Bonder,
Hot Gas Die Remover, Pick and Place
Die Attach with Epoxy Dispense,
Manual Pick and Place, Manual Wire
Puller, Lead Integrity Tester, Volume
Restivity Tester, Cut & Form Dies,
Custom and Standard Wire Bond
Columns, Microscope Illuminators,
Custom Assembly Tooling, Magnetic
Lid Pickup Wand.
Tresky Corporation
Booth #: 418
50 Route 9, Suite 304
Morganville, NJ 07751
Ph: (732) 536-8600
sales@tresky.com
http://www.tresky.com
Highly flexible die bonding systems
with 1µm alignment accuracy. Systems
are capable of performing Flip Chip
Bonding, Eutectic Die Attach,
Thermosonic, Thermocompression, 3D
Stacking and Precise Z Height Control
with Bond-line Thickness. Simple,
easy to use Rework systems with
advanced capabilities for Eutectic and
Epoxy Bonded Devices.
Twilight Technology, Inc.
Booth #: 421
325 N. Shepard Street
Anaheim, CA 92806
Ph: (602) 684-0198
bharris@ttsemiconductor.com
http://www.twilighttechnology.com
TT Semi produces analog and memory
parts for high temperature and harsh
environmental applications.
Universal Instruments
Booth #: 223
33 Broome Corporate Parkway
Conklin, NY 13748
Ph: (607) 779-5404
schillof@uic.com
http://www.uic.com
Utz Technologies, Inc.
Booth #: 704
101 Industrial Ave. East
Clifton, NJ 07012
Ph: (978) 805-5003
dan@utz.com
http://www.utz.com
Valtronic Technologies (USA), Inc.
Booth #: 423
6168 Cochran Road
Solon, OH 44139
Ph: (440) 349-1239
pklavora@valtronictechnologies.com
http://www.valtronictechnologies.com
Valtronic Technologies designs, develops,
and manufactures microelectronic and
micromechanical assemblies. Leaders in
the packaging of high density multichip
modules and high density microsystems.
Offering a turnkey solution, including
project management, procurement,
assembly, testing, and specialized
shipping. We provide miniaturized
electronics for the medical, commerical
industrial and aerospace markets. Visitors
will have the opportunity to see several
implantable electronic assemblies, such
as a retinal implant as well as box builds
where miniaturization was essential. ISO
13485:2003 certified.
Wafer & Device Packaging and
Interconnect
Booth #: 203
27 Walker Lane
Weston, CT 06883
Ph: 203-454-5678
Richard.cowan@snet.net
http://www.waferpackaging.com
Wafer & Device Packaging and
Interconnect is the most widely read
magazine for semiconductor back-end
packaging, assembly and test. The U.S.
print run averages 18,400 and the
digital averages 9 - 10 thousand. Go
to www.waferpackaging.com. See the
gigantic Buyers Guide.
West-Bond, Inc.
Booth #: 713
1551 S. Harris Court
Anaheim, CA 92806
Ph: (714) 978-1551
sales@westbond.com
http://www.westbond.com
Design and Manufacturer of
Automatic, Semiautomatic, and
Manual ESD protected Microelectronic
Assembly and Test Equipment and
accessories since 1966. Ultrasonic,
Thermosonic and Thermocompression
Wire/Ribbon Bonders, Eutectic and
Epoxy Die Bonders, Insulated Wire
Bonder, and Pull Testers, LED
Illuminators, Heated and Cold
Workholders, Temperature Controllers,
Ultrasonic Transducers, Ultrasonic
Power Supplies and Wire Despoolers.
Visit : www.westbond.com.
XYZTEC
Booth #: 528
5843 Cajon Way
Gilroy, CA 95020
Ph: (408) 846-5475
cynthia.blank@xyztec.com
http://www.xyztec.com
XYZTEC, a leading global supplier of
bond test equipment, offers the most
flexible bond testing platform on the
market today! The Condor series
features a single platform with multiple
test capabilities allowing end-users the
added flexibility of performing many
types of tests all on one system. In
addition to standard bond testing
applications such as wire pull, ball
shear, die shear, the Condor series has
the capability to perform peel testing,
push testing, high impact testing,
fatigue testing, and creep testing.
XYZTEC is the only bond test supplier
that offers a Revolving Measurement
Unit, featuring four different
measurement sensors to address 80%
of your test requirements. The joysticks
are ergonomically friendly, easily move
the XY stage to the desired position,
and feature 12 logically arranged
buttons for increased operator
efficiency. The Condor EZ software
features onboard graphics and
intelligent wizards, providing intuitive
operator control as well as sophisticated
SPC software thus ensuring complete
documentation of the test protocol.
