About the Editors:
David G. Seller is the Chief of the Semiconductor Electronics Division, Electronics and Electrical Engineering
Laboratory, National Institute of Standards and Technology (NIST). His Division provides technical leadership in
research and development of the semiconductor measurement infrastructure essential to the silicon integrated
circuit industry as well as other advanced semiconductor technology needs. Dr. Seiler, Fellow of the American
Physical Society, has worked extensively with the characterization of the electrical, optical, and nonlinear optical
properties of numerous semiconductors and artificially structured materials. He is a member of American
Association for the Advancement of Science, Materials Research Society, American Vacuum Society, ASTM,
Sigma Pi Sigma, Sigma Xi, and a senior member of IEEE. He also recently received a Purdue Distinguished
Alumnus Award for Semiconductor Physics Leadership (April 2000). Prior to joining NIST in 1988, Dr. Seiler
served as a Solid State Physics Program Director in the Materials Research Division at the National Science
Foundation, spent a year's sabbatical at the MIT Francis Bitter National Magnet Laboratory, and had been a
Regents Professor of Physics at the University of North Texas. He obtained a Ph.D. in Physics from Purdue
University in 1969.
Alain C. Dlebold is a Senior Fellow at International SEMATECH whose role is Metrology Coordination. He is a
Fellow of the American Vacuum Society. He initiated and leads the Metrology Council and Analytical Laboratory
Managers Council at International SEMATECH. Through direct interaction between customers, government
laboratories, and metrology supplies, these industry coordination activities foster the development of metrology and
analytical technology that is required for the development and manufacture of future generations of integrated
circuits. Dr. Diebold has edited the Handbook of Silicon Semiconductor Metrology and the "Metrology" section of
Future FAB International. Dr. Diebold leads the Metrology Technical Working Group and edits the Metrology
Roadmap for the International Technology Roadmap for Semiconductors.
Prior to joining International
SEMATECH, he worked at Allied Signal Corporation in the area of molecular beam Epitaxy of III-V compounds,
as well as with a broad range of materials characterization issues. He obtained a Ph.D. in Chemistry from Purdue
University in 1979 and was a post-doctoral fellow at Pennsylvania State University.
Thomas J. Shaffner is the Materials Technology Group Leader in the Semiconductor Electronics Division,
Electronics and Electrical Engineering Laboratory, National Institute of Standards and Technology (NIST).
Emphasis of this Group is on experimental and theoretical research related to semiconductor materials, structures,
and measurement technology essential to growth of the silicon and compound semiconductor industries. Dr.
Shafftier received his Ph.D. Degree in Physics from Vanderbilt University and B.S. in Physics from North Carolina
State University. He has since been active in research involving semiconductor and polymeric materials in
industrial, academic, and government laboratories over the past 30 years. Prior to joining NIST in 1998, he
managed advanced lithography and materials characterization programs within the Corporate Research Laboratories
of Texas Instruments in Dallas. Before this, he worked for six years in surface chemistry and microscopy programs
in the Fiber Surface Research Laboratories of E.I. Du Pont de Nemours. During this period, he extended these
studies at the University of Manchester (U.K.) during a sabbatical leave as a Research Associate.
Robert McDonald is currently a Board Member and the Chief Technical Officer for Metara Inc., a manufacturer of
in-line metrology equipment for wafer fab manufacturing. Dr. McDonald retired from Intel in 1998 after serving in
various management and technical capacities for 20 years. Dr. McDonald's efforts for Intel included startup of their
first materials analysis labs and the formation of a worldwide lab network. He was responsible for the introduction
of new methods to meet the demands of rapidly advancing semiconductor technology. This included the
application of advanced materials analysis techniques for critical manufacturing measurement and metrology needs
as well as for technology development. He served as Intel's representative to the SEMATECH Analytical Lab
Managers Working Group and the SIA Metrology Technical Working Group. Prior to joining Intel, he was
responsible for the Advanced Materials Analysis Lab at Fairchild R&D for five years. He received his Ph.D.
degree in Materials Science from the UCLA School of Engineering in 1981.
Stefan Zollner is Section Manager for Wireless Technology Analysis at Motorola, Inc., in the Process and Materials
Characterization Laboratory (PMCL) of the Semiconductor Products Sector in Tempe, AZ. He is responsible for
providing characterization and metrology support of manufacturing and technology development of advanced
semiconductor products, especially compound semiconductor devices, advanced lithography, strained Si CMOS,
and integrated passives. He has assisted with the startup of Motorola's SiGe:C HBT BiCMOS manufacturing using
optical and X-ray techniques. He is particularly familiar with spectroscopic ellipsometry, UV Raman and FTIR
spectroscopy, photoluminescence, femtosecond laser spectroscopy, and high-resolution X-ray diffraction and
reflectivity. Previously (1992-1997), he was an assistant professor of physics at Iowa State University and the Ames
Laboratory and (1991-1992) a postdoc at the IBM Research Center in Yorktown Heights, NY. He obtained a Ph.D.
in semiconductor physics at the Max-Planck-Institute for Solid-State Research in Stuttgart (Germany) in 1991.
Currently, he also serves as Chair-Elect of the Forum on Industrial and Applied Physics (FIAP) in the American
Physical Society.
Rajinder P. Khosla joined the National Science Foundation in October 1996 and is currently the Director of the
Electronics, Photonics, and Device Technology (EPDT) and Integrative Systems (IS) Programs in the Electrical and
Communications Systems (ECS) Division in the Engineering Directorate. Dr. Khosla worked at Eastman Kodak
Co. from 1966-96. He was the General Manager of the Microelectronics Technology Division at Kodak from
1985-95 and was responsible for the research, development, manufacturing, and marketing of solid-state imagers
and support ICs. Dr. Khosla received his Ph.D. in Solid State Physics from Purdue University in 1966. In 1974-75,
he was on an "Academic award" from Kodak as a Visiting Scientist in the Department of EE&CS at the University
of California, Santa Barbara. In the fall of 1989, he attended the Harvard Business School for the Advanced
Management Program. He was an Executive-on-Loan at Cornell University during 1995-96 to develop
industry/university relations. Dr. Khosla is a Fellow of the IEEE, Fellow of the American Physical Society, and a
Fellow of the Optical Society of America. He was awarded the 1990 IEEE Frederick Philips Award for R&D
technical management. He is the Distinguished Alumnus of the College of Science at Purdue University.
Erik M. Secula is the Editor for the Semiconductor Electronics Division, Electronics and Electrical Engineering
Laboratory, National Institute of Standards and Technology (NIST). He received his B.A. in English from the
University of Maryland in 1995. Since joining NIST in 1998, Mr. Secula has provided technical information to the
semiconductor industry through the marketing of the Division's programs and the management of the technology
transfer processes within the Division. He is responsible for ensuring the quality of all technical documents and
papers from the Division. Major activities include developing the Division's World Wide Web materials,
developing and maintaining numerous databases, representing NIST at the SEMICON West show, and serving as
the publications coordinator for the recent Characterization and Metrology for ULSI Technology conferences.