Proceedings of the 14th International Heat Transfer Conference IHTC14 August 8-13, 2010, Washington, DC, USA IHTC14- NUMERICAL INVESTIGATION OF HEAT TRANSFER EFFECTS IN MICROCHANNELS UNDER H2 BOUNDARY CONDITION V. V. Dharaiya Rochester Institute of Technology vvd3159@rit.edu R. R. Srivastava* Rochester Institute of Technology rrs2837@rit.edu S. G. Kandlikar Rochester Institute of Technology sgkeme@rit.edu ABSTRACT Study of fluid flow characteristics at microscale level is gaining importance with shrinking device sizes. Better understanding of fluid flow and heat transfer in microchannels will have important implications in biomedical industry, MEMS, electronic chip cooling, heat exchangers, and microfluidic devices. Also, due to short lengths employed in microchannels, entrance header effects can be significant and needs to be investigated. In this work, three dimensional model of microchannels, with aspect ratios (Ξ±=a/b) ranging from 0.1 to 10, are numerically simulated using CFD software, FLUENT. Heat transfer effects in the entrance region of microchannel are presented by plotting average Nusselt number as a function of non-dimensional thermal entrance length x*. The numerical simulations with both circumferential and axial uniform heat flux (H2) boundary conditions were performed for four wall, three wall and two wall cases. Large numerical data sets, generated in this work for rectangular cross sectional microchannels for three walls and two walls H2 boundary condition, can provide better understanding and insight into the transport processes in the microchannel. INTRODUCTION With rapid advancements in fabrication of MEMS (microelectro mechanical systems), highly compact and effective cooling technologies are required for the dissipation of heat generated by microelectronic devices. Microchannels are the most efficient way of high heat removal from small areas. High surface area to volume ratio, smaller volume and mass, and high convective heat transfer coefficient are the features of microchannels due to which high removal of heat flux is made *Present address: Department of Mechanical Engineering, University of Minnesota, Minneapolis. possible. Due to their inherent advantages, microchannel heat sinks have found applications in automotive heat exchangers, cooling of high power electronic devices, aerospace industry, etc. Fundamental understanding of fluid flow and heat transfer in microchannels is essential in design of microfluidic devices. Use of microchannels as high performance heat sink for cooling of electronic devices was first demonstrated by Tuckerman and Pease [1] in 1981. Fabricating rectangular microchannel heat sink in silicon wafer and using water as coolant, they showed that microchannel heat sink was able to dissipate 790 W/cm2 with substrate to coolant temperature difference being kept as 71ΛC. Deviations from classical theory of conventional channels have been reported for heat transfer in microchannels by various investigators. In their experiments with rectangular microchannels, Wu and Little [2] found the Nusselt number to be higher than conventional channels. In their work, Choi et al. [3] showed that Nusselt number in laminar flow depended upon Reynolds number unlike conventional channels where Nusselt number was constant for fully developed flow. Adams et al. [4] performed experiments on single phase turbulent flow and found the Nusselt number to be higher than the predicted values for large sized channels. In turbulent regime, Yu et al. [5] found the Nusselt number to be higher than those predicted by Dittus-Boelter equation. In the recent years, Celata et al. [6] and Bucci et al. [7] have also found the Nusselt number to exceed the theoretical predictions for conventional channels. Many researchers have also found the Nusselt number to lie below the predicted theoretical values for conventional channels. Peng et al. [8] and later Peng and Peterson [9] performed experiments on rectangular microchannels of different dimensions and found the Nusselt number to lie below the predicted values of Dittus-Boelter equation. Based on their 1 Copyright © 2010 by ASME Downloaded 29 Jun 2012 to 129.21.225.197. Redistribution subject to ASME license or copyright; see http://www.asme.org/terms/Terms_Use.cfm experiments, Qu et al. [10] showed the Nusselt number to be lower than the predicted values in the laminar region. Rahman and Gui [11, 12] found the Nusselt number to be higher than theory for laminar flow whereas lower than