Come by and visit us at IMAPS 2010
Symposium at booth # 528! For more
information, visit www.xyztec.com
Yxlon/Fein Focus
Booth #: 728
3400 Gilchrest Road
Mogadore, OH 44260
Ph: (330) 798-4838
sheri.martin@yxlon.com
http://www.yxlon.com
High magnification digital X-Ray
solutions for electronic and medical
manufacturing applications. Quick
as of October 8, 2010
Scan micro CT technology enables CT
data set acquisition in less than one
minute.
Student Booths
Korea Advanced Institute of
Science and Technology (KAIST)
Booth #: 743
Student President: Sunghwan Kim,
sunghwan_kim@kaist.ac.kr
Faculty Advisor: Jin Yu,
jinyu@kaist.ac.kr
A SPECIAL THANKS
TO THE
IMAPS 2010 EXHIBITORS!
South Dakota State University
Booth #: 836
Student President: Braden Bills,
blbills@jacks.sdstate.edu
WE ARE SINCERELY GRATEFUL
Faculty Advisor: David Galipeau,
david.galipeau@sdstate.edu
THAT YOU HAVE CHOSEN OUR EVENT
Temple University
Booth #: 737
Student President: Son Nguyen,
stnguyen@temple.edu
Faculty Advisor: Joan Delalic,
joan@temple.edu
University of Alabama
Booth #: 739
Student President: Anurag Gupta,
agupta16@crimson.ua.edu
Faculty Advisor: Bruce Kim,
bruce.kim@ieee.org
University of Arkansas
Booth #: 838
Student President: Mohammed
Chowdhury, mchowdhu@uark.edu
Faculty Advisor: Ajay Malshe,
apm2@uark.edu
University of Idaho
Booth #: 741
Student President: Avi Dhakal,
adhakal@vandals.uidaho.edu
AT WHICH TO EXHIBIT.
YOU ARE THE
“GAS FOR THE IMAPS ENGINE”!
THANK
YOU
FROM THE
IMAPS 2010 SYMPOSIUM COMMITTEE
AND THE
IMAPS STAFF.
Faculty Advisor: Aicha Elshabini,
elshabini@uidaho.edu
University of Waterloo
Booth #: 840
Student President: Andie Pequegnat,
apequegn@uwaterloo.ca
Faculty Advisor: Michael Mayer,
mmayer@uwaterloo.ca
Exhibit Hall Aisle Signs
sponsored by:
www.natelengr.com
53
products & services index
by Company & Booth Number
Assembly Equipment - Tools,
Fixtures, Dispensing and Rework
Equipment
3D Systems Packaging Research Center
at Georgia Tech
Finetech, Inc.
Nordson EFD, Inc. (shared island with Nordson
DAGE)
Smart Equipment Technology (S.E.T.)
SST International
TDK Corporation
Trebor Instrument Corp.
512
706
303
419
627
702
609
Bonding Equipment - Tools, Pull
Testers, and Bonding Wire
54
3D Systems Packaging Research Center
at Georgia Tech
Besi
Brewer Science
Coining, Inc.
Finetech, Inc.
Hesse & Knipps, Inc.
Orthodyne Electronics
Smart Equipment Technology (S.E.T.)
TDK Corporation
Trebor Instrument Corp.
XYZTEC
512
320
433
708
706
509
721
419
702
609
528
Chemicals and Gases Photochemicals
Empower Materials
VIOX Corporation
523
719
Cleaning Equipment, not including Chemicals
Geib Refining Corporation
518
Computer Design, CAD/CAM Design Services
Advance Reproductions Corp.
Infinite Graphics, Inc.
Photo Sciences, Inc.
420
726
202
Connectors, Lead Forming
and Frames
Co-Planar, Inc.
Interconnect Systems, Inc.
Interplex Engineered Products, Inc.
Trebor Instrument Corp.
803
408
730
609
Dicing and Die Attachment
Equipment
Besi
Disco Hi-Tech
Finetech, Inc.
Haiku Tech, Inc.
Smart Equipment Technology (S.E.T.)
SST International
TDK Corporation
Trebor Instrument Corp.
Furnace Equipment - Materials
Handling
320
431
706
427
419
627
702
609
Electronic Packages and
Packaging
3D Systems Packaging Research Center
at Georgia Tech
AdTech Ceramics
ALLVIA, Inc.
Chip Supply, Inc.
Coining, Inc.
Co-Planar, Inc.
CPS Technologies Corporation
Geib Refining Corporation
HEI, Inc.
Heraeus Thick Film Division
Interconnect Systems, Inc.
Interplex Engineered Products, Inc.
Microcertec
nanosystec, GmbH
NorCom Systems, Inc.
Quartzdyne Electronics
Remtec, Inc.
RTI International
Teledyne Microelectronic Technologies, Inc.
Torrey Hills Technologies, LLC
512
812
605
510
708
803
321
518
422
703
408
730
822
607
502
720
214
220
514
620
Electronic Microscopy Services,
Analytical Services
Haiku Tech, Inc.
Hi-Rel Laboratories, Inc.
RTI International
Silicon Cert, Ltd.
427
621
220
412
Epoxies and Adhesives
Harrop Industries, Inc.
SST International
Torrey Hills Technologies, LLC
Hybrid/SMT - Manufacturing
Circuit Boards and Flex Circuit
Manufacturing
HEI, Inc.
Interconnect Systems, Inc.
Quartzdyne Electronics
Remtec, Inc.
RTI International
Teledyne Microelectronic Technologies, Inc.
523
405
703
415
414
615
Failure Analysis
Hi-Rel Laboratories, Inc.
Silicon Cert, Ltd.
Sonoscan, Inc.
Trebor Instrument Corp.
Yxlon/Fein Focus
422
408
720
214
220
514
Inspection Equipment
and Services
Haiku Tech, Inc.
Hi-Rel Laboratories, Inc.
Infinite Graphics, Inc.
NorCom Systems, Inc.
Silicon Cert, Ltd.
Sonoscan, Inc.
Trebor Instrument Corp.
Yxlon/Fein Focus
427
621
726
502
412
519
609
728
Lasers - Cutting, Scribing,
Trimming, Marking, Machining,
Welding and Supplies
3D Systems Packaging Research Center
at Georgia Tech
Microcertec
nanosystec, GmbH
Tamarack Scientific Co.
512
822
607
308
Machining - Trimming
and Scribing Non-Laser
Tamarack Scientific Co.
Empower Materials
Henkel Corporation
Heraeus Thick Film Division
Indium Corporation of America
LORD Corporation
NAMICS Corporation
409
627
620
308
Publications
TechSearch International Inc.
U.S. Tech
Wafer & Device Packaging and Interconnect
218
820
203
Reflow Equipment
621
412
519
609
728
SST International
627
as of October 8, 2010
Solder - Pastes and Creams
Henkel Corporation
405
Indium Corporation of America
415
Nordson EFD, Inc. (shared island with Nordson
DAGE)
303
Screen Printers, Screens
and Stencils
Haiku Tech, Inc.
MicroScreen LLC
427
603
Semiconductors - Distributors
and Manufacturers
Brewer Science
Chip Supply, Inc.
Coining, Inc.
ES Components, Inc.
Micropac Industries, Inc.
Micross Components Corp.
RTI International
Semi Dice
Stellar Industries Corp.
433
510
708
222
633
711
220
821
403
Substrates - Shapes
3D Systems Packaging Research Center
at Georgia Tech
AdTech Ceramics
Coining, Inc.
Co-Planar, Inc.
Interplex Engineered Products, Inc.
Microcertec
Remtec, Inc.
Stellar Industries Corp.
512
812
708
803
730
822
214
403
Surface Mount/Hybrid
Components
3D Systems Packaging Research Center
at Georgia Tech
AdTech Ceramics
Chip Supply, Inc.
Crane Aerospace and Electronics
HEI, Inc.
Heraeus Thick Film Division
Interplex Engineered Products, Inc.
Micropac Industries, Inc.
Remtec, Inc.
RTI International
Teledyne Microelectronic Technologies, Inc.
Test Equipment - Probes,
Probe Cards and Die Sorting
Equipment
512
812
510
622
422
703
730
633
214
220
514
NorCom Systems, Inc.
Sonoscan, Inc.
502
519
Thick and/or Thin Film
Materials - Precious Metals
and Polymers
3D Systems Packaging Research Center
at Georgia Tech
Brewer Science
DuPont Electronics and Communications
ES Components, Inc.
Henkel Corporation
Heraeus Thick Film Division
Indium Corporation of America
LORD Corporation
Remtec, Inc.
Rogers Corporation
RTI International
Stellar Industries Corp.
VIOX Corporation
512
433
623
222
405
703
415
414
214
709
220
403
719
IMAPS 2011 BOOTH SELECTION
IMAPS 2011 - OCTOBER 9TH - 13TH: LONG BEACH CONVENTION CENTER
THURSDAY, NOVEMBER 4TH
9:00 AM - NOON
RCC: EXHIBIT HALL
GET A LEG UP ON YOUR COMPETITION -- PARTICIPATE IN THE BOOTH SELECTION.
55
products & services index
by Company & Booth Number
Booth Number
Other
Advance Reproductions Corp
ALLVIA, Inc.
Atotech USA, Inc.
Brewer Science
420
605
710
433
Colt Refining, Inc.