that predicted by theory in the case of turbulent flow. There have also been various studies in which heat transfer in microchannels was found to be accurately predicted by macroscale equations. Lee et al. [13] performed numerical analysis on copper microchannels over a range of Reynolds numbers and found that heat transfer can be predicted using classical theory for conventional sized channels. Performing experiments on array of microchannels, Harms et al. [14] found the Nusselt number to be similar to the macroscale predictions. Qu and Mudawar [15] carried out numerical and experimental work on microchannels in the laminar region and found the heat transfer results to have good agreement with theory. Owhaib and Palm [16] performed experiments on microchannels in turbulent region and found the heat transfer results to be accurately predicted by conventional correlations. Deviations in heat transfer predictions by classical theory have been mainly attributed to surface roughness, entrance and exit effects, thermal and flow boundary conditions, etc. Lee et al. [13] showed that flow in microchannels is generally thermally developing with considerable entrance effects by numerically simulating microchannels with inlet and exit manifolds. Applying correct thermal boundary conditions is also very important in determining accurate heat transfer coefficients. Different thermal boundary conditions generally applied in fluid domain are: H1 (axially constant wall heat flux and circumferentially constant wall temperature), H2 (uniform wall heat flux, axially and circumferentially) and T (uniform wall temperature, axially and circumferentially) [17]. Using generalized integral transform technique, Aparecido and Cotta [18] analytically solved for bulk temperature and Nusselt number in thermally developing laminar flow in rectangular ducts with uniform wall temperature (T) as the boundary condition. Montgomery and Wibulswas [19] performed numerical analyses of thermally developing flow in rectangular microchannels with constant wall temperature and constant wall heat flux (H1) as the boundary condition. Lee and Garimella [20] numerically investigated heat transfer in thermally developing flow in microchannels having aspect ratios ranging from 1 to 10 with the H1 thermal boundary condition. However, there is little information available for the entrance region heat transfer under the H2 boundary condition. Kandlikar [21] emphasizes the need to generate entrance region effects for smooth microchannels under H2 boundary condition. different boundary conditions: (1) uniform heat flux on all four walls of microchannels, (2) uniform heat flux on three walls of microchannels, and (3) uniform heat flux on two walls of microchannels. Fully developed Nusselt number (NuH2) found from the numerical results of four wall heating conditions are compared with the published data of Shah and London [17]. In order to study the effect of entrance conditions on Nusselt number, microchannels having inlet and outlet headers are modeled and simulated. Numerical results of this geometry are compared with the findings of microchannels of the previous case having abrupt entrance (plain microchannels with no headers). In the next step rectangular microchannels with aspect ratio ranging from 0.1 to 10 are simulated to generate large data sets for Nusselt number with uniform heat flux H2 boundary condition, circumferentially and axially at three walls and two walls. In addition, the heat transfer effects in entrance region of microchannels are studied by plotting Nusselt number as a function of non-dimensional length x*. NOMENCLATURE a b l Dh αΉ π΄π Ah P Ph T Q q'' Cp k h Re Nu xth x* Subscripts w f H2 fd avg x m OBJECTIVE In the present work, microchannels are numerically simulated using commercial CFD software FLUENT for constant wall heat flux H2 (constant axial and circumferential wall heat flux) boundary condition and different heated wall configurations. The microchannels with aspect ratio ranging from 0.1 to 10 are simulated with constant wall heat flux boundary conditions. The geometries are simulated for three height of rectangular microchannel, (ΞΌm) width of rectangular microchannel, (ΞΌm) length of rectangular microchannel, (mm) hydraulic diameter, (ΞΌm) mass flow rate (kg/s) cross-sectional area of microchannel, (m2) area of heated walls (m2) perimeter of microchannel (m) perimeter of heated walls (m) temperature (K) heat transfer rate (W) total heat flux (W/m2) specific heat of