CPS Technologies Corporation
Disco Hi-Tech
732
321
431
Empower Materials
Geib Refining Corporation
523
518
Harrop Industries, Inc.
Infinite Graphics, Inc.
Kyzen Corporation
Metallix Refining, Inc.
Microcertec
MicroScreen LLC
Photo Sciences, Inc.
Reldan Metals Co.
Silicon Cert, Ltd.
Smart Equipment Technology (S.E.T.)
SST International
TechSearch International Inc.
Torrey Hills Technologies, LLC
Trebor Instrument Corp.
VIOX Corporation
409
726
315
219
822
603
202
309
412
419
627
218
620
609
719
Photomasks
Foundry services for custom TSVs, Cu Pillars, and Interposers
Process chemicals and equipment
Specialty chemicals for Semiconductor, Advanced Packaging, and
MEMS
Refining of Precious Metals
AlSiC Heat Spreaders
Equipment and diamond tools for Cutting, Grinding and Polishing
applications
Sacrificial binders
Precious metal reclaim. Recycling and refining of precious metals ITAR
Compliant Precious Metals Facility
Tape casters
Photomask Services
Cleaning Chemistries
Services - Recycler of Precious Metals
Ceramics, Thin-film metallizing & coatings services, Brazed assemblies
Screens for printing solar cells, membrane switch assemblies, etc.
Photomasks and reticles
Service: Precious Metal Refiner
Reliability - Qualification testing services
Nanoimprint Lithography systems
Vacuum Solder Reflow Equipment
Consulting
Mixing Equipment - Three Roll Mills
Fluorescent Ring Microscope Illuminators
Glass Powders for thick-film pastes
Company
56
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upcoming imaps events
Mark Your Calendar ... Events being planned for 2011!
Global Business Council (GBC) Spring Conference
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona - USA
March 6 - 7, 2011
www.imaps.org/gbc
Co-located with Device Packaging Conference and Exhibition
IMAPS International Conference on
High Temperature Electronics Network (HITEN 2011)
St. Catherine’s College Oxford
Oxford, United Kingdom
July 18 - 20, 2011
www.imaps.org/hiten
International Conference and Exhibition on
Device Packaging (DPC 2011)
Radisson Fort McDowell Resort and Casino
Scottsdale/Fountain Hills, Arizona - USA
March 7 - 10, 2011
www.imaps.org/devicepackaging
Advanced Technology Workshop on
RF and Microwave Packaging
The Crowne Plaza San Diego
San Diego, California - USA
September 20 - 22, 2011
www.imaps.org/rf
Advanced Technology Workshop on
Electronics Packaging of Solar Cells and Fuel Cells
Hilton Garden Inn Cleveland Airport
Cleveland, Ohio - USA
March 29 - 30, 2011
www.imaps.org/energy
44 th International Symposium on Microelectronics
(IMAPS 2011)
Long Beach Convention Center
Long Beach, California - USA
October 9 - 13, 2011
www.imaps2011.org
IMAPS/ACerS 7th International Conference and Exhibition on
Ceramic Interconnect and Ceramic Microsystems
Technologies (CICMT 2011)
The Westgate Hotel
San Diego, California - USA
April 5 - 7, 2011
www.cicmt.org
IMAPS Advanced Technology Workshop on
Electronics Packaging of Solar Cells and Fuel Cells
Hilton Garden Inn Cleveland Airport
Cleveland, Ohio
March 29 - 30, 2011
Visit www.imaps.org/energy for more information.
IMAPS Advanced Technology Workshop on
RF and Microwave Packaging
The Crowne Plaza San Diego
San Diego, California - USA
September 20 - 22, 2011
Visit www.imaps.org/rf for more information.
57
International Conference and Exhibition
on
Device Packaging
Sponsored by
IMAPS
www.imaps.org/devicepackaging
Radisson Fort McDowell Resort & Casino
Scottsdale/Fountain Hills, Arizona - USA
March 7 - 10, 2011
International Microelectronics And Packaging Society
Bringing Together the Entire Microelectronics Supply Chain!
Abstract Deadline: December 3, 2010
Announcement and Call for Abstracts
Topical Workshops on
58
3D IC & Packaging
Flip Chip Technologies
MEMS & Associated Microsystems
Wafer Level Packaging
Emerging Technologies - LEDS
Emerging Technologies - Passive Integration
s are being held as a p
art of the 201
1 Device Packaging Conference
workshops
part
2011
These workshop
The Seventh Annual Device Packaging Conference (DPC 2011) will be held in Scottsdale, Arizona, on March 7-10, 2011.
It is an international event organized by the International Microelectronics And Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking
opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within
industry and academia. It provides a chance for educational interactions across many different functional groups and
experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers,
manufacturing engineers, professors, students, business managers, sales and marketing.
The 2011 conference will feature technical sessions, panel discussions, a poster session, professional development courses
and a vendor exhibition and technology showcase. The conference provides a focused forum on the latest technological
developments in 5 topical workshop areas related to microelectronic packaging.
Those wishing to present in a topical workshop of the Device Packaging Conference must submit a 200-300 word abstract
electronically no later than December 3, 2010, using the on-line submittal form at: www.imaps.org/abstracts.htm. No
formal technical paper is required. A reproduction-ready two- to six-page concise summary with text (figures and graphs
included if necessary) will be required for the abstract booklet on Friday, January 28, 2011. A post-conference CD containing
the full presentation material as supplied by authors will be mailed 15 business days after the event to all attendees. Please
contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 305-382-8433 if you have questions.
Device Packaging Exhibit and Technology Show: IMAPS will hold a concurrent exhibition for vendors and suppliers
who support the many aspects of Device Packaging at the related topical areas. This venue features an ideal atmosphere
to showcase your products and services to key decision making professionals in the industry. Full 8' by 10' exhibit spaces
will be available. The Exhibit Hall sold out each year since 2006. To reserve booth space please fill out the on-line
submittal form before February 3, 2011 at: www.imaps.org/devicepackaging or contact Ann Bell by email at abell@imaps.org
or by phone at 202-548-8717.
Device Packaging Professional Development Courses (PDCs): For those wishing to broaden their knowledge of
device packaging, a selection of half-day courses will be offered on Monday, March 7th, preceding the technical conference. If you would like to participate as an instructor, please submit a description of your short course on-line at www.imaps.org/
pdc no later than December 3, 2010.
Announcement and Call for Papers
IMAPS/ACerS 7th International Conference and Exhibition on
Ceramic Interconnect and Ceramic Microsystems Technologies
The Westgate Hotel
San Diego, California - USA
April 5 - 7, 2011
The official Ceramic Interconnect and Ceramic Microsystems Technologies website is www.cicmt.org.
Co-sponsored by:
The American Ceramic Society
(ACerS)
The International Microelectronics And Packaging Society
(IMAPS)
General Chairs:
Amy Moll, Boise State University
amoll@boisestate.edu
Jens Müller, Technical University Ilmenau
jens.mueller@imaps.de
Technical Program Chairs:
Chris Apblett, Sandia National Labs
caapble@sandia.gov
Soshu Kirihara, Osaka University
kirihara@jwri.osaka-u.ac.jp
Marija Kosec, Jozef Stefan Institute
marija.kosec@ijs.si
Goal
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of
disciplines to share experiences and promote opportunities to accelerate research, development and application of ceramic interconnect
and ceramic microsystems technologies. This international conference features ceramic technology for both Microsystems and
Interconnect applications in a dual-track technical program. The Ceramic Interconnect track focuses on cost effective and reliable high
performance ceramic interconnect products for hostile thermal and chemical environments in the automotive, aerospace, defense/
security, and communication industries. The Ceramic Microsystems track focuses on emerging applications and new products that
exploit the ability of 3-D ceramic structures to integrate interconnect/packaging with microfluidic, optical, micro-reactor and sensing
functions. Tape casting, thick film hybrid, direct write and rapid prototyping technologies are common to both tracks, with emphasis on
material, processes, prototype development, advanced design and application opportunities.
Ceramic Interconnect Track
Ceramic Interconnect technology has a long history of meeting the requirements of the most demanding applications. Conventional thick and thin film ceramic technologies are being revolutionized and extended through the development of low temperature
co-fired ceramics, photo patterning, and embedded passive component materials and processes. These have contributed to increased
circuit density, enhanced functionality, and improved performance that are being adopted for leading edge applications in wireless and
optical communications, automotive, MEMS, sensors, and energy. Data communications and the Internet are driving the demand for
bandwidth, sparking demand for optical communication equipment and new interconnect and packaging applications that perform at
40 Gb/sec and beyond. In under-the-hood electronics for automotive, engine/transmission control, communications, and safety applications continue to drive the growth of ceramic interconnect technology, while collision avoidance systems are creating interest in low
loss ceramic materials for frequencies approaching 100 GHz.
Ceramic Microsystems Track
Enabled by the availability of commercial ceramic, metal and embedded passives materials systems, and the rapid prototyping
capabilities of the well established multilayer ceramic interconnect technology, three dimensional (3-D) functional ceramic structures
are spawning new microsystems applications in MEMS, sensors, microfluidics, bio-devices, microreactors and microenergy. These
new devices and applications exploit the ability to make microchannels and embed fluidic device functions (e.g., valves, pumps,
switches, light pipes, and reaction chambers).