fluid (J/kg-K) thermal conductivity of fluid (W/m-K) heat transfer coefficient (W/m2-K) Reynolds number Nusselt number thermal entrance length (m) Non-dimensional thermal entrance length x*= x / (DhRePr) wall fluid uniform heat flux boundary condition fully developed flow average local mean Greek Ξ± Ο µ 2 channel aspect ratio (refer to Fig. 1) density of water (kg/m3) dynamic viscosity (N-s/m2) Copyright © 2010 by ASME Downloaded 29 Jun 2012 to 129.21.225.197. Redistribution subject to ASME license or copyright; see http://www.asme.org/terms/Terms_Use.cfm MATHEMATICAL FORMULATION The continuity and flow energy equations in their steady state, with associated H2 boundary conditions for all the cases were solved using finite-volume approach using following assumptions: Table 1: Channel dimensions used for numerical simulations for each cases of rectangular microchannel with varying aspect ratios of 0.1 to 10. (1) Laminar Steady state flow behavior, (2) Incompressible fluid flow conditions, (3) Fluid properties remain constant along the length of microchannel, (4) Neglect viscous dissipation, (5) Neglect radiative effects. q'' wall1 a wall 4 wall 3 q'' wall2 b Figure 1: Cross-sectional area of rectangular microchannel with uniform heat flux on all four walls. Table 1 shows the dimensions of rectangular microchannels used for numerical simulations with varying aspect ratios of 0.1 to 10. Figure 1 represents the crosssectional area of rectangular microchannel with constant heat flux boundary condition on all the four walls. The length (l) and height (a) of rectangular microchannels were kept constant for all the computations and width (b) was varied in accordance with change in aspect ratios as shown in Table 1. The aspect ratio and hydraulic diameter for all the three different boundary conditions of rectangular microchannels were defined by equation (1); π πΌ=π and 4βπβπ π·π = 2β(π+π) (1) For numerical simulations of uniform heat flux on three walls of microchannels, wall 1 of Figure 1 was considered as adiabatic wall. Similarly, for two wall heating boundary conditions, wall 3 and 4 were assumed as adiabatic walls. A finite volume approach is employed to investigate the thermally developing flow regime in microchannels. The local and average Nusselt numbers are calculated numerically as a function of non-dimensional axial distance and channel aspect ratio. The heat transfer coefficient and Nusselt number for rectangular microchannels can be calculated using π=π πβ²β² π€ ,ππ£π βπ π,ππ£π and ππ’π»2 = π·π ππ π(π₯) (2) In equation (2), the fluid average temperature along the length of microchannel is calculated using the energy balance equation as follows ππ,π₯ = π β²β² βππ βπ₯ π βπΆπ + ππ,ππ (3) Ξ± a b l Dh (a/b) (µm ) ( µm ) ( mm ) ( µm ) 0.10 150 1500 100 272.7 0.25 150 600 100 240.0 0.33 150 450 100 225.1 0.50 150 300 100 200.0 0.60 150 250 100 187.5 0.75 150 200 100 171.4 1 150 150 100 150.0 2 150 75 100 100.0 5 150 30 100 50.0 10 150 15 100 27.3 The averaged wall temperature, obtained from the computational results, was calculated using temperature at different nodes on each heated walls along the length of microchannel. Moreover, each respective wall temperature was averaged by considering five nodes on each wall. However for each wall of rectangular microchannel, temperature peak is observed at corners and hence the temperature values at each corner nodes were halved while calculating average temperature for each wall. The average wall temperature is defined differently for all three different wall boundary conditions. For four-wall uniform heat flux boundary condition, ππ€ ,ππ£π = ππ βπΌ+ππ where, ππ = 1+πΌ π3 +π4 2 and ππ = π1 +π2 2 (4) For three-wall uniform heat flux boundary condition, ππ€ ,ππ£π = ππ β 2πΌ + ππ where, ππ 1 + 2πΌ = π3 +π4 2 and ππ = π2 (5) For two-wall uniform heat flux boundary condition, ππ€ ,ππ£π = π1 +π2 2 (6) MODEL DESCRIPTION The fluid flow and heat transfer effects in rectangular microchannels with varying aspect ratio from 0.1 to 10 were 3 Copyright © 2010 by ASME Downloaded 29 Jun 2012 to 129.21.225.197. Redistribution subject to ASME license or copyright; see http://www.asme.org/terms/Terms_Use.cfm investigated using commercial CFD software, FLUENT. GAMBIT was used as pre-solver software for designing geometric models, grid generation and boundary definition. Water enters the rectangular microchannels with a fully developed velocity profile at inlet temperature of 300K. The numerical simulation was initially performed