In addition, the Ceramic Microsystems track of the CICMT conference targets new developments in microsystems that include
fabricating 3-D micro device structures enhanced with sol-gel, advanced printing and patterning technologies, high temperature materials technologies, and emerging applications like energy harvesting. Many of these innovative applications are taking advantage of
the unique ability to integrate the thermal, chemical, mechanical and electrical properties of these multicomponent ceramic-metal
systems.
Special Features
• Invited keynote and international presentations on the current status of ceramic technology and future system directions.
• A focused exhibition for suppliers who support the use of the technologies.
• A technical poster session to promote student participation.
• Social events to promote new contacts.
59
IMAPS/ACerS 7th International Conference and Exhibition on
Ceramic Interconnect and Ceramic Microsystems Technologies
Planned Session and Paper Topics Include
Ceramic Interconnect
Ceramic Microsystems
60
Markets and Applications
•
MEMS Technology and Markets
•
Energy and Fuel Cells
•
Biological and Medical
•
Chemical and Biochemical
•
Photonics
Materials and Properties
•
Materials Integration & Nano-materials
•
Thermal Management and Reliability
•
Piezoelectric Materials
•
Optoelectronics
Processing and Manufacturing
•
MEMS Manufacturing Technology
•
Industrial Automation and Rapid Prototyping
•
Nano-Technology/Integration
•
High Temperature Microsystems
Devices
•
Sensors and Actuators
•
Micro-Reactors
•
Fluidic Devices
•
Biomolecular and Cell Transport Systems
•
Energy Conversion Systems
Characterization and Reliability
•
Materials and Process Characterization
•
Systems Reliability, Lifetime, and Failure Estimation
•
Reliability of High-Performance Microsystems
Design, Modeling, and Simulation
•
Thermal and Heat Transfer
•
Computational Fluid Dynamics
Markets and Applications
•
Automotive
•
Aerospace
•
Wireless/Communication
•
Medical Electronics
Materials and Properties/Functions
•
Dielectric and Magnetic Materials
•
Embedded and Integrated Passives
•
Microwave/mm Wave Characterization
•
Zero-Shrink Ceramic Systems
Processing and Manufacturing
•
Green Tape Manufacturing
•
Multilayer Ceramics
- Via and Pattern Generation
- Metallization Processes
- Lamination
- Binder Burnout and Co-Firing
•
Laser Trimming and Deposition
•
Advanced Thick Film Processing
•
Fine Structuring Technologies
•
Rapid Prototyping
Devices
•
Circuits, Antennas, and Filters
•
Embedded Structures and Components
•
Optical Devices and Optoelectronics
Characterization and Reliability
•
Characterization of Green Tapes
•
Life Testing, Quality Issues
•
RF Performance
Design, Modeling, and Simulation
•
High Frequency Design Software
•
Design Rules
Integrated Ceramic Technology
Advanced Packaging Technology
•
Next Generation Packaging Technologies
•
Packaging and Integration in BioMEMS
•
Packaging Issues for MEMS Devices
•
Technologies for Microsystems Components and
Substrates
•
Packaging Standard for Microsystems
•
Environmental Issues: Lead-Free Systems
•
Cost Reduction
Abstract Cut-off Date: November 12, 2010
Notice of Acceptance: January 7, 2011
Final Manuscript Due: February 11, 2011
Please send your 250-300 word abstract electronically only by November 12, 2010, using the on-line
submittal form at: www.cicmt.org. All papers will be presented and published in English. If you are
having problems with the on-line submittal form, please email Jackki Morris-Joyner jmorris@imaps.org
or call +1-305-382-8433 (USA). All speakers are required to pay a reduced registration fee.
Announcement / Call for Papers
IMAPS International Conference on
High Temperature Electronics Network (HITEN)
www.imaps.org/hiten
St. Catherine’
s College Oxford
Catherine’s
Oxford, United Kingdom
2011
July 18 - 20, 201
1
Abstract Deadline Extended: January 28, 2011
The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and
industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are
encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon,
silicon on insulator (SOI), silicon carbide and gallium nitride. Although, HITEN is not simply a semiconductor focused network. HITEN
provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global
network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.
HITEN Conference Chairs:
HITEN Organizing Committee:
Colin Johnston
Oxford Applied Technology - UK
colin.johnston@materials.ox.ac.uk
Alison Crossley, University of Oxford (UK)
Patrick McCluskey, University of Maryland-CALCE (US)
Denis Flandre, UCL (B)
Bernd Michel, FHG-IZM (D)
Randy Norman, Perma Works, LLC (US)
Bernard Parmentier, Schlumberger (F)
Sascha Schwarze, Baker Hughes INTEQ (D)
Ovidiu Vermessan, SINTEF (N)
Matthias Werner, NMTC (D)
Wolfgang Wondrak, Daimler Chrysler (D)
R. Wayne Johnson
Auburn University
johnsr7@auburn.edu
Papers are solicited in the following topical areas:
• Contacts and metallizations
• Applications in the Aerospace, Automotive, Oil & Gas, and
• Materials
Geothermal Industries
• Packaging and interconnects
• Devices and applications
• Sealants, adhesives, solders
• Novel devices
• Reliability and failure mechanisms
• ASICs for high temperature applications
• Lifetime predictions
• Memories
• Accelerated life testing
• Passive components
• Testing at high temperatures
• Power devices
• Semiconductor materials
Those wishing to present a paper at the HITEN Conference must submit a 200-300 word abstract electronically no later than
January 28, 2011, using the on-line submittal form at: www.imaps.org/abstracts.htm. If your abstract is selected, a Final Manuscript
for publication on the Conference CD-ROM Proceedings, 6-12 pages, two-column format will be due on June 3, 2011.
Student Competition sponsored by:
The Microelectronics Foundation sponsors Student Paper Competitions in conjunction with all Advanced Technology Workshops
(ATWs) and Conferences. Students submitting their work and identifying that “Yes, I’m a full-time student” on the abstract submission form, will automatically be considered for these competitions. The review committee will evaluate all student papers/posters and
award at least one student author with a $1,000 check at the ATW/Conference. The selected student must attend the event to
present his or her work and receive the award. Registration fee is waived. The winner must pay for travel and lodging expenses.
Please contact Jackki Morris-Joyner by email at jmorris@imaps.org or by phone at 202-548-4001 if you have questions.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging; invitations
will be sent separately. All Speakers are required to pay a reduced registration fee and are required to attend the entire event.
61
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The Building Blocks
of Electronics
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This is your opportunity to come
right up to date with the latest
activity in the microelectronics industry. The 18th European Microelectronics
and Packaging Conference - EMPC 2011 - will be held in Brighton,
England from 12th to 15th September 2011. Here you will find an
international event covering all aspects of advanced electronics technology
and business, combining a major conference with an exhibition showcasing
the latest materials, equipment and services.
As with all events organised by the International Microelectronics and
Packaging Society - IMAPS - the event will offer excellent networking
opportunities at a most attractive venue. Brighton is a splendid seaside
town with wonderful facilities and easy access to/from London and London
airports; just 35 minutes from London Gatwick Airport.
EMPC 2011 is enhanced by the technical co sponsorship provided by
IEEE-CPMT, which further broadens the scope and relevance of the event.
So, put the dates in your calendar now and log on to the website at
www.empc2011.com to pre-register your interest as an author, delegate
or exhibitor.
Contact:
contact@empc2011.com
www.empc2011.com
IMAPS 2011 Symposium - Call for Papers
Bringing Together the Entire Microelectronics Supply Chain!
Center,, Long Beach, California - USA
Long Beach Convention Center
October 9 - 13, 201
2011
1
The 44th International Symposium on Microelectronics will be held at the Long Beach Convention Center, Long Beach, California,
USA, and is being sponsored by the International Microelectronics And Packaging Society (IMAPS). The IMAPS Technical Committee
seeks original papers that present progress on technologies “between the chip and the system.” The 44th Symposium on Microelectronics
will cover four tiers of electronics: Industry, Systems & Applications, Design, and Materials & Process. Abstracts should highlight the
major contributions of the work in one or more of these four areas. All abstracts submitted must represent original, previously unpublished
work.
General Chair:
Mark Hoffmeyer
IBM Corporation
hoffmeyr@us.ibm.com
Technical Chair:
Richard Sigliano
Kyocera America, Inc.
rick.sigliano@kyocera.com
Industry
Planned Sessions Include
Design
♦
♦
♦
♦
♦
♦
Consumer, Portable, and Wireless
Biomedical
Telecom
Defense and Security
Computing and Gaming
Automotive, Industrial, Harsh Environment Electronics
Applications
♦ Solar and Alternative Energy
Systems & Applications
♦ Thermal Management
♦ Power Management
♦ Cost Reduction, Outsourcing and Supply Chain
Management
♦ Electromagnetic Interference (EMI)
♦ Sensors and Nano Packaging
♦ Emerging Technologies
♦ System Packaging
♦ Microwave & RF Applications
♦ Electrostatic Discharge (ESD) Protection
♦ Photonic / Optoelectronic Packaging
♦ Packaging for Extreme Environments
♦ MEMS Packaging
♦ LED Packaging
♦ Packaging of Compound Semiconductor Devices
♦
♦
♦
♦
♦
♦
63
Electrical Modeling, Signal & Power Integrity
High Performance Interconnects and Boards
3D Packaging Approaches
Embedded and Integrated Passives
Wafer Level Packaging / CSP
Advanced Materials
Materials and Process
♦ Flip-Chip and Wafer Bumping Processes and Reliability
♦ Underfill/Encapsulants and Adhesives
♦ Pb-Free Solder Materials, RoHS, Processes, and
Reliability
♦ Design for Reliability
♦ Package Reliability Testing
♦ Wirebonding and Stud Bumping
♦ Ceramic and LTCC Packaging
♦ Substrate Materials and Technology
♦ Printed Electronics
Translated (Invited Speakers Only)
♦ Japanese (Japanese to English translation)
Poster Session (Interactive Forum)
Outstanding papers that do not fit in planned or created sessions
will be considered for the interactive poster session.