for rectangular microchannels with four-side constant wall heat flux boundary condition. This case was tested for three different aspect ratios of 0.1, 0.5 and 1, and the results were verified by the scheme proposed by Shah and London [17]. The only published data understand the effect of entrance types on heat transfer characteristics in entrance region. The pre-solver GAMBIT was used for grid generation in microchannels. Figures 4 and 5 show the meshed geometry of rectangular channel having aspect ratio of 1 with abrupt entrance type and smooth entrance type respectively. Hexwedge cooper scheme was used for generating mesh in geometries. The mesh spacing was kept as 0.005. Finer meshes were created to predict the fluid flow and heat transfer effects more accurately. There were approximately 2 million grid Figure 2: Schematic of geometric model with abrupt entrance type. Figure 4: Schematic of meshed model with abrupt entrancetype having aspect ratio of 1. Figure 3: Schematic of geometric model with smooth entrance type. Figure 5: Schematic of meshed model with smooth entrance type having aspect ratio of 1. available for NuH2 for varying aspect ratios are for four-wall heating conditions given by Shah and London [17]. Hence, the data sets for uniform heat flux (H2) boundary condition for three-walls and two-walls are numerically generated. The rectangular channels used in their proposed scheme were having abrupt entrance type as shown in Figure 2, and in general channels always have some type of headers for practical applications. Hence, new geometric models were designed with same rectangular microchannel dimensions as earlier along with a smooth entrance type (with inlet and outlet headers) as shown in Figure 3. This comparison can help us to elements in each of the rectangular geometries and the processing time for the simulation was noted to be around 7-8 hours (Intel Core 2 Duo processor). Grid independence test was carried out in order to ensure the best mesh spacing for the geometrical model. The numerical simulations were performed using commercial CFD software package FLUENT. Reynolds number was kept constant as 100 for all cases in order to confirm laminar flow through rectangular microchannels. Pressure-based solver was used for simulation in order to achieve steady state analysis. The SIMPLE (Semi-Implicit 4 Copyright © 2010 by ASME Downloaded 29 Jun 2012 to 129.21.225.197. Redistribution subject to ASME license or copyright; see http://www.asme.org/terms/Terms_Use.cfm Method for Pressure-Linked Equations) algorithm was used for introducing pressure into the continuity equation. The energy equation was activated during the analysis to predict heat transfer effects in microchannels and check the effect of entrance type on heat transfer. The flow momentum and energy equations were solved with a first-order upwind scheme. The simulations were performed for a convergence criterion of E-6. microchannels with and without abrupt entrance are shown for two different aspect ratios of 0.1 and 0.5. From these plots it can be seen that entrance type does not have any significant impact on Nusselt number in entrance region of thermally developing flow. 16 14 The first objective was to validate the results of numerical simulation with available published data of Shah and London [17] for uniform heat flux boundary condition (H2) on all the four walls of rectangular microchannel. Table 2 shows the fully developed Nusselt number, found by numerical simulation as well as available published data, for three different aspect ratios of 0.1, 0.5 and 1 with H2 boundary condition. It can be seen from the Table 2 that fully developed Nusselt number found from simulation results are slightly higher than the fully developed Nusselt number for macroscale ducts. Table 2: Comparison of NuH2,fd of numerical work with proposed values by Shah and London [17] NuH2,fd Aspect ratio, From Shah and Current Numerical Ξ± London, 1971 work 0.1 2.950 3.083 0.25 2.940 2.901 0.33 2.970 3.023 0.5 3.020 3.110 1 3.091 3.299 Effects of entrance type on Nusselt number: Abrupt entrance type (AR=0.5) Smooth entrance type (AR=0.1) 12 Smooth entrance type (AR=0.5) 10 8 6 4 2 0 0 2 4 6 8 10 Length along the microchannel, x (mm) Figure 6: Plot of Nu along the length of the microchannel having smooth and abrupt entrance with H2 boundary conditon on all the four walls. 