Please send your 250-300 word abstract electronically only using the on-line submittal form at: www.imaps.org/abstracts.htm
Abstract Cut-off Date: February 25, 2011
Notice of Acceptance: May 13, 2011
Final Manuscript Due: July 8, 2011
All Speakers are required to register for the symposium, but at a reduced registration fee in recognition of their contribution to the event.
Cash Awards Offered: $2000 for Best Paper of Symposium; $500 each for two Outstanding Papers of Symposium.
Accepted papers may be considered for publication in the IMAPS Journal of Microelectronics and Electronic Packaging.
If you need assistance with the on-line submission form, please email Jackki Morris-Joyner (jmorris@imaps.org) or call 305-382-8433.
64
symposium at a glance
*Indicates a separate registration fee. See registration form for details.
Sunday, October 31
Wednesday, November 3
7:00 AM - 5:00 PM
Registration Open
7:00 AM - 5:00 PM
8:00 AM - 5:00 PM
Professional Development Courses*
(S1 - S6)
8:00 AM - 10:50 AM
Professional Development Course*
(S8)
8:00 AM - 11:15 AM
1:00 PM - 5:00 PM
Professional Development Courses*
(S9)
8:30 AM - 11:45 AM
Student Tour
9:00 AM - 5:30 PM
Exhibit Hall Open
5:00 PM - 6:00 PM
PDC Reception
11:45 AM - 12:30 PM
Keynote Presentation
8:00 AM - 12:00 PM
(for instructors and attendees only)
Registration Open
6:30 AM
Golf Tournament*
8:00 AM - 5:00 PM
Professional Development Courses*
(M1 - M7)
Lunch in the Exhibits Hall
(Sponsored by RFMD)
Monday, November 1
Registration Open
Technical Sessions
(WA1; WA2; WA4; WA5)
12:30 PM - 1:30 PM
7:00 AM - 5:00 PM
Technical Sessions
(WA3)
1:35 PM - 4:35 PM
Technical Sessions
(WP1)
1:35 PM - 5:00 PM
Technical Sessions
(WP3; WP4; WP5)
1:35 PM - 5:25 PM
Technical Sessions
(WP2)
8:00 AM - 12:00 PM
Professional Development Course*
(M8)
1:35 PM - 5:25 PM
Interactive Forum - Poster Session
(WP6)
1:00 PM - 5:00 PM
Professional Development Courses*
(M9)
5:00 PM - 7:30 PM
Welcome Reception
(Raleigh Convention Center - Ballroom C)
Tuesday, November 2
7:00 AM - 5:00 PM
8:00 AM - 10:20 AM
5:30 PM - 7:30 PM
GBC Forum/Happy Hour
WEDNESDAY LUNCH
sponsored by
Registration Open
Technical Sessions
www.rfmd.com
(TA1; TA2; TA5)
8:00 AM - 10:45 AM
Technical Sessions
(TA3; TA4)
11:00 AM - 5:30 PM
Exhibit Hall Open
11:25 AM - 11:40 AM
Annual Business Meeting
11:40 AM - 12:00 PM
Awards Ceremony
12:00 PM - 12:45 PM
Keynote Presentation
1:30 PM - 3:00 PM
Student Booth Judging
1:55 PM - 4:50 PM
Technical Session
Thursday, November 4
7:00 AM - 12:00 PM
Registration Open
8:00 AM - 11:35 AM
Technical Sessions
(THA2; THA4)
8:00 AM - 12:00 PM
Technical Sessions
(THA1; THA3; THA5)
9:00 AM - 12:00 PM
Exhibit Hall Open
9:00 AM - 12:00 PM
IMAPS 2011 Booth Selection
(TP3; TP5)
1:55 PM - 5:15 PM
Technical Session
(TP1; TP2; TP4)
3:30 PM - 4:30 PM
Student Chapter Meeting
4:30 PM - 5:30 PM
Student Industry Panel/Reception
ELECTRONIC ASSEMBLY
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