16 Abrupt entrance type (AR=0.1) 14 Nusselt Number, Nu Validation of numerical model: Nusselt Number, Nu RESULTS AND DISCUSSIONS Initially the simulations were performed for H2 boundary conditions on all four walls for three different aspect ratios of 0.1, 0.5 and 1. The results of fully developed Nusselt number were then compared with the values reported by Shah and London [17]. Further simulations were performed on all the three cases of boundary conditions; four-wall, three-wall and two-wall for two different aspect ratios of 0.1 and 0.5 for two different cases of abrupt and smooth entrance types. The results from the simulations were used to predict the effect of entrance type on thermally developing entrance region in rectangular microchannels. Large data set was generated for thermally developing Nusselt number for three-wall and two-wall uniform heat flux boundary condition (H2) for whole range of aspect ratio varying from 0.1 to 10. The aspect ratio was defined as a/b for all the numerical simulations with four wall, three wall, and two wall H2 boundary conditions. Abrupt entrance type (AR=0.1) Abrupt entrance type (AR=0.5) Smooth entrance type (AR=0.1) 12 Smooth entrance type (AR=0.5) 10 8 6 4 2 0 0 2 4 6 8 Length along the microchannel, x (mm) 10 Figure 7: Plot of Nu along the length of the microchannel having smooth and abrupt entrance with H2 boundary conditon on three walls. Figure 6, figure 7 and figure 8 are the plots showing variation in Nusselt number along the length of the microchannel having uniform heat flux on 4 walls, 3 walls and 2 walls respectively. These cases were plotted only for first 10mm length of rectangular microchannel in order to see the effect of entrance headers on Nusselt number. Results for 5 Copyright © 2010 by ASME Downloaded 29 Jun 2012 to 129.21.225.197. Redistribution subject to ASME license or copyright; see http://www.asme.org/terms/Terms_Use.cfm 20 18 Abrupt entrance type (AR=0.5) 16 Smooth entrance type (AR=0.1) 14 Smooth entrance type (AR=0.5) AR=0.25 AR=0.33 AR=0.5 AR=0.6 AR = 0.75 AR = 1 AR = 2 AR = 5 AR = 10 18 16 Nusselt Number, Nu Nusselt Number, Nu 20 Abrupt entrance type (AR=0.1) 12 10 8 6 14 12 10 8 6 4 4 2 2 0 0 0 2 4 6 8 Length along the microchannel, x (mm) 0 10 20 40 60 80 100 Length along the microchannel, x (mm) Figure 8: Plot of Nu along the length of the microchannel having smooth and abrupt entrance with H2 boundary conditon on two walls. Figure 10: Plot of Nu along the length of the microchannel for whole range of aspect ratios with H2 boundary conditon on two walls. Results for 3-wall & 2-wall H2 boundary condition: Moreover, for three wall H2 boundary condition the values of fully developed Nusselt number converges and are approximately around 3 for the whole range of aspect ratio from 0.1 to 10. Also, the trend of Nusselt number along the length of microchannels for three walls H2 condition was similar to that observed for four wall cases. The values of Nusselt number did not seem to vary much for the whole range of channel aspect ratio. Whereas in case of two wall H2 boundary condition, the fully developed Nusselt number values vary within a wide range. Moreover, the fully developed Nusselt number obtained for four wall and three wall H2 boundary condition seem to have increased with increase in channel aspect ratio. The similar trend was observed by Shah and London [17] for four wall cases. This trend was opposite to that observed by investigators for four wall and three wall cases for H1 and T boundary conditions [22]. Figure 10 shows local Nusselt number along the length of rectangular microchannel for two wall H2-constant wall heat flux boundary condition. The fully developed Nusselt number for two wall uniform heat flux cases seem to have decreasing value with increase in aspect ratio. This trend was similar to the published data for H1 and T boundary condition for two wall cases [22]. In order to study heat transfer effects in the entrance region of microchannel, Nusselt number is plotted as a function of non dimensional length x*. Figures 11 and 12 show results for rectangular microchannels for the whole range of aspect ratios under H2 boundary condition on three and two walls respectively. From these figures, it can be seen that a larger channel aspect ratio will have a larger dimensionless thermal entrance length x*, and its value decreases with simultaneous decrease in aspect ratio. The results show that the value of Nusselt number starts high and decreases rapidly along the length of microchannel. Next important step in this work was to generate large data set for Nusselt number in thermally developing flow with H2 boundary condition. Microchannels having aspect ratios ranging from 0.1 to 10 were simulated with H2 boundary condition. Figure 9 and figure 10 are the plots showing Nusselt number along the length of microchannel with uniform heat flux on three walls and two walls respectively. The graphs show that the Nusselt number is very high at the beginning of the entrance region of microchannel and thereafter decreases exponentially and achieve the fully developed Nusselt number. 20 AR=0.25 AR=0.33 AR=0.5 AR=0.6 AR = 0.75 AR = 1 AR = 2 AR = 5 AR = 10 18 Nusselt Number, Nu 16 14 12 10 8 6 4 2 0 0 20 40 60 80 Length along the microchannel, x (mm) 100 Figure 9: Plot of Nu along the length of the microchannel for whole range of aspect ratios with H2 boundary conditon on three walls. 6 Copyright © 2010 by ASME Downloaded 29 Jun 2012 to 129.21.225.197. Redistribution subject to ASME license or copyright; see http://www.asme.org/terms/Terms_Use.cfm Nusselt number, Nu 10 Table 3: NuH2,fd for fully developed laminar flow, for three walls and two walls uniform heat flux boundary condition. AR=0.25 9 AR=0.33 8 AR=0.5 7 AR = 0.6 6 AR = 0.75 NuH2,fd 3-wall condition 4 3 0.10 0.25 0.33 0.50 0.60 0.75 1 2 5 10 2 1 0 0 0.2 0.4 0.6 0.8 1 Non-dimensional length, x* 1.2 Figure 11: Plot of Nu as a function of x* for different aspect ratios with H2 boundary conditon on three walls. 16 AR=0.25 14 Nusselt number, Nu 2-wall boundary condition Aspect ratio, Ξ± (a/b) AR = 1 5 boundary AR=0.33 AR=0.5 12 AR = 0.6 10 AR = 0.75 AR = 1 8 6 4 2 0 0 0.2 0.4 0.6 0.8 1 1.2 Non-dimensional length, x* Figure 12: Plot of Nu as a function of x* for different aspect ratios with H2 boundary conditon on two walls. Generated numerical data set for 3-wall and 2-wall H2 boundary condition: Table 3 represents the values of fully developed Nusselt number found from the results of numerical simulations of three walls and two walls uniform heat flux (H2) boundary condition for rectangular microchannels for the whole range of aspect ratios. Hence the large data set for constant wall heat flux, both circumferentially and axially has been generated by performing CFD computations for wide range of cases. 2.463 2.401 2.533 2.724 2.762 2.835 3.148 3.243 3.770 4.632 6.803 6.183 6.086 5.626 5.235 4.844 4.611 3.201 1.785 1.065 CONCLUSIONS The numerical simulations were carried out with uniform wall heat flux boundary condition for three different cases; four walls, three walls and two walls heating. The numerical model for four wall H2 boundary condition was validated with published data by Shah and London [17] and the results obtained for microchannels seem to have good accordance with the findings of majority of researchers. The effect of entrance type on the heat transfer in the thermally developing entrance region was studied. The results predict insignificant effect of entrance type on Nusselt numbers for all the three cases. Large data sets were generated for wide range of aspect ratios varying from 0.1 to 10 for rectangular microchannels for three walls and two walls uniform heat flux boundary condition. The numerical data obtained for three wall H2 boundary condition followed similar trend as observed for four wall uniform heat flux condition for different aspect ratios. The heat transfer results for four wall and three wall H2 condition did not vary much with increase in aspect ratio contrary to that observed by Schmidt [22] for H1 and T boundary condition. On the other hand, fully developed Nusselt number values for two wall H2 boundary condition in rectangular microchannels for aspect ratios ranging from 0.1 to 10 followed the similar trend as compared to H1 and T boundary condition. Higher channel aspect ratio predicted larger values of non-dimensional thermal entrance length, x*. A comprehensive numerical data set was generated for heat transfer aspects in rectangular microchannels under more practical H2 boundary condition. ACKNOWLEDGMENTS The work was carried out in Thermal Analysis and Microfluidics and Fuel Cell Laboratory (TAµFL), Rochester Institute of Technology, Rochester, NY. 7 Copyright © 2010 by ASME Downloaded 29 Jun 2012 to 129.21.225.197. Redistribution subject to ASME license or copyright; see http://www.asme.org/terms/Terms_Use.cfm REFERENCES [1] [2] [3] [4] [5] [6] [7] [8] [9] [10] [11] [12] [13] Tuckerman, D. B., and Pease, R. F. W., 1981, βHighperformance heat sinking for VLSI,β IEEE Electron Dev. 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